公开(公告)号：EP0599937B1

公开(公告)日：1996-01-10

申请号：EP92917673.3

申请日：1992-08-14

申请人： SELA CO.-SEMICONDUCTOR ENGINEERING 1992 LTD.

发明人： SMITH, Colin ,  KAUFMAN, Kalman ,  MAZOR, Isaac ,  CHEN, Elik ,  VILENSKI, Dan

IPC分类号： H01L21/00

CPC分类号： B28D5/0094 ,  B28D5/0005 ,  B28D5/0023 ,  B28D5/0064 ,  Y10T225/10 ,  Y10T225/12

摘要： A method and apparatus are described for cleaving a relatively thin semiconductor wafer for inspecting a target feature on a workface thereof by: producing, on a first lateral face of the semiconductor wafer, laterally of the workface on one side of the target feature, an indentation in alignment with the target feature; and inducing, e.g., by impact, in a second lateral face of the semiconductor wafer, laterally of the workface on the opposite side of the target feature, a shock wave substantially in alignment with the target feature and the indentation on the first lateral face, to split the semiconductor wafer along a cleavage plane essentially coinciding with the target feature and the indentation.