公开(公告)号：EP3000907B1

公开(公告)日：2018-07-25

申请号：EP15172629.6

申请日：2015-06-18

申请人： Strip Tinning Limited

发明人： O'Connor, Stephen ,  Holmes, Christopher ,  Barton, Richard

IPC分类号： C23C2/00 ,  C23C2/02 ,  C23C2/08 ,  C23C2/16 ,  C23C2/20 ,  C23C2/38 ,  C23C2/40 ,  C25D5/34 ,  C23C2/22 ,  C23C2/26 ,  C25D17/00 ,  H01R43/16

CPC分类号： H01R43/16 ,  C23C2/003 ,  C23C2/02 ,  C23C2/08 ,  C23C2/16 ,  C23C2/20 ,  C23C2/22 ,  C23C2/26 ,  C25D17/00

摘要： Apparatus 1' for forming a busbar having a width of less than 25mm and a thickness of less than 120microns, the apparatus 1' comprising means to continuously supply a length of substrate having a pair of major surfaces, a width of less than 25mm and a thickness of less than 120microns, means 3' to clean the substrate, a hot dip overlayer application means 5' comprising a bath 50' for overlayer material OL to apply, in use, an overlayer material OL to all of the surfaces of the substrate S, overlayer control means (51', 60') to control the amount of overlayer material OL adhered to the substrate S, the overlayer control means (51', 60') comprising wiping means 51' to physically contact both major surfaces of the substrate S, wherein the wiping means 51' are located, in use, beneath the surface level of overlayer material OL retained in the bath 50'.

公开(公告)号：EP3000907A1

公开(公告)日：2016-03-30

申请号：EP15172629.6

申请日：2015-06-18

申请人： Strip Tinning Limited

发明人： O'Connor, Stephen ,  Holmes, Christopher ,  Barton, Richard

IPC分类号： C23C2/00 ,  C23C2/02 ,  C23C2/08 ,  C23C2/16 ,  C23C2/20 ,  C23C2/38 ,  C23C2/40 ,  C25D5/34 ,  C23C2/22 ,  C23C2/26

CPC分类号： H01R43/16 ,  C23C2/003 ,  C23C2/02 ,  C23C2/08 ,  C23C2/16 ,  C23C2/20 ,  C23C2/22 ,  C23C2/26 ,  C25D17/00

摘要： Apparatus 1' for forming a busbar having a width of less than 25mm and a thickness of less than 120microns, the apparatus 1' comprising means to continuously supply a length of substrate having a pair of major surfaces, a width of less than 25mm and a thickness of less than 120microns, means 3' to clean the substrate, a hot dip overlayer application means 5' comprising a bath 50' for overlayer material OL to apply, in use, an overlayer material OL to all of the surfaces of the substrate S, overlayer control means (51', 60') to control the amount of overlayer material OL adhered to the substrate S, the overlayer control means (51', 60') comprising wiping means 51' to physically contact both major surfaces of the substrate S, wherein the wiping means 51' are located, in use, beneath the surface level of overlayer material OL retained in the bath 50'.

摘要翻译： 用于形成宽度小于25mm并且厚度小于120微米的汇流条的装置1'，该装置1'包括连续地提供一长度的具有一对主表面的基底，宽度小于25mm和 厚度小于120微米，用于清洁基底的装置3'，包括用于覆盖材料OL的浴50'的热浸覆盖施加装置5'，在使用中将覆盖材料OL施加到基底S的所有表面 ，覆盖层控制装置（51'，60'），用于控制附着在基板S上的覆层材料OL的量，所述覆盖层控制装置（51'，60'）包括擦拭装置51'以物理接触基板的两个主表面 S，其中擦拭装置51'在使用中位于保留在浴50'内的覆层材料OL的表面水平之下。

公开(公告)号：EP2925100A1

公开(公告)日：2015-09-30

申请号：EP15156471.3

申请日：2015-02-25

申请人： Strip Tinning Limited

发明人： Barton, Richard ,  Wong, Simon ,  Holmes, Christopher ,  O'Connor, Stephen

IPC分类号： H05K3/46

CPC分类号： B32B27/10 ,  B32B7/06 ,  B32B7/12 ,  B32B7/14 ,  B32B17/10293 ,  B32B27/08 ,  B32B27/30 ,  B32B37/1292 ,  B32B2037/268 ,  B32B2255/205 ,  B32B2264/105 ,  B32B2307/202 ,  B32B2311/12 ,  B32B2317/122 ,  B32B2333/00 ,  B32B2605/08 ,  H05K2201/10272

摘要： A busbar (1) for installation on or in a structure, the busbar (1) comprises a length of electrically conductive material (2) having a, preferably dimensionally invariant, adhesive material (3) secured along at least part of a major surface along the length thereof, wherein the adhesive material (3) is inboard of one both of the longitudinal edges of the electrically conductive material (2).

摘要翻译： 一种用于安装在结构上或结构中的母线（1），所述母线（1）包括一段导电材料（2），所述导电材料具有优选尺寸不变的粘合材料（3），沿至少一部分主表面 其长度，其中粘合材料（3）位于导电材料（2）的两个纵向边缘的内侧。