公开(公告)号：EP2477223B1

公开(公告)日：2018-12-12

申请号：EP11195847.6

申请日：2011-12-28

申请人： Fuji Electric Co., Ltd.

发明人： Katsuki, Takashi

IPC分类号： H01L23/495 ,  H01L23/31 ,  F02P3/045

CPC分类号： H01L24/92 ,  F02P3/0453 ,  H01L23/3107 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49582 ,  H01L23/49589 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/29101 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48755 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2224/85455 ,  H01L2224/92 ,  H01L2224/922 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19106 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85

摘要： A method of manufacturing a semiconductor apparatus according to the invention includes the steps of: coating solder 31 on an predetermined area in the upper surface of lead frame 30; mounting chip 32 on solder 31; melting solder 31 with hot plate 33 for bonding chip 32 to lead frame 30; wiring with bonding wires 34; turning lead frame 30 upside down; placing lead frame 30 turned upside down on heating cradle 35; coating solder 36, the melting point of which is lower than the solder 31 melting point; mounting electronic part 37 on solder 36; and melting solder 36 with heating cradle 35 for bonding electronic part 37 to lead frame 30. The bonding with solder 36 is conducted at a high ambient temperature. The semiconductor apparatus and the manufacturing method thereof facilitate mounting semiconductor devices and electronic parts on both surfaces of a lead frame divided to form wiring circuits without through complicated manufacturing steps.

公开(公告)号：EP3007226B1

公开(公告)日：2018-12-05

申请号：EP15188280.0

申请日：2015-10-05

申请人： Epistar Corporation

发明人： He, Guan-Ru ,  Yeh, Jui-Hung ,  Huang, Kevin T. Y. ,  Chen, Chih-Chung

IPC分类号： H01L25/075

CPC分类号： H01L33/62 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/40 ,  H01L24/48 ,  H01L24/64 ,  H01L24/66 ,  H01L24/69 ,  H01L24/73 ,  H01L24/80 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/89 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/36 ,  H01L33/486 ,  H01L2221/68304 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/29194 ,  H01L2224/32 ,  H01L2224/40245 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/64 ,  H01L2224/73251 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/8085 ,  H01L2224/80862 ,  H01L2224/80874 ,  H01L2224/84439 ,  H01L2224/84444 ,  H01L2224/84447 ,  H01L2224/84455 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/89 ,  H01L2224/9222 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2933/0016 ,  H01L2933/0066 ,  H01L2224/45099 ,  H01L2224/69 ,  H01L2224/83 ,  H01L2224/08 ,  H01L2224/85 ,  H01L2224/84 ,  H01L2924/00012 ,  H01L2224/37099

摘要： LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.

公开(公告)号：EP2705531B1

公开(公告)日：2018-11-14

申请号：EP12718241.8

申请日：2012-05-04

申请人： 3D Plus

发明人： VAL, Christian

IPC分类号： H01L23/538 ,  H01L21/60 ,  H01L23/48 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01G4/224 ,  B05D1/02 ,  B05D5/10 ,  C23C14/08 ,  C23C16/01 ,  C23C16/402 ,  H01L21/568 ,  H01L23/3121 ,  H01L24/18 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L2221/68368 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/181 ,  H05K1/115 ,  H05K1/181 ,  H05K3/284 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/82

公开(公告)号：EP2630660B1

公开(公告)日：2018-10-03

申请号：EP11788252.2

申请日：2011-10-20

申请人： Raytheon Company

发明人： GOOCH, Roland, W. ,  KOCIAN, Thomas, A. ,  BLACK, Stephen, H. ,  DIEP, Buu

IPC分类号： H01L27/146 ,  H01L23/10 ,  G01J5/04 ,  B81B7/00

CPC分类号： H01L27/14618 ,  B81B7/0077 ,  G01J5/045 ,  H01L23/10 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L27/14683 ,  H01L2224/04026 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05187 ,  H01L2224/05563 ,  H01L2224/05582 ,  H01L2224/05644 ,  H01L2224/05669 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/291 ,  H01L2224/29144 ,  H01L2224/32225 ,  H01L2224/83815 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/04941 ,  H01L2924/05341 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2924/0105

摘要： In accordance with particular embodiments, a method for packaging an incident radiation detector includes depositing an opaque solder resistant material on a first surface of a transparent lid substrate configured to cover at least one detector. The method also includes forming at least one cavity in the lid substrate. The method further includes forming a first portion of at least one hermetic seal ring on the opaque solder resistant material. The first portion of each hermetic seal ring surrounds a perimeter of a corresponding cavity in the lid substrate. The method also includes aligning the first portion of the at least one hermetic seal ring with a second portion of the at least one hermetic seal ring. The method additionally includes bonding the first portion of the at least one hermetic seal ring with the second portion of the at least one hermetic seal ring with solder.

