Process solutions containing surfactants
    1.
    发明公开
    Process solutions containing surfactants 有权
    含有表面活性剂的工艺解

    公开(公告)号:EP1580607A3

    公开(公告)日:2005-10-12

    申请号:EP05005646.4

    申请日:2005-03-15

    IPC分类号: G03F7/32 G03F7/40 H01L21/306

    摘要: Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain embodiments, the process solution may reduce post-development defects such as pattern collapse or line width roughness when employed as a rinse solution either during or after the development of the patterned photoresist layer. Also disclosed is a method for reducing the number of defects such as pattern collapse and/or line width roughness on a plurality of photoresist coated substrates employing the process solution of the present invention.

    摘要翻译: 包含一种或多种表面活性剂的工艺溶液用于减少制造半导体器件中的缺陷数量。 在某些实施例中,当在图案化光刻胶层的显影期间或之后用作漂洗溶液时,处理溶液可以减少显影后缺陷,例如图案塌陷或线宽粗糙度。 还公开了一种用于减少使用本发明的处理溶液的多个光致抗蚀剂涂覆的基板上的缺陷例如图案塌陷和/或线宽粗糙度的方法。

    Process solutions containing surfactants
    2.
    发明公开
    Process solutions containing surfactants 有权
    Tenside enthaltendeBehandlungslösungen

    公开(公告)号:EP1580607A2

    公开(公告)日:2005-09-28

    申请号:EP05005646.4

    申请日:2005-03-15

    IPC分类号: G03F7/32 G03F7/40

    摘要: Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain embodiments, the process solution may reduce post-development defects such as pattern collapse or line width roughness when employed as a rinse solution either during or after the development of the patterned photoresist layer. Also disclosed is a method for reducing the number of defects such as pattern collapse and/or line width roughness on a plurality of photoresist coated substrates employing the process solution of the present invention.

    摘要翻译: 使用包含一种或多种表面活性剂的工艺溶液来减少半导体器件制造中的缺陷数量。 在某些实施方案中,当在图案化光致抗蚀剂层的显影期间或之后,当用作冲洗溶液时,所述工艺溶液可以减少显影后缺陷,例如图案塌陷或线宽粗糙度。 还公开了一种使用本发明的工艺溶液来减少多个光致抗蚀剂涂覆的基板上的图案塌陷和/或线宽粗糙度等缺陷的数量的方法。