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    Heat exchanging member, more particularly for cooling a semiconductor module
    2.
    发明公开
    Heat exchanging member, more particularly for cooling a semiconductor module 失效
    Wärmeaustauschkörper，insbesondere zumKühleneines Halbleitermodules。

    公开(公告)号：EP0510734A1

    公开(公告)日：1992-10-28

    申请号：EP92200372.8

    申请日：1992-02-11

    申请人： Akzo Nobel N.V.

    发明人： Willemsen, Henricus Petrus ,  Dirix, Carolina Anna Maria Christina ,  Te Boekhorst, Theodorus Gerhardus Johannes

    IPC分类号： H01L23/467 ,  H01L23/373 ,  H01L23/473

    CPC分类号： H01L23/473 ,  F28F13/003 ,  H01L23/3733 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat exchanging member (1), more particularly for cooling a semiconductor module, having at a first and a second side, respectively, inlets and outlets, respectively, for a preferably gaseous heat exchanging medium, and having a heat exchanging component (2) made of a highly thermal conductive material, such as metal, in which channels disposed side by side and running from its inlet side to its outlet side have been formed, such that medium flowing in through the inlet channels is constrained to flow at an angle to the direction of entry via the heat exchanging material to the adjacent outlet channels, characterized in that the heat exchanging material has a structure which

    a) is composed of randomly packed elementary parts, such as grains, fibres or scales, or
    b) is composed of parts packed in an ordered fashion, such as gauze or plates, with the exception of individual wires.

    In a preferred embodiment the heat exchanging material is made up of sintering bronze.

    摘要翻译： 一种用于冷却半导体模块的热交换构件（1），其特征在于，分别在第一和第二侧分别具有用于优选气体热交换介质的入口和出口，并具有热交换部件（2） 由诸如金属的高导热材料制成，其中已经形成并排设置并从其入口侧到其出口侧的通道，使得流过入口通道的介质被限制为以与 或通过热交换材料进入相邻出口通道的方向，其特征在于，所述热交换材料具有以下结构：a）由随机填充的基本部分如颗粒，纤维或鳞片组成，或者b）由 零件以有序的方式包装，如纱布或板材，单独的电线除外。 在优选实施例中，热交换材料由烧结青铜制成。

    Semiconductor module
    3.
    发明公开
    Semiconductor module 失效
    Halbleitermodul。

    公开(公告)号：EP0376365A1

    公开(公告)日：1990-07-04

    申请号：EP89203004.0

    申请日：1989-11-27

    申请人： Akzo Nobel N.V.

    发明人： van Andel, Eleonoor ,  Dirix, Carolina Anna Maria Christina

    IPC分类号： H01L23/367 ,  H01L23/373

    CPC分类号： H01L23/467 ,  H01L23/3677 ,  H01L23/3732 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Multichip module with provisions for improved cooling and interconnection so as to allow for maximum chip packaging density. Air cooling is brought about by a zig-zag arrangement of groups (6) of thin wire cooling fins (5) mounted on a heat sink layer (3) also providing the necessary mechanical rigidity of the module.
    Said interconnection means comprises a layer (22) containing diamond grains (23) having high electrical insulating and high thermal conductive properties.

    摘要翻译： 多芯片模块具有改进冷却和互连的规定，从而允许最大的芯片封装密度。 空气冷却是通过安装在散热层（3）上的细线散热片（5）的组（6）的锯齿形布置而产生的，其也提供模块的必要的机械刚度。 所述互连装置包括含有具有高电绝缘和高导热性能的金刚石晶粒（23）的层（22）。