公开(公告)号：EP2384841A2

公开(公告)日：2011-11-09

申请号：EP11003586.2

申请日：2011-05-03

Applicant: ASM Assembly Automation Ltd.

Inventor： Lam, Kui Kam ,  Tu, Pingliang ,  Ip, Chung Hung Samuel

IPC: B23K1/00 ,  B23K3/06

CPC classification number: B23K1/20 ,  B23K1/0016 ,  B23K3/063 ,  B23K2201/40 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00

Abstract: An apparatus (10) for dispensing solder onto a substrate (12) for mounting a semiconductor chip on the substrate comprises a dispensing body (18) and first and second dispensing channels extending through the dispensing body. Each dispensing channel is operative to receive a separate solder wire to feed the solder wire (24) to an end of the dispensing body facing the substrate. The dispensing channels are further operative to introduce the solder wires in a solid state simultaneously from the end of the dispensing body to be melted upon contact with the substrate which is heated.

Abstract translation: 基板的装置（10）用于分配焊料到（12），在该衬底上安装半导体芯片包括分配体（18）和第一和第二分配通道通过分配主体延伸。 每个分配通道可操作以接收单独的焊丝喂焊丝（24）在面向衬底的分配体的端部。 分配通道可操作继以固体状态的同时从分配本体的端部引入焊线在与基板的所有被加热接触熔融。

公开(公告)号：EP2450947A3

公开(公告)日：2017-05-10

申请号：EP11008850.7

申请日：2011-11-07

Applicant: ASM Assembly Automation Ltd.

Inventor： Lam, Kui Kam ,  Tang, Yen Hsi ,  Wong, Yiu Yan ,  Wan, Hok Man

IPC: H01L21/67 ,  H01L23/00

CPC classification number: H01L21/6715 ,  H01L24/27 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/00

Abstract: Adhesive is dispensed for conducting die bonding onto a substrate including rows of bond pads aligned along a first axis and columns of bond pads aligned along a second axis transverse to the first axis where target dispensing positions are located. A first dispensing head incorporating a first nozzle and a second dispensing head incorporating a second nozzle are provided and the substrate is fed along the first axis to a position where the first and second dispensing heads are located. Pattern recognition of a columnar section of the substrate comprising one or more consecutive columns of bond pads with an optical system may be conducted by moving the optical system along the second axis relative to the substrate. Thereafter, the first nozzle and the second nozzle are driven concurrently to dispense adhesive from the first and second nozzles onto the target dispensing positions in the same columnar section of the substrate.

Abstract translation: 分配粘合剂以便将管芯接合到衬底上，所述衬底包括沿着第一轴对准的成排的接合焊盘和沿着横切第一轴的第二轴对齐的接合焊盘列，目标分配位置位于所述第二轴上。 提供结合有第一喷嘴的第一分配头和结合有第二喷嘴的第二分配头，并且将基底沿着第一轴线供给到第一和第二分配头所处的位置。 通过使光学系统沿着第二轴线相对于衬底移动来进行包括具有光学系统的一个或多个连续的焊盘列的衬底的柱状部分的图案识别。 之后，同时驱动第一喷嘴和第二喷嘴以将粘合剂从第一和第二喷嘴分配到基板的相同柱状部分中的目标分配位置上。

公开(公告)号：EP2067561A1

公开(公告)日：2009-06-10

申请号：EP08020432.4

申请日：2008-11-25

Applicant: ASM Assembly Automation Ltd.

Inventor： Lam, Kui Kam ,  IP Chun Hung, Samuel

IPC: B23K1/00 ,  B23K3/06 ,  H05K3/34 ,  B23K101/40

CPC classification number: B23K1/0016 ,  B23K3/063 ,  B23K2201/40 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00

Abstract: A method for mounting a semiconductor chip onto a substrate (12) comprises the steps of positioning a solder dispenser (10) over the substrate (12) and passing a length of solder wire (24) through the solder dispenser (10) to the substrate (12). The feeding of the wire (24) to the substrate (12) is a feeding direction is controlled with a wire feeder. The solder dispenser (10) is moved relative to the substrate (12) with a positioning device (17) along at least one of two orthogonal axes that are substantially perpendicular to the feeding direction contemporaneously with feeding the solder wire (24) to the surface of the substrate (12) to dispense a line of molten solder onto the substrate (12). The semiconductor chip is then mounted onto the molten solder that has been dispensed onto the substrate.

