公开(公告)号：EP1737023A3

公开(公告)日：2007-05-30

申请号：EP06018989.1

申请日：2002-03-20

Applicant: ASM Assembly Automation Ltd.

Inventor： Cheung, Yiu Ming ,  Cheung, Yu Sze ,  Tsai, Pei Wei

IPC: H01L21/00 ,  H01L21/68

CPC classification number: H01L21/67034 ,  H01L21/68707 ,  Y10T83/2187

Abstract: This invention relates to a method and apparatus for pick and place handling of electronic components (7) that have been formed on a common substrate. A cutting chuck (5) is provided for separating the component. A processing unit (3) is provided including a rinsing station, at least one drying station and an output station. A transfer platform (4) is provided for receiving components from said output station of said processing unit (3). An output track is provided for carrying said components to an output location.

公开(公告)号：EP1737023A2

公开(公告)日：2006-12-27

申请号：EP06018989.1

申请日：2002-03-20

Applicant: ASM Assembly Automation Ltd.

Inventor： Cheung, Yiu Ming ,  Cheung, Yu Sze ,  Tsai, Pei Wei

IPC: H01L21/00 ,  H01L21/68

CPC classification number: H01L21/67034 ,  H01L21/68707 ,  Y10T83/2187

Abstract: This invention relates to a method and apparatus for pick and place handling of electronic components (7) that have been formed on a common substrate. A cutting chuck (5) is provided for separating the component. A processing unit (3) is provided including a rinsing station, at least one drying station and an output station. A transfer platform (4) is provided for receiving components from said output station of said processing unit (3). An output track is provided for carrying said components to an output location.

Abstract translation: 本发明涉及一种已经形成在公共基板上的电子部件（7）的拾取处理方法和装置。 提供了用于分离组件的切割卡盘（5）。 提供处理单元（3），其包括漂洗站，至少一个干燥站和输出站。 提供传送平台（4），用于从所述处理单元（3）的所述输出站接收组件。 提供输出轨道用于将所述组件携带到输出位置。

公开(公告)号：EP1601005A2

公开(公告)日：2005-11-30

申请号：EP05076250.9

申请日：2005-05-27

Applicant: ASM Assembly Automation Ltd.

Inventor： Cheung, Yiu Ming ,  Chong, Chi Ming ,  Yiu, Ching Hong

IPC: H01L21/00

CPC classification number: H01L21/67132 ,  Y10T156/1179 ,  Y10T156/1983

Abstract: A peeling device is provided for detachment of a chip from an adhesive tape on which it is mounted. The device comprises a platform including a first surface and a raised contact surface set at a determinate height with respect to the first surface. The raised contact surface has a width that is smaller than a width of the chip for contacting the adhesive tape at a position of the chip. Further, an elevation device is projectable from the raised contact surface and movable with respect to the platform for lifting the chip away from the adhesive tape.

Abstract translation: 设置有剥离装置用于从安装其上的胶带剥离芯片。 该装置包括平台，该平台包括相对于第一表面设置在确定高度的第一表面和凸起的接触表面。 凸起的接触表面的宽度小于在芯片的位置处与胶带接触的芯片的宽度。 此外，升降装置可从凸起的接触表面突出并且相对于平台可移动，以将芯片从胶带上提起。

公开(公告)号：EP2450947A3

公开(公告)日：2017-05-10

申请号：EP11008850.7

申请日：2011-11-07

Applicant: ASM Assembly Automation Ltd.

Inventor： Lam, Kui Kam ,  Tang, Yen Hsi ,  Wong, Yiu Yan ,  Wan, Hok Man

IPC: H01L21/67 ,  H01L23/00

CPC classification number: H01L21/6715 ,  H01L24/27 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/00

Abstract: Adhesive is dispensed for conducting die bonding onto a substrate including rows of bond pads aligned along a first axis and columns of bond pads aligned along a second axis transverse to the first axis where target dispensing positions are located. A first dispensing head incorporating a first nozzle and a second dispensing head incorporating a second nozzle are provided and the substrate is fed along the first axis to a position where the first and second dispensing heads are located. Pattern recognition of a columnar section of the substrate comprising one or more consecutive columns of bond pads with an optical system may be conducted by moving the optical system along the second axis relative to the substrate. Thereafter, the first nozzle and the second nozzle are driven concurrently to dispense adhesive from the first and second nozzles onto the target dispensing positions in the same columnar section of the substrate.

