公开(公告)号：EP2849221A1

公开(公告)日：2015-03-18

申请号：EP13183978.9

申请日：2013-09-11

Applicant: ABB Technology AG

Inventor： Hartmann, Samuel ,  Hajas, David ,  Berger, Andreas ,  Trüssel, Dominik

IPC: H01L23/373 ,  H01L23/42 ,  H01L23/433

CPC classification number: H01L23/42 ,  H01L23/433 ,  H01L2924/0002 ,  H05K1/0306 ,  H01L2924/00

Abstract: A cooling arrangement (30a, 30b) for a power semiconductor module (10) comprises a thermally emitting surface (22) in thermal contact with at least one power semiconductor (16) of the power semiconductor module (10); a cooling body (24) in thermal contact with the thermally emitting surface (22) adapted for dissipating heat generated by the at least one power semiconductor (16); and a thermally conducting body (26a, 26b), which is arranged between the thermally emitting surface (22) and the cooling body (24), such that the heat emitted from the thermally emitting surface (22) is conducted via the thermally conducting body (26a, 26b) to the cooling body (24). The thermally conducting body (26a, 26b) comprises at least one foil (32, 32a, 32b) and a plastically deformable material (34) adapted for conduction heat, which is prevented to leak from the cooling arrangement (30a, 30b) by the at least one foil (32, 32a, 32b).

Abstract translation: 用于功率半导体模块（10）的冷却装置（30a，30b）包括与功率半导体模块（10）的至少一个功率半导体（16）热接触的热发射表面（22）。 与热发射表面（22）热接触的冷却体（24），其适于消散由所述至少一个功率半导体（16）产生的热量; 以及布置在所述热发射表面（22）和所述冷却体（24）之间的导热体（26a，26b），使得从所述热发射表面（22）发射的热量经由所述导热体 （26a，26b）连接到冷却体（24）。 导热体（26a，26b）包括至少一个箔（32,32a，32b）和适于传导热的可塑性变形材料（34），其被防止从冷却装置（30a，30b）泄漏 至少一个箔片（32,32a，32b）。