公开(公告)号：EP3140854A1

公开(公告)日：2017-03-15

申请号：EP14758919.6

申请日：2014-09-03

申请人： Heraeus Deutschland GmbH & Co. KG

发明人： SCHÄFER, Michael ,  DUCH, Susanne Klaudia

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/488 ,  H01L23/13 ,  H01L21/98 ,  H01L25/065

CPC分类号： H01L21/4867 ,  B23K35/0244 ,  B23K35/025 ,  H01L21/4825 ,  H01L21/4871 ,  H01L23/142 ,  H01L23/15 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/49582 ,  H01L23/49838 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/743 ,  H01L24/83 ,  H01L25/16 ,  H01L2224/04026 ,  H01L2224/05571 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2744 ,  H01L2224/29294 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/743 ,  H01L2224/7598 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83424 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83464 ,  H01L2224/8384 ,  H01L2224/97 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2924/13091 ,  H01L2924/15153 ,  H05K3/007 ,  H05K3/207 ,  H05K2203/1131 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00

摘要： A method for applying multiple discrete layer fragments made of dried metal sintering compound onto predetermined, electrically-conductive surface areas of a carrier for electronic components, comprising the steps: (1) application of multiple discrete layer fragments made of metal sintering compound on one side of a flat transfer substrate in mirrored arrangement to the predetermined, electrically-conductive surface areas, (2) drying of the metal sintering compound thus applied while preventing sintering, (3) arranging and contacting of the transfer substrate with the layer fragments made of dried metal sintering compound facing toward the surface of the carrier for electronic components and while guaranteeing a congruent positioning of the surface area of the transfer substrate provided with the dried metal sintering compound and the predetermined, electrically-conductive surface area of the carrier for electronic components, (4) application of pressing force on the contact arrangement created in Step (3), and (5) removal of the transfer substrate from the contact arrangement, wherein the adhesive force of the dried metal sintering compound following the completion of Step (4) is greater with respect to the predetermined, electrically-conductive surface areas of the carrier for electronic components than with respect to the surface of the transfer substrate, wherein the flat transfer substrate is a non-sinterable and, if necessary, coated metal film or a thermoplastic plastic film, wherein the carrier for electronic components describes a substrate with a flat surface having one or more indentations from 10 to 500 μm and at the same time is selected from the group consisting of pressed screens, ceramic substrates, DCB substrates, and metal composite materials, and wherein at least one predetermined, electrically-conductive surface area is located in an indentation. The carrier for electronic components can already be populated with one or more electronic components. The carrier substrate can have recesses for electronic components already present on the carrier. The carrier for electronic components provided with dried metal sintering compound is used in a method, in which initially a sandwich arrangement is created from the carrier for electronic components provided with dried metal sintering compound and the electronic components, and the sandwich arrangement is subsequently subjected to a sintering process.

摘要翻译： 一种用于涂敷由干燥的金属烧结化合物走上预定电子元件的载体，导电性的表面区域，其包括以下步骤的多个离散层片段的方法：（1）在一侧上由金属制成的烧结化合物的多个离散层片段的应用 在镜像布置到预定的平转移衬底，导电性的表面区域，（2）的金属烧结化合物的干燥这样施加，同时防止烧结，（3）布置而制成的干燥与层片段转印基板接触 朝向承载用于电子部件的表面和同时保证提供与干燥的金属烧结化合物和预定的转印用基板的表面区域的全等定位相对的金属烧结化合物，所述载体为电子元件的导电表面区域， （4）在接触arrangemen按压力的施加 在步骤创建吨（3）和（5）去除所述接触装置的转印基板，worin干燥的金属烧结化合物的粘合力继完成步骤（4）大于相对于所述预定的，electrically- 所述载体用于电子部件比相对于所述转印用基板的表面上，worin扁平转印用基板的导电表面区域是一个非烧结能够和，如有必要，涂覆的金属片或热塑性塑料薄膜，电影，worin用于电子部件的载体 描述了一种基片与具有从10至500微米，并在同一时间的一个或多个凹口被选自按压屏幕中选择的平表面，陶瓷基板，DCB衬底和金属复合材料，和worin至少一个预定， 导电表面区域位于在缩进。 用于电子部件的载体可以已经与一个或多个电子部件填充。 所述载体基片可以具有用于电子部件的凹部已经存在于载体上。 用于设置有干燥的金属烧结化合物的电子元件的载体在其中从载体用于设置有干燥的金属烧结化合物和电子部件的电子部件最初创建的夹层结构的方法中使用，并且该夹层结构随后经受 烧结过程。