公开(公告)号：EP3312877A3

公开(公告)日：2018-08-08

申请号：EP17197418.1

申请日：2017-10-19

申请人： Palo Alto Research Center, Incorporated

发明人： KRUSOR, Brent S. ,  MEI, Ping

IPC分类号： H01L21/98 ,  H01L21/67 ,  H01L21/60

CPC分类号： H01L24/97 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/27003 ,  H01L2224/2731 ,  H01L2224/27334 ,  H01L2224/2783 ,  H01L2224/27848 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/75251 ,  H01L2224/75312 ,  H01L2224/75314 ,  H01L2224/75315 ,  H01L2224/75316 ,  H01L2224/75318 ,  H01L2224/7532 ,  H01L2224/75824 ,  H01L2224/7598 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/95091 ,  H01L2224/95121 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00012

摘要： A method for substantially simultaneously bonding multiple semiconductor chips (116A, 116B) of different height profiles on a flexible substrate (100) comprises:
providing a flexible substrate (100) with printed conductive traces (102);
placing an anisotropic conductive adhesive (ACA) (104) over at least portions of the printed conductive traces (102) of the flexible substrate (100), the ACA (104) including a thermosetting adhesive and conductive spherical elements;
tacking the ACA (104) in place by application of heat and pressure for a predetermined time;
positioning and orientating a first side of each of multiple semiconductor chips (116A, 116B) to align with selected locations of the printed conductive traces (102) of the flexible substrate (100) lying under the ACA (104), wherein at least one of the multiple semiconductor chips (116A, 116B) has a height profile different from at least one other one of the multiple semiconductor chips (116A, 116B);
curing the thermosetting adhesive of the ACA (104) by applying heat and pressure, wherein the pressure is applied, with a deformable bonding head (206), an expandable elastic membrane (304) or a plurality of movable pins (402) held in a support structure (e.g., a pin screen) (404), to a second side of each of the multiple semiconductor chips (116A, 116B), the applying of the pressure pressing and deforming the conductive spherical elements of the ACA (104), wherein electrical contact is made between the semiconductor chips (116A, 116B) and at least portions of the printed conductive traces (102).
A corresponding semiconductor chip bonding device (200, 300, 400) is also disclosed.

公开(公告)号：EP3221888A4

公开(公告)日：2018-07-11

申请号：EP15860345

申请日：2015-11-19

申请人： MICRON TECHNOLOGY INC

发明人： YE SENG KIM ,  NG HONG WAN

IPC分类号： H01L25/065 ,  G06F13/16 ,  H01L21/60 ,  H01L21/98 ,  H01L23/31 ,  H01L23/48 ,  H01L23/49 ,  H01L25/18

CPC分类号： H01L25/0657 ,  G06F13/1668 ,  G06F13/1694 ,  H01L22/14 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/04 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/03 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/13083 ,  H01L2224/1319 ,  H01L2224/16225 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/2939 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/81855 ,  H01L2224/81856 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/83874 ,  H01L2224/92227 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1033 ,  H01L2924/14 ,  H01L2924/143 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/15184 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/83101 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2224/83

摘要： Memory devices with controllers under stacks of memory packages and associated systems and methods are disclosed herein. In one embodiment, a memory device is configured to couple to a host and can include a substrate, a stack of memory packages, and a controller positioned between the stack and the substrate. The controller can manage data stored by the memory packages based on commands from the host.