Abstract translation: 分配粘合剂以便将管芯接合到衬底上，所述衬底包括沿着第一轴对准的成排的接合焊盘和沿着横切第一轴的第二轴对齐的接合焊盘列，目标分配位置位于所述第二轴上。 提供结合有第一喷嘴的第一分配头和结合有第二喷嘴的第二分配头，并且将基底沿着第一轴线供给到第一和第二分配头所处的位置。 通过使光学系统沿着第二轴线相对于衬底移动来进行包括具有光学系统的一个或多个连续的焊盘列的衬底的柱状部分的图案识别。 之后，同时驱动第一喷嘴和第二喷嘴以将粘合剂从第一和第二喷嘴分配到基板的相同柱状部分中的目标分配位置上。

公开(公告)号：EP2189235A1

公开(公告)日：2010-05-26

申请号：EP09014522.8

申请日：2009-11-20

Applicant: ASM Assembly Automation Ltd.

Inventor： Cheng, Chi Wah ,  Mak, Tim Wai, Tony ,  Ng, Hon Kam, Boris

IPC: B23K20/00 ,  B23K20/10 ,  H01L21/00 ,  H01L21/60

CPC classification number: B23K20/004 ,  B23K20/106 ,  B23K2201/42 ,  H01L21/67138 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/78313 ,  H01L2224/7855 ,  H01L2224/78822 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A bonding apparatus (10) for bonding a length of wire comprises a first module (14) which is drivable along a linear axis towards and away from a bonding point and a second module (16) slidably mounted to the first module (14). A wire cutter (36) is mounted to the first module (14) and a bonding tool (32) is mounted to the second module (16). A coupling mechanism is operative to lock the second module (16) in fixed relative position to the first module (14), and to unlock the second module (16) from its fixed relative position to the first module (14) so that the second module (16) is slidable relative to the first module (14) in directions parallel to the linear axis.

Abstract translation: 对于接合线的长度的接合装置（10）包括第一模块（14），所有这些是沿着线性轴线朝向和从接合点和第二模块（16）可滑动地安装到所述第一模块（14）远离驱动。 电线切割器（36）被安装到所述第一模块（14）和一个接合工具（32）被安装到所述第二模块（16）。 的连接机构可操作以在固定的相对位置的第二模块（16）锁定到所述第一模块（14），并从它的固定的相对位置的第二模块（16）解锁所述第一模块（14）象在第二 模块（16）是可相对滑动，以在方向上的第一模块（14）平行于所述线性轴。

公开(公告)号：EP2067561A1

公开(公告)日：2009-06-10

申请号：EP08020432.4

申请日：2008-11-25

Applicant: ASM Assembly Automation Ltd.

Inventor： Lam, Kui Kam ,  IP Chun Hung, Samuel

IPC: B23K1/00 ,  B23K3/06 ,  H05K3/34 ,  B23K101/40

CPC classification number: B23K1/0016 ,  B23K3/063 ,  B23K2201/40 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00

Abstract: A method for mounting a semiconductor chip onto a substrate (12) comprises the steps of positioning a solder dispenser (10) over the substrate (12) and passing a length of solder wire (24) through the solder dispenser (10) to the substrate (12). The feeding of the wire (24) to the substrate (12) is a feeding direction is controlled with a wire feeder. The solder dispenser (10) is moved relative to the substrate (12) with a positioning device (17) along at least one of two orthogonal axes that are substantially perpendicular to the feeding direction contemporaneously with feeding the solder wire (24) to the surface of the substrate (12) to dispense a line of molten solder onto the substrate (12). The semiconductor chip is then mounted onto the molten solder that has been dispensed onto the substrate.

Abstract translation: 一种用于安装一个半导体芯片到基片（12）的方法包括定位一个焊料滴涂器（10）在基板（12）和通过焊接导线（24）的长度通过焊料滴涂器（10）到所述基板的步骤 （12）。 导线（24）与基板（12）的进给是进给方向被控制与焊丝送进器。 焊料滴涂器（10）相对于沿两个正交轴中的至少一个基板（12）的定位装置（17）被移动确实是基本垂直于进给方向同时与焊料丝（24）进料至所述表面 基板（12）的，以分配到基底（12）的线的熔融焊料。 然后，将半导体芯片安装到熔融焊料也已被分配到基底上。

公开(公告)号：EP1489655B1

公开(公告)日：2008-07-09

申请号：EP04076592.7

申请日：2004-05-28

Applicant: ASM Assembly Automation Ltd.

Inventor： Cheung, Yiu Ming ,  Chong, Chi Ming

IPC: H01L21/58 ,  H01L21/68 ,  H05K13/04

CPC classification number: H01L24/83 ,  H01L21/67132 ,  H01L21/6838 ,  H01L24/29 ,  H01L24/743 ,  H01L2224/27334 ,  H01L2224/2919 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/8388 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  Y10T156/171 ,  Y10T156/1744 ,  H01L2924/00

Abstract: The invention provides a pick and place assembly for transferring a film of material. The assembly comprises a collet having a substantially convex contact surface for contacting the film, the collet including a vacuum suction device operative to generate a force to hold the film. The film may comprise a thermoplastic adhesive tape or B-stage thermoset epoxy coated film.

