公开(公告)号：EP0510734A1

公开(公告)日：1992-10-28

申请号：EP92200372.8

申请日：1992-02-11

申请人： Akzo Nobel N.V.

发明人： Willemsen, Henricus Petrus ,  Dirix, Carolina Anna Maria Christina ,  Te Boekhorst, Theodorus Gerhardus Johannes

IPC分类号： H01L23/467 ,  H01L23/373 ,  H01L23/473

CPC分类号： H01L23/473 ,  F28F13/003 ,  H01L23/3733 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat exchanging member (1), more particularly for cooling a semiconductor module, having at a first and a second side, respectively, inlets and outlets, respectively, for a preferably gaseous heat exchanging medium, and having a heat exchanging component (2) made of a highly thermal conductive material, such as metal, in which channels disposed side by side and running from its inlet side to its outlet side have been formed, such that medium flowing in through the inlet channels is constrained to flow at an angle to the direction of entry via the heat exchanging material to the adjacent outlet channels, characterized in that the heat exchanging material has a structure which

a) is composed of randomly packed elementary parts, such as grains, fibres or scales, or
b) is composed of parts packed in an ordered fashion, such as gauze or plates, with the exception of individual wires.

In a preferred embodiment the heat exchanging material is made up of sintering bronze.

摘要翻译： 一种用于冷却半导体模块的热交换构件（1），其特征在于，分别在第一和第二侧分别具有用于优选气体热交换介质的入口和出口，并具有热交换部件（2） 由诸如金属的高导热材料制成，其中已经形成并排设置并从其入口侧到其出口侧的通道，使得流过入口通道的介质被限制为以与 或通过热交换材料进入相邻出口通道的方向，其特征在于，所述热交换材料具有以下结构：a）由随机填充的基本部分如颗粒，纤维或鳞片组成，或者b）由 零件以有序的方式包装，如纱布或板材，单独的电线除外。 在优选实施例中，热交换材料由烧结青铜制成。