公开(公告)号：EP2978015A4

公开(公告)日：2016-12-07

申请号：EP14768581

申请日：2014-03-13

申请人： G-SMATT CO LTD

发明人： SHIN HAK RYUL ,  LEE HO JOON

IPC分类号： H05K3/32 ,  H01L23/00 ,  H05K3/30

CPC分类号： H01L33/62 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/27312 ,  H01L2224/29006 ,  H01L2224/29007 ,  H01L2224/29012 ,  H01L2224/29014 ,  H01L2224/29027 ,  H01L2224/29036 ,  H01L2224/30131 ,  H01L2224/30135 ,  H01L2224/30136 ,  H01L2224/30151 ,  H01L2224/30155 ,  H01L2224/30179 ,  H01L2224/30505 ,  H01L2224/32225 ,  H01L2224/33135 ,  H01L2224/33179 ,  H01L2224/33505 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/83874 ,  H01L2924/12041 ,  H01L2933/0066 ,  H05K3/305 ,  H05K3/321 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2203/0126 ,  H05K2203/166 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00012

公开(公告)号：EP1732720B1

公开(公告)日：2016-06-22

申请号：EP05728632.0

申请日：2005-03-31

申请人： SENJU METAL INDUSTRY CO., LTD.

发明人： UESHIMA, Minoru

IPC分类号： F27D3/04 ,  B22D41/04 ,  B23K35/26 ,  B22D1/00 ,  B23K35/02 ,  F27D27/00 ,  H01L23/00 ,  B23K101/40

CPC分类号： F27D27/00 ,  B22D1/00 ,  B22D41/04 ,  B23K35/0244 ,  B23K35/262 ,  B23K2201/40 ,  H01L24/743 ,  H01L2224/743 ,  Y10S164/90 ,  H01L2924/00

公开(公告)号：EP2284876A4

公开(公告)日：2012-01-04

申请号：EP09758095

申请日：2009-06-02

申请人： SUMITOMO BAKELITE CO

发明人： KATSURAYAMA SATORU

IPC分类号： H01L21/56

CPC分类号： H01L24/27 ,  C09D163/00 ,  H01L21/563 ,  H01L23/293 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/29 ,  H01L24/743 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/743 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81211 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/0373 ,  H05K2201/0209 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/05341 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2924/05042 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

公开(公告)号：EP1886814A3

公开(公告)日：2010-05-26

申请号：EP07013383.0

申请日：2007-07-09

申请人： Komori Corporation

发明人： Kusaka, Akehiro

IPC分类号： B41F31/00 ,  B41F11/02 ,  B41F9/02 ,  B41F16/00

CPC分类号： B41F11/02 ,  B41F9/021 ,  B41F16/00 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/14 ,  H01L2924/00

摘要： An information recording medium supply apparatus comprises: a gravure plate cylinder (35) supported having recessed image areas (35b) formed in the circumferential surface thereof; an ink roller (36) for supplying ink from an ink reservoir (37) to the circumferential surface of the gravure plate cylinder (35) ; a doctor (38) for removing surplus ink adhering to non-image areas (35a) of the gravure plate cylinder (35) ; an impression cylinder (34) supported rotatably and adapted to transfer the ink in the image areas (35b) to a sheet (S) being transported in cooperation with the gravure plate cylinder (35) ; and an IC chip supply device (50) for supplying an IC chip to the ink in the image area (35b) on a side downstream of the point of removal of the ink by the doctor (38) in the rotating direction of the gravure plate cylinder (35), and on a side upstream of the point of contact with the impression cylinder (34) in the rotating direction of the gravure plate cylinder (35).

