摘要:
To provide a method for producing conductive polymer film suitable for, for example, enhancing electrical conductivity of a PEDOT/PSS film capable of being manufactured quickly and at low cost with simple operation, enhancing electrical conductivity of PEDOT/PSS film significantly, and obtaining stable properties of the film. Means for Solving Problem A method of producing a conductive polymer film by drying out a solution 2 of conductive polymer and a dopant solution thereof to obtain a dried film A dried film 9 obtained from the solution 2 is treated with an organic solvent 11 and pressurized carbon dioxide through a reaction vessel 10.
摘要:
The invention provides a composition capable of providing a molded article that has excellent heat resistance and a small weight change against oxygen plasma exposure and fluorine plasma exposure during a semiconductor manufacturing step. The composition contains a fluorine-containing polymer and a hyperbranched polymer of a cage silsesquioxane with a specific structure.
摘要:
Provided is a composition comprising a fluorine-containing polymer and a silicon-containing compound, wherein the phosphorus content in the composition is 20 ppm or less.
摘要:
Provided are a crystallinity measurement device, a resin-containing material manufacturing device, a crystallinity measurement method, and a resin-containing material manufacturing method capable of calculating crystallinity easily and accurately even when materials other than crystalline thermoplastic resin are included in addition to crystalline thermoplastic resin. A crystallinity measurement device 10 includes a Raman spectroscopy unit 11 and an analysis unit 13. The Raman spectroscopy unit 11 acquires a Raman spectrum of resin-containing material 1 including crystalline thermoplastic resin. The analysis unit 13 calculates the crystallinity of the crystalline thermoplastic resin based on the intensity of a low-wavenumber spectrum that is a spectrum in a region of less than 600 cm -1 , in the Raman spectrum.
摘要:
The invention provides a composition capable of providing a molded article that has excellent heat resistance and a small weight change against both fluorine plasma exposure and oxygen plasma exposure during a semiconductor manufacturing step. The composition contains a fluorine-containing polymer and a cage silsesquioxane having a specific structure.