公开(公告)号：EP1361023A2

公开(公告)日：2003-11-12

申请号：EP03252801.0

申请日：2003-05-02

申请人： Applied Materials, Inc.

发明人： Hu, Yongqi ,  Wang, Yan ,  Duboust, Alain ,  Liu, Feng Q. ,  Mavliev, Rashid ,  Chen, Liang-Yuh ,  Morad, Ratson ,  Somekh, Sasson

IPC分类号： B24D13/14 ,  B24B37/04

CPC分类号： B24B37/16 ,  B23H5/08 ,  B24B37/046 ,  B24B37/14 ,  Y10S977/902

摘要： An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article (205) having a body comprising at least a portion (310) of fibers coated with a conductive material, conductive fillers, or combinations thereof, and adapted to polish the substrate. In another aspect, a polishing article includes a body having a surface adapted to polish the substrate and at least one conductive element embedded in the polishing surface, the conductive element comprising dielectric or conductive fibers coated with a conductive material, conductive fillers, or combinations thereof. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. A plurality of perforations (546) and a plurality of grooves (542) may be formed in the articles to facilitate flow of material through and around the polishing article.

摘要翻译： 提供了一种用于平坦化基板表面的制造方法和装置。 一方面，提供了一种制造用品，用于抛光包括抛光制品（205）的基材，所述抛光制品（205）具有主体，该主体包括涂覆有导电材料的纤维的至少一部分（310），导电填料或其组合，并适于 抛光底物。 在另一方面，抛光制品包括具有适于抛光基底的表面和嵌入在抛光表面中的至少一个导电元件的主体，导电元件包括​​涂覆有导电材料的电介质或导电纤维，导电填料或其组合 。 导电元件可以具有延伸超过由抛光表面限定的平面的接触表面。 可以在制品中形成多个穿孔（546）和多个凹槽（542），以促进材料流过抛光制品周围。

公开(公告)号：EP1067590A2

公开(公告)日：2001-01-10

申请号：EP00305658.7

申请日：2000-07-05

申请人： Applied Materials, Inc.

发明人： Cheng, Robin ,  Carl, Daniel A. ,  Dordi, Yezdi N. ,  Hey, Peter ,  Morad, Ratson ,  Chen, Liang-Yuh ,  Smith, Paul F. ,  Sinha, Ashok K.

IPC分类号： H01L21/00

CPC分类号： H01L21/68721 ,  C25D7/123 ,  C25D17/001 ,  H01L21/68728 ,  H01L2924/0002 ,  H01L2924/00

摘要： The disclosure relates to a system and method that deposits an electroless seed layer on a substrate prior to subsequent processing. The system is designed with flexible architecture and can be configured in several ways. The electroless deposition process is performed in-situ with an electroplating process to minimize oxidation and other contaminants prior to the electroplating process. The system allows the substrate to be transferred from the electroless deposition process to the electroplating process with a protective coating to also minimise oxidation. The system generally includes a mainframe (214) having a mainframe substrate transfer robot (228), a loading station (210) disposed in connection with the mainframe, one or more processing facilities (218) disposed in connection with the mainframe, and an electroless supply (220) fluidly connected to the one or more processing applicators (240). Preferably, the electro-chemical deposition system includes a spin-rinse-dry (SRD) station (212) disposed between the loading station and the mainframe, a rapid thermal anneal chamber (211) attached to the loading station, and a system controller for controlling the deposition processes and the components of the electro-chemical deposition system. The electroless deposition fills defects and discontinues in the activation, or seed, layer and allows subsequent processing, such as electroplating, to fill the remainder of the features without substantial voids in the deposited material.

摘要翻译： 本公开涉及一种在随后的处理之前将无电解种子层沉积在衬底上的系统和方法。 该系统设计灵活的架构，可以通过多种方式进行配置。 无电沉积工艺通过电镀工艺原位进行，以在电镀工艺之前使氧化和其他污染物最小化。 该系统允许衬底从无电沉积工艺转移到具有保护涂层的电镀工艺中，以使氧化最小化。 该系统通常包括具有主机基板传送机器人（228）的主机架（214），与主机连接设置的加载站（210），与主机连接设置的一个或多个处理设备（218）和无电解 供应（220）流体连接到一个或多个处理施加器（240）。 优选地，电化学沉积系统包括设置在装载站和主框架之间的旋转干燥（SRD）站（212），附接到装载站的快速热退火室（211）和用于 控制沉积工艺和电化学沉积系统的组件。 无电沉积填充了激活或种子层中的缺陷和中断，并且允许随后的处理，例如电镀，以填充剩余的特征，而没有沉积材料中的实质空隙。

公开(公告)号：EP1361023A3

公开(公告)日：2004-04-07

申请号：EP03252801.0

申请日：2003-05-02

申请人： Applied Materials, Inc.