公开(公告)号：EP1884990A1

公开(公告)日：2008-02-06

申请号：EP06745589.9

申请日：2006-04-24

申请人： Lintec Corporation

发明人： KOBAYASHI, Kenji c/o. LINTEC CORPORATION ,  TSUJIMOTO, Masaki c/o. LINTEC CORPORATION ,  YOSHIHOKA, Takahisa c/o. LINTEC CORPORATION

IPC分类号： H01L21/52 ,  H01L21/683 ,  B29C63/02 ,  B29C65/02

CPC分类号： B29C63/02 ,  B29C63/0095 ,  B29C65/4825 ,  B29C65/5057 ,  B29C65/5092 ,  B29C65/526 ,  B29C65/7861 ,  B29C65/7867 ,  B29C66/1122 ,  B29C66/452 ,  B29C66/8223 ,  B29C66/8242 ,  B29C66/83411 ,  B29L2017/005 ,  B32B37/025 ,  B32B2457/14 ,  H01L21/00 ,  H01L21/67132 ,  H01L21/68 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/274 ,  H01L2224/743 ,  H01L2224/83191 ,  H01L2924/01004 ,  H01L2924/01029 ,  B29C65/00 ,  H01L2924/00

摘要： A sticking apparatus includes a sticking table 21 for supporting a semiconductor wafer W and a sticking unit 24 that peels off an adhesive sheet S1 from a release liner PS and sticks the adhesive sheet to the semiconductor wafer W. The sticking unit 24 has a detector 60. The detector 60 is disposed above a feed-out path of a raw strip sheet L for detecting a displacement amount S of the adhesive sheet S1 in the lateral direction perpendicular to the feed-out direction thereof. When the displacement amount S is detected, a displacement correction device 51 is activated and the sticking table 21 is moved by a distance corresponding to the displacement amount S, thereby the adhesive sheet S1 can be stuck onto the semiconductor wafer W in accordance with the outer shape thereof. The adhesive sheet S1 is stuck onto the wafer W by a sticking roll 61, which is brought into a contact with the release liner PS to impart a pressing force thereto.

摘要翻译： 粘贴装置包括用于支撑半导体晶片W的粘贴台21和从剥离衬垫PS剥离粘合片S1的粘贴单元24，并将粘合片粘贴到半导体晶片W.粘贴单元24具有检测器60 检测器60设置在用于检测粘合片S1在与其送出方向垂直的横向方向上的位移量S的原纸片材L的送出路径的上方。 当检测到位移量S时，位移校正装置51被启动，并且粘贴台21移动与位移量S相对应的距离，从而可以根据外部的粘合片S1粘贴到半导体晶片W上 形状。 粘合片S1通过与剥离衬垫PS接触以对其施加压力的粘着辊61粘附在晶片W上。

公开(公告)号：EP0901155B1

公开(公告)日：2004-08-18

申请号：EP98810103.6

申请日：1998-02-06

申请人： ESEC Trading SA

发明人： Viggiano, Franco, Dr. ,  Koster, Christof

IPC分类号： H01L21/00

CPC分类号： H01L21/6715 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/00

公开(公告)号：EP1342525A1

公开(公告)日：2003-09-10

申请号：EP02005422.7

申请日：2002-03-08

申请人： ESEC Trading SA

发明人： Suter, Guido ,  Tschudin, Christoph

IPC分类号： B23K3/06 ,  B23K3/00 ,  B23K1/012

CPC分类号： B23K3/063 ,  B23K1/012 ,  B23K2201/40 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/00

摘要： Zum Auftragen von Lot auf ein Substrat (1) werden einer Mischkammer (6) einer Zweistoffdüse (4) ein Lotdraht (7) und auf eine vorbestimmte Temperatur erhitztes Formiergas zugeführt, so dass in der Mischkammer (6) Lot abgeschmolzen und im Gasstrom mitgeführt wird. Das aus der Zweistoffdüse (4) herausgeblasene Lot setzt sich auf dem Substrat (1) ab. Die Zweistoffdüse (4) wird relativ zum Substrat (1) bewegt oder verschwenkt, um das Lot auf einer vorbestimmten Fläche des Substrats (1) zu verteilen.