公开(公告)号：EP1596422A2

公开(公告)日：2005-11-16

申请号：EP05076097.4

申请日：2005-05-10

Applicant: ASM Assembly Automation Ltd.

Inventor： Cheung, Yiu Ming ,  Liu, Chou Kee, Peter ,  Yiu, Ching Hong ,  Chong, Chi Ming

IPC: H01L21/00

CPC classification number: H01L21/6838 ,  H01L21/67132 ,  H01L21/67144 ,  H01L2221/68322 ,  Y10S156/943 ,  Y10T29/4913 ,  Y10T29/49815 ,  Y10T29/53091 ,  Y10T29/53191 ,  Y10T29/53274 ,  Y10T156/1978 ,  Y10T156/1983

Abstract: An apparatus and method is provided for detaching a semiconductor chip from an adhesive tape on which it is mounted. The apparatus comprises a platform adapted to contact the adhesive tape at a position of the chip and a retaining force generator coupled to the platform for drawing the adhesive tape in a direction away from the chip. An elevation device is projectable from the platform that is movable both laterally across a surface of the platform and vertically with respect to the platform for elevating the chip. By moving the elevation device across a width of the chip while lifting the chip, controlled lifting of the chip and propagation of delamination between the chip and the adhesive tape may be achieved

Abstract translation: 提供了一种用于将半导体芯片从其上安装有的粘合带分离的装置和方法。 该装置包括适于在芯片的位置处接触粘合带的平台和联接到平台的保持力发生器，用于沿远离芯片的方向拉伸胶带。 升降装置可从平台投射，该平台可跨过平台的表面横向移动，并相对于平台垂直移动以升高芯片。 通过在升高芯片的同时将升降装置移动跨越芯片的宽度，可以实现芯片的控制提升和芯片与胶带之间的分层传播。

公开(公告)号：EP1244137A3

公开(公告)日：2005-02-02

申请号：EP02252010.0

申请日：2002-03-20

Applicant: ASM Assembly Automation Ltd.

Inventor： Cheung, Yiu Ming ,  Tsai, Pei Wei ,  Cheung, Yu Sze

IPC: H01L21/00 ,  H01L21/68

CPC classification number: H01L21/67034 ,  H01L21/68707

Abstract: This invention relates to a method and apparatus for pick and place handling of electronic components (7) that have been formed on a common substrate and then separated on a cutting chuck (5). A transferring means (4) is provided formed with openings for receiving separated components. The opening is defined by walls (1, 2) of which at least one (2) is movable so as to engage the components (7) and hold them in a fixed configuration and orientation while they are moved by a sliding motion through a processing unit (3) and onto a transfer platform for delivery to an output track.

公开(公告)号：EP1358950A1

公开(公告)日：2003-11-05

申请号：EP03252694.9

申请日：2003-04-29

Applicant: ASM Assembly Automation Ltd.

Inventor： Cheung, Yiu Ming, c/o ASM Assembly Autom. Ltd. ,  Sze, Chak Tong, c/o ASM Assembly Autom. Ltd.

IPC: B08B3/02

CPC classification number: H01L21/67092 ,  B08B3/024 ,  B08B2203/0288 ,  H01L21/67051

Abstract: The invention provides an ultrasonic cleaning module and a method for cleaning singulated electronic packages. The module comprises a cutting chuck (13) having a surface with a plurality of cutting recesses defined in it for enabling a cutting device to separate individual electronic packages from a substrate (1) having a plurality of electronic packages on the surface of the chuck. A pulsator nozzle (14) is supported above the chuck (13) and the separated electronic packages on the chuck such that the pulsator nozzle may emit fluid toward the packages. An ultrasonic generator (17) is associated with the nozzle (14) that is adapted to ultrasonically energize fluid that passes through the nozzle (14) to enhance cleaning of the packages.

Abstract translation: 本发明提供了一种用于清洁单个电子封装的超声波清洗模块和方法。 模块包括具有限定在其中的多个切割凹部的表面的切割卡盘（13），用于使得切割装置能够在卡盘的表面上具有多个电子封装的基板（1）分离各个电子封装。 波轮喷嘴（14）被支撑在卡盘（13）上方和卡盘上的分离的电子包装件上，使得波轮喷嘴可朝向包装件发射流体。 超声波发生器（17）与喷嘴（14）相关联，喷嘴（14）适于对通过喷嘴（14）的流体进行超声波激励以增强包装的清洁。