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公开(公告)号：EP3240360A1
公开(公告)日：2017-11-01
申请号：EP17168859.1
申请日：2017-04-28
发明人： Barton, Richard , Karl, Christoph
CPC分类号： H05B3/84 , H05B2203/016
摘要： A connector (1) for providing an electrical connection to a fragile substrate, the connector (1) comprises a first and a second mounting portion (2, 3) for engaging a fragile substrate and a connection portion (4) between the first and second mounting portions (2, 3) and for making an electrical connection to the connector (1), each mounting portion (2, 3) comprising a first surface (2a, 3a) for facing the fragile substrate in use, the connector (1) being formed from an alloy of iron having a coefficient of thermal expansion of from 10 x 10 -6 m/m°C to 16 x 10 -6 m/m°C and an electrical conductivity of greater than 4 x 10 6 S/m.
摘要翻译： 1.一种用于提供与易碎衬底的电连接的连接器（1），所述连接器（1）包括用于接合易碎衬底的第一和第二安装部分（2,3）以及位于所述第一和第二 （2,3），并用于与连接器（1）形成电连接，每个安装部分（2,3）包括用于在使用中面对易碎衬底的第一表面（2a，3a），连接器（1） 由具有10×10 -6 m / m℃至16×10 -6 m / m℃的热膨胀系数和大于4×10 6 S / m的导电率的铁合金形成。
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公开(公告)号：EP3159969A1
公开(公告)日：2017-04-26
申请号：EP16192578.9
申请日：2016-10-06
发明人： Barton, Richard , O'Connor, Stephen
CPC分类号： H01R4/027 , H01R11/01 , H01R2201/26 , H05B3/86 , H05B2203/011 , H05B2203/017
摘要： A busbar assembly (1) for installation at a site of use, for example in a windscreen, the busbar assembly (1) comprises a first busbar (3) and a second busbar (2), wherein the second busbar (2) at least partially overlies the first busbar (3), at least one of the first and second busbars (2, 3) is coated with a lead free solder material (32) comprising tin and bismuth, wherein at least one of the first and second busbars (2, 3) comprises securing means (33) configured to secure, in use, the busbar assembly (1) to a site of use.
摘要翻译： 一种用于安装在使用场所例如挡风玻璃中的母线组件（1），所述母线组件（1）包括第一母线（3）和第二母线（2），其中所述第二母线（2）至少 部分地覆盖第一母线（3），第一和第二母线（2,3）中的至少一个涂覆有包含锡和铋的无铅焊料材料（32），其中第一和第二母线中的至少一个 包括固定装置（33），所述固定装置构造成在使用中将所述母线组件（1）固定到使用位置。
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公开(公告)号：EP4283791A1
公开(公告)日：2023-11-29
申请号：EP23174154.7
申请日：2023-05-18
发明人： PRICE, Geoff , POPILIAN, Denis
摘要： An electrical connection (1) for electrically connecting a flat connector (2) and an electrical cable (3), the electrical connection (1) comprises
a flat connector (2) with an insulated portion (21) and an electrically conductive portion (20e) to which is secured a pressure sensitive adhesive (6) defining a window (6w),
an electrical cable (3) which is secured to the flat connector (2) at the window (6w) to provide an electrical contact between the flat connector (2) and the electrical cable (3), and
an enclosure (4) encasing the electrical contact.-
公开(公告)号：EP3182520A1
公开(公告)日：2017-06-21
申请号：EP16188836.7
申请日：2016-09-14
发明人： Tank, Kulvinder
CPC分类号： H01R13/5205 , H01R4/021 , H01R12/63 , H01R43/005 , H01R2201/26 , H05B3/86 , H05B2203/016
摘要： An electrical connection 1 for electrically connecting a flat connector 2 and an electrical cable 3, the electrical connection 1 comprising a flat connector 2 with an insulated portion 21 and an exposed electrically conductive portion 20e, an electrical cable 3, a first seal 6a, a second seal 6b and an enclosure 4, wherein the flat connector 2 and the electrical cable 3 are secured together in order to provide electrical contact between one another at the exposed electrically conductive portion 20e of the flat connector 2, the first seal 6a being outboard of the exposed electrically conductive portion 20e of the flat connector 2 and adjacent a distal edge of the exposed electrically conductive element 20 of the flat connector 2, whereby the enclosure 4 encases the first seal 6a and the electrical contact.
摘要翻译： 用于电连接扁平连接器2和电缆3的电连接1，电连接1包括具有绝缘部分21和暴露的导电部分20e的扁平连接器2，电缆3，第一密封件6a， 第二密封件6b和外壳4，其中扁平连接器2和电缆3被固定在一起，以便在扁平连接器2的暴露的导电部分20e处提供彼此之间的电接触，第一密封件6a在外侧 暴露的扁平连接器2的导电部分20e并且邻近扁平连接器2的暴露的导电元件20的远端边缘，由此外壳4包围第一密封件6a和电触点。
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公开(公告)号：EP2894941B1
公开(公告)日：2019-06-12
申请号：EP15150707.6
申请日：2015-01-09
发明人： O'Connor, Stephen , Barton, Richard
IPC分类号： H05B3/84
CPC分类号： H05B3/84 , B32B17/10293 , H05B2203/011 , H05B2203/017
摘要： A busbar (1) for installation on or in a structure, the busbar (1) comprises a length of electrically conductive material (2), having a dimensionally invariant solder material (3) secured along at least part of the length thereof, the solder material (3) preferably covering less than 25% of the surface area of the electrically conductive material (2).
