METHOD FOR PRODUCING POROUS CARBON, AND ELECTRODE AND CATALYST SUPPORT CONTAINING POROUS CARBON PRODUCED BY SAID PRODUCTION METHOD

    公开(公告)号:EP4331720A2

    公开(公告)日:2024-03-06

    申请号:EP24150330.9

    申请日:2019-07-01

    Abstract: A method of producing a porous carbon for use as a catalyst support having a specific surface area of 500 m 2 /g or greater is provided, comprising: a first step of carbonizing a material containing a carbon source and a template source, to prepare a carbonized product; a second step of immersing the carbonized product into a template removing solution, to remove a template from the carbonized product; and a third step of heat treating the carbonized product from which the template has been removed, the method characterized by: controlling amount of functional groups that are present in the porous carbon, comprising changing type of the template removing solution or temperature of the heat treatment, wherein the template size is 3 nm to 30 nm.

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

    公开(公告)号:EP4033519A1

    公开(公告)日:2022-07-27

    申请号:EP20864989.7

    申请日:2020-06-18

    Abstract: To provide a technique capable of improving performance and reliability of a semiconductor device. An n - -type epitaxial layer (12) is formed on an n-type semiconductor substrate (11), and a p + -type body region (14), n + -type current spreading regions (16, 17), and a trench TR are formed in the n - -type epitaxial layer (12). A bottom surface B1 of the trench TR is located in the p + -type body region (14), a side surface S1 of the trench TR is in contact with the n + -type current spreading region (17), and a side surface S2 of the trench TR is in contact with the n + -type current spreading region (16). Here, a ratio of silicon is higher than a ratio of carbon in an upper surface T1 of the r - -type epitaxial layer (12), and the bottom surface B1, the side surface S1, and the side surface S2 of the trench. Furthermore, an angle θ1 at which the upper surface T1 of the n - -type epitaxial layer (12) is inclined with respect to the side surface S1 is smaller than an angle θ2 at which the upper surface T1 of the n - -type epitaxial layer (12) is inclined with respect to the side surface S2.

    SUSCEPTOR
    5.
    发明公开
    SUSCEPTOR 审中-公开

    公开(公告)号:EP3863043A1

    公开(公告)日:2021-08-11

    申请号:EP19868808.7

    申请日:2019-09-30

    Abstract: Provided is a susceptor which enables improvement in yield of semiconductor chips produced from wafers, has a long life, and hardly causes chipping. The susceptor includes pockets (2) in which wafers (10) are to be placed, wherein at least one of the pockets (2) includes a plurality of supporting portions (3) for supporting the wafer (10), a plurality of contact portions (4) to make contact with a lateral surface (10a) of the wafer (10), and a plurality of non-contact portions (5) spaced from the lateral surface (10a) of the wafer (10). The contact portions (4) and the non-contact portions (5) are alternately provided in the inner peripheral wall of the pocket (2), and at least two of the supporting portions (3) are provided on lines extending from a center (O) of the pocket (2) to the non-contact portions (5) when the susceptor is viewed from above.

    CARBON BRUSH
    10.
    发明授权

    公开(公告)号:EP2858219B1

    公开(公告)日:2018-12-05

    申请号:EP13797737.7

    申请日:2013-05-29

    Inventor: TAKUMA, Masayuki

    CPC classification number: H01R39/22 H01R39/26

    Abstract: A carbon brush is provided that inhibits the temperature increase and the increase of rubbing noise that result from excessive formation of a commutator film. A carbon brush includes a carbon block substrate having pores in a surface thereof and an inner portion thereof, the carbon brush making sliding contact with a commutator provided in a motor. A suspension containing an oil and a petroleum-based solvent having a boiling point higher than a temperature of the carbon brush at a time of operation of the motor exists in the pores. It is desirable that the proportion of the suspension be from 0.5 weight % to 6 weight % with respect to the carbon block substrate.

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