摘要:
The present invention relates to compositions useful in removing photoresist and organic and inorganic residues and processes for removal of photoresists and etch residues. The compositions are aqueous, acidic compositions containing fluoride and organic polar solvents. The compositions are free of glycols and have a low surface tension and viscosity. Corrosion inhibitors are optionally present.
摘要:
An aqueous stripping composition comprising a mixture of a polar amine, an organic or inorganic amine and a corrosion inhibitor which is gallic acid, its ester or analog. The stripping composition is effective to strip photoresists, residues from plasma process generated organic, metal-organic materials, inorganic salts, oxides, hydroxides or complexes in combination with or exclusive of organic photoresist films at low temperatures without redepositing any susbtantial amount of metal ions.
摘要:
An aqueous stripping composition comprising a mixture of an organic amine and a corrosion inhibitor which is benzotriazole alone or in combination with gallic acid, its ester or analog. The stripping composition is effective to strip photoresists, residues from plasma process generated organic, metal-organic materials, inorganic salts, oxides, hydroxides or complexes in combination with or exclusive of organic photoresist films at low temperatures with little corrosion of copper or titanium containing substrates.
摘要:
A non-aqueous negative photoresist stripping composition which consists essentially of about 40 to 85 % by weight of an alkylnaphthalene solvent, about 5 to 20 % by weight of an alkyl phenol which provides a corrosion inhibitory effect, about 5 to 20 % by weight of a linear monoalkylbenzene sulfonic acid which is a surfactant and about 1 to 10 % by weight of a dialkylbenzene sulfonic acid. There is further provided a process for removing coatings from a photoresist with the compositions of the invention.