Abstract:
An electronic device according to one embodiment includes a wiring substrate, the wiring substrate having a first wiring connected to a first external terminal and a second wiring connected to a second external terminal and extending along the first wiring. Additionally, the above electronic device has a semiconductor device mounted on the above wiring substrate and electrically connected to each of the first and second wirings. Further, the above electronic device has a capacitor mounted on the above wiring substrate and electrically connected to the semiconductor device via each of the above first and second wirings. Furthermore, a distance between the above semiconductor device and capacitor is shorter than a distance between each of the above first and second external terminals and the above capacitor.
Abstract:
A printed wiring board including at least a first substrate (11) is provided. The first substrate (11) is formed with pads (2) and a ground layer (3) at any one of main surfaces of the first substrate (11). The pads (2) are to be electrically connected to a connector as another component. The ground layer (3) has inner edges at locations separated from outer edges of the pads (2) with a predetermined distance and is to be grounded to a ground contact. Grooves (4) are formed between the pads (2) and the ground layer (3).
Abstract:
Provided are a wiring structure in which a crosstalk noise between wiring patterns can be reduced without making an area occupied by a wiring region significantly widened, and a printed wiring substrate to which the wiring structure is applied. A wiring structure (1) includes a plurality of wiring patterns (11, 12, 13, 14). An interval (Wp) between the adjacent wiring patterns is shortened in the parallel wiring portions (PI, P2, P3). In wiring path change portions (D1, D2), the wiring patterns (11, 12, 13, 14) are extended at a slope with respect to an X direction, and an interval (Wd) between the adjacent wiring patterns is more widened than the interval (Wp). A crosstalk noise can be reduced by widening the interval (Wd) between the wiring patterns using the wiring path change portions (D1, D2) without making an area occupied by a wiring region extremely increased.
Abstract:
In order to reduce crosstalk effects, cables that carry contaminating signals can be routed using physically adjacent cables in pairs that carry replica signals of opposite polarity. Keeping the cables in close proximity will reduce loop area and will cause the magnetic fields induced by the wires carrying the paired signals to cancel. Accordingly, the crosstalk induced both by the differential and common-mode components of these two signals on any other medium or device cancel each other.
Abstract:
What is described is an electronic device (1) comprising a power component (3) and a printed circuit board (2) . The power component comprises a main body (30) and a lead (31) . The printed circuit board comprises at least two conductive layers (21) parallel to a plane xy, a mounting element (23) and a conductor (24) . The mounting element and the conductor respectively comprise first (23b) and second (24b) conductive tubes, which elongate through a thickness of the printed circuit board along a direction z substantially perpendicular to the plane xy. The main body of the power component is fixed to the mounting element, while the lead thereof is fixed to the conductor.
Abstract:
A circuit board comprising: a resin; first and second fiberglass fibers; and first and second signal line traces capable of transmitting electrical signals, wherein: a ratio between fiberglass and resin material near the first signal line trace is similar to a ratio between fiberglass and resin material near the second signal line trace.
Abstract:
A circuit board comprising: a resin; first and second fiberglass fibers; and first and second signal line traces capable of transmitting electrical signals, wherein: the first and second fiberglass fibers diagonally cross near the first and second signal line traces.
Abstract:
The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a crosstalk compensation arrangement for reducing crosstalk at the jack. The circuit board also includes arrangements that reduce return loss at the jack.