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    VERFAHREN ZUR HERSTELLUNG EINER DURCHKONTAKTIERUNG BEI EINER MEHRLAGEN-LEITERPLATTE
    1.
    发明公开
    VERFAHREN ZUR HERSTELLUNG EINER DURCHKONTAKTIERUNG BEI EINER MEHRLAGEN-LEITERPLATTE 审中-公开
    用于在多层PCB上产生接触的方法

    公开(公告)号：EP3257335A1

    公开(公告)日：2017-12-20

    申请号：EP16706131.6

    申请日：2016-02-06

    Applicant: Häusermann GmbH

    Inventor： HACKL, Johann ,  REDL, Norbert ,  HÖRTH, Stefan

    IPC: H05K1/02 ,  H05K3/42 ,  H05K3/40

    CPC classification number: H05K3/429 ,  H05K1/0204 ,  H05K1/0207 ,  H05K3/4046 ,  H05K2201/09581 ,  H05K2201/0969 ,  H05K2201/09809 ,  H05K2201/10416

    Abstract: Method for producing a plated-through hole between conductor tracks which are arranged at the top and at the bottom in a multilayer printed circuit board which is composed of a printed circuit board material and comprises at least one copper profile which is embedded in the composite of the multilayer printed circuit board, wherein the plated-through hole is produced by the following method steps: producing a first bore with a first bore diameter through the multilayer printed circuit board by drilling through the top and the bottom conductor track and the embedded copper profile; filling the first bore with an insulating filling material; producing a second bore coaxially in relation to the first bore with a second, smaller bore diameter than the bore diameter of the first bore; lining the bore wall of the second bore with an electrically conductive material and in this way making electrical contact with the top and bottom conductor tracks.

    HIGH-FREQUENCY SIGNAL LINE AND ELECTRONIC DEVICE
    2.
    发明授权
    HIGH-FREQUENCY SIGNAL LINE AND ELECTRONIC DEVICE 有权
    高频信号线和电子设备

    公开(公告)号：EP2590485B1

    公开(公告)日：2017-07-19

    申请号：EP11845031.1

    申请日：2011-12-02

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： KATO Noboru ,  TAGO Shigeru ,  SASAKI Jun ,  KURITA Junichi ,  SASAKI Satoshi

    IPC: H05K1/02 ,  H01P3/08 ,  H01P3/12 ,  H05K1/11 ,  H01P1/203 ,  H05K1/03

    CPC classification number: H01P3/085 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01P1/20363 ,  H01P3/003 ,  H01P3/026 ,  H01P3/08 ,  H01P3/10 ,  H01P3/121 ,  H03H7/38 ,  H04B15/00 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/0242 ,  H05K1/025 ,  H05K1/0253 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/113 ,  H05K2201/09618 ,  H05K2201/0969 ,  H05K2201/09727

    Abstract: To provide an easily bendable high-frequency signal line and an electronic apparatus which are capable of suppressing the deviation of the characteristic impedance of a signal line from a predetermined characteristic impedance. A dielectric body 12 is obtained by laminating a protection layer 14 and dielectric sheets 18a to 18c, and has a surface and an undersurface. A signal line 20 is a linear conductor disposed in the dielectric body 12. A ground conductor 22 is disposed in the dielectric body 12, faces the signal line 20 via the dielectric sheet 18a, and continuously extends along the signal line 20. A ground conductor 24 is disposed in the dielectric body 12, faces the ground conductor 22 via the signal line 20 sandwiched therebetween, and has a plurality of openings 30 arranged along the signal line 20. The surface of the dielectric body 12 on the side of the ground conductor 22 with respect to the signal line 20 is in contact with a battery pack 206.

    Abstract translation: 提供一种能够容易地弯曲的高频信号线和能够抑制信号线的特性阻抗与预定特性阻抗的偏差的电子设备。 介电体12通过层压保护层14和介电片18a至18c而获得，并且具有表面和下表面。 信号线20是布置在电介质体12中的线状导体。接地导体22布置在电介质体12中，经由电介质片18a面对信号线20并且沿着信号线20连续延伸。接地导体 24被布置在电介质体12中，经由夹在其间的信号线20面对接地导体22，并且具有沿信号线20布置的多个开口30.电介质体12的接地导体侧上的表面 22相对于信号线20与电池组206接触。

    WIRING BOARD AND ELECTRONIC DEVICE
    5.
    发明公开
    WIRING BOARD AND ELECTRONIC DEVICE 审中-公开
    LEITERPLATTE和ELEKTRONISCHE VORRICHTUNG

    公开(公告)号：EP3062590A4

    公开(公告)日：2017-05-24

    申请号：EP14855585

    申请日：2014-10-23

    Applicant: KYOCERA CORP

    Inventor： MURAKAMI KENSAKU

    IPC: H05K1/11 ,  H01L23/13

    CPC classification number: H01L23/49811 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/49838 ,  H01L24/05 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/181 ,  H05K3/403 ,  H05K3/4629 ,  H05K2201/09036 ,  H05K2201/09145 ,  H05K2201/0969 ,  H01L2924/00012

    Abstract: This wiring board (1) is provided with: an insulating base (11) that has a lateral surface having an incision part (12); an electrode (13) that is provided on the inner surface of the incision part (12); and a wiring conductor (15) that is provided within the insulating base (11) or on the surface of the insulating base (11) and is electrically connected to the electrode (13) via a connection conductor (14). The width of the incision part (12) is larger than the depth thereof, and the connection conductor (14) is connected to the electrode (13) at an end of the incision part (12) in the width direction. An electronic device according to the present invention is provided with this wiring board (1) and an electronic component (2) that is mounted to the upper surface of this wiring board (1).

