CERAMIC COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME

    公开(公告)号:EP4426075A1

    公开(公告)日:2024-09-04

    申请号:EP22886798.2

    申请日:2022-10-18

    IPC分类号: H05K1/03 H01L23/13

    CPC分类号: H05K1/03 H01L23/13

    摘要: A ceramic copper circuit board according to one embodiment of the present invention is provided with: a ceramic substrate; and a copper circuit part that is bonded to at least one surface of the ceramic substrate, with a brazing material layer being interposed therebetween. The brazing material layer contains Cu, Ti, and one or two elements that are selected from among Sn and In. The brazing material layer comprises: a bonding part that is provided between the ceramic substrate and the copper circuit part; and a first protrusion part that is provided around the bonding part, and has a titanium content within the range from 70% by mass to 100% by mass. It is preferable that the sum of the titanium content and the nitrogen content in the first protrusion part is within the range from 99% by mass to 100% by mass.

    CERAMIC CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME

    公开(公告)号:EP4297076A1

    公开(公告)日:2023-12-27

    申请号:EP22756097.6

    申请日:2022-02-10

    摘要: A ceramic circuit board includes a ceramic substrate and a metal plate bonded together via a bonding layer, wherein when the ceramic circuit board is observed through a cross-section defined by a thickness direction and lateral direction of the ceramic circuit board: a side surface of the metal plate has an inclined shape; and the bonding layer has a bonding-layer protruding portion which protrudes by 20 µm or more and 150 µm or less from an edge where the bonding layer is in contact with the side surface of the metal plate. The shape and Vickers hardness of the side surface of the metal plate are controlled. The ceramic substrate is preferably a silicon nitride substrate.

    JOINED BODY, CERAMIC-COPPER CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE

    公开(公告)号:EP4234518A1

    公开(公告)日:2023-08-30

    申请号:EP21882852.3

    申请日:2021-10-20

    IPC分类号: C04B37/02 H05K1/03

    摘要: A joined body according to an embodiment is provided with a ceramic substrate, a copper plate and a joint layer. The joint layer is arranged on at least one surface of the ceramic substrate and joins the ceramic substrate and the copper plate to each other. The joint layer contains Ag and Ti. The copper plate includes a first region, a second region and a third region. The first region is separated apart from the joint layer in the thickness direction. The second region is arranged between the joint layer and the first region, and has a higher Ag concentration than that in the first region. The third region is arranged between the joint layer and the second region, and has a lower Ag concentration than that in the second region.

    WHITE LIGHT EQUIPMENT
    10.
    发明公开

    公开(公告)号:EP3848985A1

    公开(公告)日:2021-07-14

    申请号:EP21160434.3

    申请日:2011-06-23

    摘要: The present invention provides a white light source comprising a blue light emitting LED having a light emission peak of 421 to 490 nm and satisfying a relational equation of − 0.2 ≤ P λ × V λ / P λmax 1 × V λmax 1 − B λ × V λ / B λmax 2 × V λmax ≤ + 0.2 , assuming that: a light emission spectrum of the white light source is P(λ); a light emission spectrum of black-body radiation having a same color temperature as that of the white light source is B(λ); a spectrum of a spectral luminous efficiency is V(λ); a wavelength at which P(λ) × V(λ) becomes largest is λmax1; and a wavelength at which B(λ) × V(λ) becomes largest is λmax2. According to the above white light source, there can be provided a white light source capable of reproducing the same light emission spectrum as that of natural light.