公开(公告)号：EP3164886A4

公开(公告)日：2018-06-20

申请号：EP14870661

申请日：2014-07-02

申请人： INTEL CORP

发明人： DESHPANDE NITIN ,  MAHAJAN RAVI V

IPC分类号： H01L23/12 ,  H01L21/52 ,  H01L21/60 ,  H01L21/98 ,  H01L23/13 ,  H01L25/065 ,  H01L25/16 ,  H01L29/06

CPC分类号： H01L25/0657 ,  H01L21/52 ,  H01L21/76898 ,  H01L23/04 ,  H01L23/13 ,  H01L24/94 ,  H01L24/97 ,  H01L25/50 ,  H01L28/00 ,  H01L29/0657 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2225/06555 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/15153 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/16251 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83

摘要： An electronic assembly that includes a first electronic device. The first electronic device includes a cavity that extends into a back side of the first electronic device. The electronic assembly further includes a second electronic device. The second electronic device is mounted to the first electronic device within the cavity in the first electronic device. In some example forms of the electronic assembly, the first electronic device and the second electronic device are each a die. It should be noted that other forms of the electronic assembly are contemplated where only one of the first electronic device and the second electronic device is a die. In some forms of the electronic assembly, the second electronic device is soldered to the first electronic device.

公开(公告)号：EP3333883A1

公开(公告)日：2018-06-13

申请号：EP17204936.3

申请日：2017-12-01

申请人： IMEC vzw ,  Universiteit Gent

发明人： OP DE BEECK, Mrs. Maria ,  VANDECASTEELE, Mr. Bjorn

IPC分类号： H01L21/60 ,  H01L21/58 ,  H01L21/78 ,  H01L23/544

CPC分类号： H01L24/96 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/25 ,  H01L24/81 ,  H01L24/83 ,  H01L24/93 ,  H01L24/97 ,  H01L29/0657 ,  H01L2221/68354 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/25175 ,  H01L2224/29036 ,  H01L2224/2919 ,  H01L2224/30166 ,  H01L2224/81132 ,  H01L2224/818 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/8338 ,  H01L2224/83855 ,  H01L2224/93 ,  H01L2224/95001 ,  H01L2224/95121 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/10156 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/1515 ,  H01L2924/00014 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2224/81

摘要： A method is disclosed for placing on a carrier substrate (7) a semiconductor device (3), the method comprises providing a semiconductor substrate (1) comprising a rectangular shaped assist chip (2) which comprises at least one semiconductor device (3) surrounded by a metal-free border (6), dicing the semiconductor substrate (1) to singulate the rectangular shaped assist chip (2), providing a carrier substrate (7) having adhesive (10) thereon, transferring to and placing on the carrier substrate (7) the rectangular shaped assist chip (2), thereby contacting the adhesive with the assist chip (2) at least at the location of the semiconductor device (3), and singulating the semiconductor device (3), while remaining attached to the carrier substrate (7) by the adhesive (10), by removing the part of rectangular shaped assist chip (2) other than the semiconductor device (3).

公开(公告)号：EP3160734A4

公开(公告)日：2018-03-14

申请号：EP15814784

申请日：2015-06-29

申请人： IMMUNOLIGHT LLC

发明人： FATHI ZAKARYAE ,  BOURKE FREDERIC A JR ,  WALDER HAROLD

IPC分类号： C09J5/02 ,  B32B5/02 ,  B32B7/06 ,  B32B7/12 ,  B32B15/08 ,  B32B25/10 ,  B32B25/12 ,  B32B25/14 ,  C09J4/00 ,  C09J7/00 ,  C09J107/00 ,  C09J121/00

CPC分类号： B32B7/12 ,  B32B5/024 ,  B32B7/06 ,  B32B15/08 ,  B32B25/10 ,  B32B25/12 ,  B32B25/14 ,  B32B2307/748 ,  B32B2437/00 ,  B32B2457/14 ,  C08F2/48 ,  C08K3/00 ,  C09J4/00 ,  C09J5/02 ,  C09J7/10 ,  C09J107/00 ,  C09J121/00 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/31 ,  C09J2400/22 ,  C09J2407/00 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/0383 ,  H01L2224/03831 ,  H01L2224/04026 ,  H01L2224/05791 ,  H01L2224/05887 ,  H01L2224/2711 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/27416 ,  H01L2224/27418 ,  H01L2224/27436 ,  H01L2224/27618 ,  H01L2224/27622 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/83009 ,  H01L2224/83591 ,  H01L2224/83687 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83868 ,  H01L2224/83874 ,  H01L2224/94 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/0781

摘要： A method of and system for adhesive bonding. The method and system a) treat a surface of an element to be bonded to provide an adherent structure including one or more rubber compounds on the surface; b) place a polymerizable adhesive composition, including at least one photoinitiator and at least one energy converting material, in contact with the adherent structure and two or more components to be bonded to form an assembly, c) irradiated the assembly with radiation at a first wavelength, capable of conversion by the at least one energy converting material, to a second wavelength capable of activating the at least one photoinitiator to produce from the polymerizable adhesive composition a cured adhesive composition; and d) adhesively join the two or more components by way of the adherent structure and the cured adhesive composition.