    Abstract translation: 该布线基板1具有：绝缘性基体11，其具有具有切口部12的侧面; 设置在所述切口部（12）的内表面上的电极（13）; 以及设置在绝缘基体（11）内或绝缘基体（11）的表面上并经由连接导体（14）与电极（13）电连接的布线导体（15）。 切口部12的宽度大于其深度，连接导体14在切口部12的宽度方向的一端与电极13连接。 本发明的电子设备具备该布线基板（1）和安装于该布线基板（1）的上表面的电子部件（2）。

    LIGHT SOURCE MODULE, FABRICATION METHOD THEREFOR, AND LIGHTING DEVICE INCLUDING THE SAME
    6.
    发明公开
    LIGHT SOURCE MODULE, FABRICATION METHOD THEREFOR, AND LIGHTING DEVICE INCLUDING THE SAME 审中-公开
    光源模块及其制造方法以及包括该光源模块的照明设备

    公开(公告)号：EP3116038A1

    公开(公告)日：2017-01-11

    申请号：EP16163631.1

    申请日：2016-04-04

    Applicant: LG Electronics Inc.

    Inventor： HONG, Jaepyo ,  CHANG, Hyeuk ,  JUN, Sumin ,  KIM, Jaechan ,  KIM, Injoong

    IPC: H01L33/62 ,  H01L33/64

    CPC classification number: F21V29/74 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H05K1/053 ,  H05K3/38 ,  H05K2201/0376 ,  H05K2201/0969 ,  H05K2201/10106 ,  H05K2201/2072 ,  H05K2203/107 ,  H05K2203/1355

    Abstract: A light source module includes at least one light source emitting light, and a body supporting the light source. The body includes a heat sink absorbing heat from the light source and dissipating the heat to the outside, an insulating layer having electrical insulating properties, the insulating layer being provided on at least one surface of the heat sink, and a conductive layer provided on the insulating layer to enable electric current to flow therein. The conductive layer includes an electrically conductive layer providing a path region in which electric current is applied to the light source, and a heat dissipation conductive layer diffusing generated by the light source. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, and prevention of heat dissipation. Furthermore, it is possible to obtain various effects that can be understood through configurations described in embodiments.

    Abstract translation: 光源模块包括发射光的至少一个光源和支撑光源的主体。 该主体包括吸收来自光源的热量并将热量散发到外部的散热器，具有电绝缘性质的绝缘层，绝缘层设置在散热器的至少一个表面上，以及设置在散热器上的导电层 绝缘层以使电流能够在其中流动。 导电层包括提供电流施加到光源的路径区域和由光源产生的散热导电层扩散的导电层。 因此，可以获得诸如快速制造工艺，低成本制造成本，便于批量生产，提高产品成品率以及防止散热的效果。 此外，可以通过实施例中描述的配置来获得可以理解的各种效果。

    MODULE
    10.
    发明公开
    MODULE 审中-公开

    公开(公告)号：EP2916626A1

    公开(公告)日：2015-09-09

    申请号：EP13851712.3

    申请日：2013-10-01

    Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI

    Inventor： OZAKI, Kiminori ,  KOIKE, Yasuhiro ,  ASANO, Hiroaki ,  SHIMADU, Hitoshi ,  KAWAGUCHI, Shigeki ,  ASAI, Tomoaki

    IPC: H05K1/18 ,  H05K1/14 ,  H05K7/20

    CPC classification number: H05K1/144 ,  H01F27/2804 ,  H01F2027/2809 ,  H01R12/716 ,  H05K1/0201 ,  H05K1/181 ,  H05K3/303 ,  H05K3/368 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/0969 ,  H05K2201/10189 ,  H05K2201/2072 ,  H05K2203/167 ,  Y02P70/613

    Abstract: This module includes an insulating substrate having a first surface and a second surface, which are positioned on opposite sides to each other, a first metal layer that is provided on the first surface of the insulating substrate and include a metal plate, a second metal layer provided on the second surface of the insulating substrate, a first circuit board including the insulating substrate, the first metal layer, and the second metal layer, an electronic component joined to the first metal layer, and a positioning portion, which is located on the joint surface between the first metal layer and the electronic component, at which the first metal layer and the electronic component are engaged with each other through a recess-projection relationship. The insulating substrate is located between the second metal layer and a part of the first metal layer where the positioning portion is located.

    Abstract translation: 该模块包括：绝缘基板，具有位于彼此相对侧的第一表面和第二表面;第一金属层，设置在绝缘基板的第一表面上并且包括金属板;第二金属层 设置在所述绝缘基板的所述第二表面上的第一电路板，所述第一电路板包括所述绝缘基板，所述第一金属层和所述第二金属层;电子部件，所述电子部件接合到所述第一金属层;以及定位部分， 第一金属层和电子元件之间的接合表面，其中第一金属层和电子元件通过凹凸投影关系彼此接合。 绝缘基板位于第二金属层与定位部所在的第一金属层的一部分之间。

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