公开(公告)号：EP2847789B1

公开(公告)日：2017-12-27

申请号：EP13788027.4

申请日：2013-05-01

申请人： Apple Inc.

发明人： BIBL, Andreas ,  HIGGINSON, John A. ,  HU, Hsin-Hua

IPC分类号： B81C99/00 ,  H01L21/677 ,  H01L21/50 ,  B65G49/07 ,  H01L21/683 ,  H01L21/60 ,  H01L21/67 ,  H01L25/075 ,  H01L23/00

CPC分类号： B41J2/385 ,  B25J15/0052 ,  B25J15/0085 ,  B41J2/39 ,  B81B2201/038 ,  B81C99/002 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0079 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/29036 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/7565 ,  H01L2224/7598 ,  H01L2224/83815 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00014

摘要： A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.

公开(公告)号：EP2780953B1

公开(公告)日：2020-06-24

申请号：EP12849007.5

申请日：2012-11-08

申请人： Apple Inc.

发明人： BIBL, Andreas ,  HIGGINSON, John A. ,  LAW, Hung-Fai Stephen ,  HU, Hsin-Hua

IPC分类号： H01L33/36 ,  H01L33/00 ,  H01L25/075 ,  H01L33/20