Abstract translation: 一种用于安装一个半导体芯片到基片（12）的方法包括定位一个焊料滴涂器（10）在基板（12）和通过焊接导线（24）的长度通过焊料滴涂器（10）到所述基板的步骤 （12）。 导线（24）与基板（12）的进给是进给方向被控制与焊丝送进器。 焊料滴涂器（10）相对于沿两个正交轴中的至少一个基板（12）的定位装置（17）被移动确实是基本垂直于进给方向同时与焊料丝（24）进料至所述表面 基板（12）的，以分配到基底（12）的线的熔融焊料。 然后，将半导体芯片安装到熔融焊料也已被分配到基底上。

公开(公告)号：EP2450947B1

公开(公告)日：2018-07-04

申请号：EP11008850.7

申请日：2011-11-07

Applicant: ASM Assembly Automation Ltd.

Inventor： Lam, Kui Kam ,  Tang, Yen Hsi ,  Wong, Yiu Yan ,  Wan, Hok Man

IPC: H01L21/67 ,  H01L23/00

CPC classification number: H01L21/6715 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L2224/27312 ,  H01L2224/29036 ,  H01L2224/2919 ,  H01L2224/743 ,  H01L2224/75611 ,  H01L2224/75744 ,  H01L2224/759 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665

Abstract: Adhesive is dispensed for conducting die bonding onto a substrate including rows of bond pads aligned along a first axis and columns of bond pads aligned along a second axis transverse to the first axis where target dispensing positions are located. A first dispensing head incorporating a first nozzle and a second dispensing head incorporating a second nozzle are provided and the substrate is fed along the first axis to a position where the first and second dispensing heads are located. Pattern recognition of a columnar section of the substrate comprising one or more consecutive columns of bond pads with an optical system may be conducted by moving the optical system along the second axis relative to the substrate. Thereafter, the first nozzle and the second nozzle are driven concurrently to dispense adhesive from the first and second nozzles onto the target dispensing positions in the same columnar section of the substrate.

公开(公告)号：EP2067561B1

公开(公告)日：2013-04-10

申请号：EP08020432.4

申请日：2008-11-25

Applicant: ASM Assembly Automation Ltd.

Inventor： Lam, Kui Kam ,  IP Chun Hung, Samuel

IPC: B23K1/00 ,  B23K3/06 ,  H05K3/34 ,  B23K101/40

CPC classification number: B23K1/0016 ,  B23K3/063 ,  B23K2201/40 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00

公开(公告)号：EP2450947A2

公开(公告)日：2012-05-09

申请号：EP11008850.7

申请日：2011-11-07

Applicant: ASM Assembly Automation Ltd.

Inventor： Lam, Kui Kam ,  Tang, Yen Hsi ,  Wong, Yiu Yan ,  Wan, Hok Man

IPC: H01L21/67

CPC classification number: H01L21/6715 ,  H01L24/27 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/00

Abstract: Adhesive is dispensed for conducting die bonding onto a substrate including rows of bond pads aligned along a first axis and columns of bond pads aligned along a second axis transverse to the first axis where target dispensing positions are located. A first dispensing head incorporating a first nozzle and a second dispensing head incorporating a second nozzle are provided and the substrate is fed along the first axis to a position where the first and second dispensing heads are located. Pattern recognition of a columnar section of the substrate comprising one or more consecutive columns of bond pads with an optical system may be conducted by moving the optical system along the second axis relative to the substrate. Thereafter, the first nozzle and the second nozzle are driven concurrently to dispense adhesive from the first and second nozzles onto the target dispensing positions in the same columnar section of the substrate.