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公开(公告)号：EP3000907A1
公开(公告)日：2016-03-30
申请号：EP15172629.6
申请日：2015-06-18
IPC分类号： C23C2/00 , C23C2/02 , C23C2/08 , C23C2/16 , C23C2/20 , C23C2/38 , C23C2/40 , C25D5/34 , C23C2/22 , C23C2/26
CPC分类号： H01R43/16 , C23C2/003 , C23C2/02 , C23C2/08 , C23C2/16 , C23C2/20 , C23C2/22 , C23C2/26 , C25D17/00
摘要： Apparatus 1' for forming a busbar having a width of less than 25mm and a thickness of less than 120microns, the apparatus 1' comprising means to continuously supply a length of substrate having a pair of major surfaces, a width of less than 25mm and a thickness of less than 120microns, means 3' to clean the substrate, a hot dip overlayer application means 5' comprising a bath 50' for overlayer material OL to apply, in use, an overlayer material OL to all of the surfaces of the substrate S, overlayer control means (51', 60') to control the amount of overlayer material OL adhered to the substrate S, the overlayer control means (51', 60') comprising wiping means 51' to physically contact both major surfaces of the substrate S, wherein the wiping means 51' are located, in use, beneath the surface level of overlayer material OL retained in the bath 50'.
摘要翻译： 用于形成宽度小于25mm并且厚度小于120微米的汇流条的装置1'，该装置1'包括连续地提供一长度的具有一对主表面的基底，宽度小于25mm和 厚度小于120微米，用于清洁基底的装置3'，包括用于覆盖材料OL的浴50'的热浸覆盖施加装置5'，在使用中将覆盖材料OL施加到基底S的所有表面 ，覆盖层控制装置（51'，60'），用于控制附着在基板S上的覆层材料OL的量，所述覆盖层控制装置（51'，60'）包括擦拭装置51'以物理接触基板的两个主表面 S，其中擦拭装置51'在使用中位于保留在浴50'内的覆层材料OL的表面水平之下。
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公开(公告)号：EP2925100A1
公开(公告)日：2015-09-30
申请号：EP15156471.3
申请日：2015-02-25
IPC分类号： H05K3/46
CPC分类号： B32B27/10 , B32B7/06 , B32B7/12 , B32B7/14 , B32B17/10293 , B32B27/08 , B32B27/30 , B32B37/1292 , B32B2037/268 , B32B2255/205 , B32B2264/105 , B32B2307/202 , B32B2311/12 , B32B2317/122 , B32B2333/00 , B32B2605/08 , H05K2201/10272
摘要： A busbar (1) for installation on or in a structure, the busbar (1) comprises a length of electrically conductive material (2) having a, preferably dimensionally invariant, adhesive material (3) secured along at least part of a major surface along the length thereof, wherein the adhesive material (3) is inboard of one both of the longitudinal edges of the electrically conductive material (2).
摘要翻译： 一种用于安装在结构上或结构中的母线（1），所述母线（1）包括一段导电材料（2），所述导电材料具有优选尺寸不变的粘合材料（3），沿至少一部分主表面 其长度，其中粘合材料（3）位于导电材料（2）的两个纵向边缘的内侧。
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公开(公告)号：EP2894941A2
公开(公告)日：2015-07-15
申请号：EP15150707.6
申请日：2015-01-09
发明人： O'Connor, Stephen , Barton, Richard
IPC分类号： H05B3/84
CPC分类号： H05B3/84 , B32B17/10293 , H05B2203/011 , H05B2203/017
摘要： A busbar (1) for installation on or in a structure, the busbar (1) comprises a length of electrically conductive material (2), having a dimensionally invariant solder material (3) secured along at least part of the length thereof, the solder material (3) preferably covering less than 25% of the surface area of the electrically conductive material (2).
摘要翻译： 一种用于安装在结构上或结构中的汇流条（1），母线（1）包括一定长度的导电材料（2），其具有沿其长度的至少一部分固定的尺寸不变的焊料材料（3），焊料 材料（3）优选地覆盖导电材料（2）的表面积的25％以下。
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公开(公告)号：EP2894941B8
公开(公告)日：2019-07-17
申请号：EP15150707.6
申请日：2015-01-09
发明人： O'Connor, Stephen , Barton, Richard
IPC分类号： H05B3/84
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公开(公告)号：EP3000907B1
公开(公告)日：2018-07-25
申请号：EP15172629.6
申请日：2015-06-18
IPC分类号： C23C2/00 , C23C2/02 , C23C2/08 , C23C2/16 , C23C2/20 , C23C2/38 , C23C2/40 , C25D5/34 , C23C2/22 , C23C2/26 , C25D17/00 , H01R43/16
CPC分类号： H01R43/16 , C23C2/003 , C23C2/02 , C23C2/08 , C23C2/16 , C23C2/20 , C23C2/22 , C23C2/26 , C25D17/00
摘要： Apparatus 1' for forming a busbar having a width of less than 25mm and a thickness of less than 120microns, the apparatus 1' comprising means to continuously supply a length of substrate having a pair of major surfaces, a width of less than 25mm and a thickness of less than 120microns, means 3' to clean the substrate, a hot dip overlayer application means 5' comprising a bath 50' for overlayer material OL to apply, in use, an overlayer material OL to all of the surfaces of the substrate S, overlayer control means (51', 60') to control the amount of overlayer material OL adhered to the substrate S, the overlayer control means (51', 60') comprising wiping means 51' to physically contact both major surfaces of the substrate S, wherein the wiping means 51' are located, in use, beneath the surface level of overlayer material OL retained in the bath 50'.
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