公开(公告)号：EP2263429A2

公开(公告)日：2010-12-22

申请号：EP09719200.9

申请日：2009-03-02

Applicant: Alcatel Lucent

Inventor： OPREA, Dorin Ionel ,  DRIEDIGER, Steve

IPC: H05K1/02

CPC classification number: H05K1/0218 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09618 ,  H05K2201/0969 ,  H05K2201/10121

Abstract: The present invention is a specially designed PCB (11) thatallows XFP compliant transceiver modules and EMI gaskets to be used in a manner specified in the XFP standard and results in an integrated solution that is compliant with the XFP standard. Various geometric features are incorporated into the PCB to achieve improvements that in combination result in an integrated solution meeting the XFP standard. Some of these improved features include: specific thickness of prepreg and other layering of the PCB, specific spacing, dimensions and weights for certain components of the PCB, an opening on the first layer XFP cage ground shield (20) connecting to the EMI gasket, guard ground traces (27) in the second layer (25) surrounding the differential pair signal traces (26), openings (32) in the copper of the third layer (31) beneath the XFP cage ground shield and XFP connector pads (12), and ground vias (14) at the XFP connector and PHY connector pads (15).