公开(公告)号：EP3276652A2

公开(公告)日：2018-01-31

申请号：EP17182111.9

申请日：2016-03-23

申请人： Heraeus Deutschland GmbH & Co. KG

发明人： Schäfer, Michael ,  Schmitt, Wolfgang ,  Hinrich, Andreas ,  Barrera-Marin, Isabel

IPC分类号： H01L21/58 ,  H01L21/60 ,  H01L23/373 ,  H01L23/495 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H01L21/683

CPC分类号： H01L24/83 ,  H01L21/6836 ,  H01L23/3735 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/95 ,  H01L24/97 ,  H01L2221/68368 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/27418 ,  H01L2224/27848 ,  H01L2224/29007 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/75272 ,  H01L2224/75745 ,  H01L2224/83001 ,  H01L2224/83007 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83201 ,  H01L2224/8321 ,  H01L2224/83815 ,  H01L2224/8384 ,  H01L2224/83907 ,  H01L2224/95 ,  H01L2224/97 ,  H05K3/303 ,  H05K3/32 ,  H05K3/34 ,  H05K2203/1131 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/00012 ,  H01L2224/83

摘要： Die Erfindung betrifft ein Verfahren zum Herstellen einer Substratanordnung (10, 10') zur Verbindung mit einem Elektronikbauteil (50; 51), umfassend die Schritte:
- Bereitstellen eines Substrates (20), insbesondere eines DCB-Substrats, eines PCB-Substrats oder eines Leadframes, mit einer ersten Seite (22) und einer zweiten Seite (23),
- abschnittsweises Aufbringen eines Vorfixiermittels (30) auf die erste Seite (22) des Substrates (20),
wobei das Vorfixiermittel (30) ein Klebemittel ist, das 20 - 45 Gew.-% thermoplastisches Polymer, 40 - 70 Gew.-% organisches Lösemittel, 10 - 25 Gew.-% anorganische Füllstoffpartikel und 0 - 0,5 Gew.-% weitere Additive aufweist.
Die Erfindung betrifft auch eine entsprechende Substratanordnung (10, 10') sowie ein entsprechendes Verfahren zum Verbinden (Versintern, Verlöten, Verpressen) eines Elektronikbauteils (50, 51) mit der Substratanordnung (10, 10').
Durch die erfindungsgemäßen Maßnahmen wird beim Transport vom Ort des Bestückens der Substratanordnung (10, 10') mit dem Elektronikbauteil (50, 51') zum Ort des Verbindens eine ausreichende Transportfestigkeit erzeugt.
Das Vorfixiermittel (30) kann auch alternativ oder zusätzlich auf die erste Seite (52) des Elektronikbauteils (50, 51) abschnittsweise aufgebracht werden.
Auf die Substratanordnung (10, 10') und/oder auf das Elektronikbauteil (50, 51) kann vor dem Aufbringen des Vorfixiermittels (30) ein Kontaktierungsmaterial (25) aufgebracht werden. Das Vorfixiermittel (30) kann zumindest abschnittsweise seitlich des Kontaktierungsmaterials (25) aufgebracht werden, derart, dass das Vorfixiermittel (30) dicker als das Kontaktierungsmaterial (25) ist.
Das Vorfixiermittel (30) wird während des Verbindens oder nach dem Verbinden zumindest teilweise entfernt, insbesondere abgebrannt und/oder abgeschmolzen.
Nach dem Verbinden ist auf der ersten Seite (22) des Substrates (20) und/oder auf der dem Substrat (20) zugewandten ersten Seite (52) des Elektronikbauteils (50, 51) abschnittsweise ein Rest (31) des Vorfixiermittels (30), insbesondere die anorganischen Füllstoffpartikel, ausgebildet.