摘要翻译： 该方法包括将加热至预定温度的焊丝（7）和加热气体进料到两级喷嘴（4）的混合室（6），使得焊料在混合室中熔化并与气体一起携带 相对于基板（1）流动并移动或倾斜喷嘴，由此从喷嘴吹出的焊料沉积在基板上。

公开(公告)号：EP0801424A2

公开(公告)日：1997-10-15

申请号：EP97105675.9

申请日：1997-04-07

申请人： Oki Electric Industry Co., Ltd.

发明人： Ohuchi, Shinji ,  Yamada, Etsuo ,  Shiraishi, Yasushi

IPC分类号： H01L23/495

CPC分类号： H01L23/4951 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/743 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A resin mold type semiconductor device (10) which can be prevented from occurring a crack and can be made thinner, is provided. A resin mold type semiconductor device comprises a semiconductor chip (11), a lead member (12) arranged in a manner that one side face (12a) of a head portion thereof touches a surface (11a) of the semiconductor chip, a wire (13) for electrically connecting the surface of the semiconductor chip and another side face of the lead member, an adhesive member (15) for adhering the one side face of the lead member and a peripheral face (11b) of the semiconductor chip, and a package (14) for molding the semiconductor chip, a part of the lead, the wire and the adhesive member by synthetic resin. In a further embodiment, the lead member is provided with a concave portion and in the one side face a groove extending from the concave portion to an end of the lead.

摘要翻译： 提供一种树脂模制型半导体装置（10），其能够防止发生裂纹并且可以变得更薄。 一种树脂模具型半导体器件，包括半导体芯片（11），引线构件（12），其引导部件（12）的头部的一个侧面（12a）接触半导体芯片的表面（11a），线（ 13），用于将所述半导体芯片的表面与所述引线构件的另一个侧面电连接，用于粘合所述引线构件的一个侧面和所述半导体芯片的外围面（11b）的粘合构件（15），以及 封装（14），用于通过合成树脂模制半导体芯片，引线，导线和粘合构件的一部分。 在另一实施例中，引线构件设置有凹部，并且在一个侧面中是从凹部延伸到引线的端部的凹槽。

公开(公告)号：EP0493595B1

公开(公告)日：1996-01-10

申请号：EP90913872.9

申请日：1990-09-19

申请人： SUMITOMO SPECIAL METALS COMPANY LIMITED

发明人： YAMAMOTO, K. Suita Seisakusho of Sumitomo Special ,  NEMOTO, Shin Suita Seisakusho of Sumitomo Special ,  OKAMOTO, Jun Suita Seisakusho of Sumitomo Special ,  OKAZAKI, S. Suita Seisakusho of Sumitomo Special

IPC分类号： B23K20/04

CPC分类号： B23K26/22 ,  B23K20/04 ,  B23K26/0846 ,  B23K26/40 ,  B23K31/02 ,  B23K2203/08 ,  B23K2203/10 ,  B23K2203/12 ,  B23K2203/18 ,  B23K2203/26 ,  B29C69/006 ,  H01L21/4821 ,  H01L21/4839 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A method of highly precisely and efficiently producing spot cladding members used for lead frames of semiconductor integrated circuits such as flat packages. A metal foil and a substrate member that are fed in constant steps are temporarily spot-welded successively at predetermined regular intervals by resistance welding, ultrasonic welding or laser welding, and then undesired portions are removed by laser cutting or rotary cutter. Alternatively, the metal foil fed in constant steps is cut by punching and is temporarily spot-welded onto the substrate member fed in the same manner using the punch as the welding electrode. Such a step provides a material to which pieces of metal foil of a required size are temporarily fastened maintaining a highly precise pitch. Thereafter, the constant-load control and the constant-elongation control are carried out in cascade in the steps of pressing and rolling such that the material has a predetermined thickness. Furthermore, a desired position is detected from the pitch after rolling or from a predetermined reference point to obtain the above desired load. Thus, the thickness of the material is highly precisely controlled to obtain a spot cladding member having a highly precise pitch and size.