公开(公告)号：EP1956112A3

公开(公告)日：2008-10-22

申请号：EP08006163.3

申请日：1999-06-30

申请人： ASM America, Inc.

发明人： Doley, Allan D. ,  Goodwin, Dennis L. ,  O'Neill, Kenneth ,  Vrijburg, Gerben ,  Rodriguez, David ,  Aggarwal, Ravinder

IPC分类号： C23C16/00 ,  C30B23/06 ,  C23C16/44 ,  C23C16/54

CPC分类号： C30B29/14 ,  C23C16/4401 ,  C23C16/4408 ,  C30B25/08 ,  Y10S414/139

摘要： An apparatus and method for reducing particles in reactors. The apparatus (10) includes an enclosure for processing the semiconductor wafers. The enclosure has a wafer handling chamber (16) connected by an isolation gate valve (18) to a load lock chamber (14). Additionally, the apparatus includes: a reactor chamber (38) pipes (24,26) for delivering a purge gas into the wafer handling chamber (16); a pilot operated back pressure regulator (40) for regulating the delivery and removal of the purge gas from the enclosure for reducing disturbances from the purge gas entering into the enclosure; a flow regulated Bernoulli wand (36) for lifting and holding a single wafer; ionizers (21a-21d) in the purge gas lines entering the wafer handling chamber (16) and load locks chamber (14) for ionizing the purged gas molecules, the ionized gas discharges all the static inside the semiconductor equipment and prevents the wafer from attracting charged particles; and means for reducing gas flow turbulence when switching valves within the reactor.

公开(公告)号：EP1956112A2

公开(公告)日：2008-08-13

申请号：EP08006163.3

申请日：1999-06-30

申请人： ASM America, Inc.

发明人： Doley, Allan D. ,  Goodwin, Dennis L. ,  O'Neill, Kenneth ,  Vrijburg, Gerben ,  Rodriguez, David ,  Aggarwal, Ravinder

IPC分类号： C23C16/00 ,  C30B23/06 ,  C23C16/44 ,  C23C16/54

CPC分类号： C30B29/14 ,  C23C16/4401 ,  C23C16/4408 ,  C30B25/08 ,  Y10S414/139

摘要： An apparatus and method for reducing particles in reactors. The apparatus (10) includes an enclosure for processing the semiconductor wafers. The enclosure has a wafer handling chamber (16) connected by an isolation gate valve (18) to a load lock chamber (14). Additionally, the apparatus includes: a reactor chamber (38) pipes (24,26) for delivering a purge gas into the wafer handling chamber (16); a pilot operated back pressure regulator (40) for regulating the delivery and removal of the purge gas from the enclosure for reducing disturbances from the purge gas entering into the enclosure; a flow regulated Bernoulli wand (36) for lifting and holding a single wafer; ionizers (21a-21d) in the purge gas lines entering the wafer handling chamber (16) and load locks chamber (14) for ionizing the purged gas molecules, the ionized gas discharges all the static inside the semiconductor equipment and prevents the wafer from attracting charged particles; and means for reducing gas flow turbulence when switching valves within the reactor.

摘要翻译： 一种减少反应器中颗粒的装置和方法。 该设备（10）包括用于处理半导体晶片的外壳。 外壳具有通过隔离闸阀（18）连接到加载锁定室（14）的晶片处理室（16）。 另外，该设备包括：用于将清除气体输送到晶片处理室（16）中的反应室（38）管道（24,26）; 先导式背压调节器（40），其用于调节来自外壳的清除气体的输送和去除，以减少来自进入外壳的清除气体的干扰; 用于提升和保持单个晶片的流量调节伯努利棒（36）; 进入晶片处理室（16）的净化气体管线中的离子发生器（21a-21d）和用于离子化净化气体分子的负载锁定室（14），离子化气体释放半导体设备内部的全部静电并防止晶片吸引 带电粒子; 以及用于在切换反应器内的阀时减少气流湍流的装置。