发明人： Hu, Yongqi ,  Wang, Yan ,  Duboust, Alain ,  Liu, Feng Q. ,  Mavliev, Rashid ,  Chen, Liang-Yuh ,  Morad, Ratson ,  Somekh, Sasson

IPC分类号： B24D13/14 ,  B24B37/04 ,  H01L21/321

CPC分类号： B24B37/16 ,  B23H5/08 ,  B24B37/046 ,  B24B37/14 ,  Y10S977/902

摘要： An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article (205) having a body comprising at least a portion (310) of fibers coated with a conductive material, conductive fillers, or combinations thereof, and adapted to polish the substrate. In another aspect, a polishing article includes a body having a surface adapted to polish the substrate and at least one conductive element embedded in the polishing surface, the conductive element comprising dielectric or conductive fibers coated with a conductive material, conductive fillers, or combinations thereof. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. A plurality of perforations (546) and a plurality of grooves (542) may be formed in the articles to facilitate flow of material through and around the polishing article.

公开(公告)号：EP1085557A2

公开(公告)日：2001-03-21

申请号：EP00307962.1

申请日：2000-09-14

申请人： Applied Materials, Inc.

发明人： Morad, Ratson ,  Shin, Ho Seon ,  Cheung, Robin ,  Kogan, Igor

IPC分类号： H01L21/00

CPC分类号： H01L21/67109 ,  H01L21/67115 ,  H01L21/67748

摘要： A method and apparatus for heating and cooling a substrate are provided. A chamber (13) is provided that comprises a heating mechanism (15,15a) adapted to heat a substrate (25) positioned proximate the heating mechanism, a cooling mechanism (39) spaced from the heating mechanism and adapted to cool a substrate positioned proximate the cooling mechanism, and a transfer mechanism (29:27) adapted to transfer a substrate between the position proximate the heating mechanism and the position proximate the cooling mechanism. The heating mechanism preferably comprises a heated substrate support adapted to support a substrate and to heat the supported substrate to a predetermined temperature, and the cooling mechanism preferably comprises a cooling plate. The transfer mechanism may comprise, for example, a wafer lift hoop (29) having a plurality of fingers adapted to support a substrate, or a plurality of wafer lift pins. A dry gas source may be coupled to the chamber and adapted to supply a dry gas thereto. The chamber preferably includes a pump adapted to evacuate the chamber to a predetermined pressure during at least cooling.

摘要翻译： 提供了一种用于加热和冷却基板的方法和装置。 提供了一个室（13），其包括适于加热位于加热机构附近的基板（25）的加热机构（15,15a），与加热机构间隔开的冷却机构（39），并适于冷却位于 冷却机构和适于在靠近加热机构的位置和靠近冷却机构的位置之间传送基板的传送机构（29:27）。 加热机构优选地包括适于支撑基板并将受支撑基板加热到预定温度的加热基板支撑件，并且冷却机构优选地包括冷却板。 转移机构可以包括例如具有适于支撑衬底的多个指状物的晶片提升环（29）或多个晶片提升销。 干燥气源可以连接到室并且适于向其供应干燥气体。 腔室优选地包括适于在至少冷却期间将腔室排空到预定压力的泵。

公开(公告)号：EP1361023B1

公开(公告)日：2006-04-12

申请号：EP03252801.0

申请日：2003-05-02

申请人： APPLIED MATERIALS, INC.

发明人： Hu, Yongqi ,  Wang, Yan ,  Duboust, Alain ,  Liu, Feng Q. ,  Mavliev, Rashid ,  Chen, Liang-Yuh ,  Morad, Ratson ,  Somekh, Sasson

IPC分类号： B24D13/14 ,  B24B37/04 ,  H01L21/321

CPC分类号： B24B37/16 ,  B23H5/08 ,  B24B37/046 ,  B24B37/14 ,  Y10S977/902

公开(公告)号：EP1067590A3

公开(公告)日：2004-05-12

申请号：EP00305658.7

申请日：2000-07-05

申请人： Applied Materials, Inc.

发明人： Cheng, Robin ,  Carl, Daniel A. ,  Dordi, Yezdi N. ,  Hey, Peter ,  Morad, Ratson ,  Chen, Liang-Yuh ,  Smith, Paul F. ,  Sinha, Ashok K.

IPC分类号： H01L21/00 ,  C25D7/12 ,  C23C18/16

CPC分类号： H01L21/68721 ,  C25D7/123 ,  C25D17/001 ,  H01L21/68728 ,  H01L2924/0002 ,  H01L2924/00

摘要： The disclosure relates to a system and method that deposits an electroless seed layer on a substrate prior to subsequent processing. The system is designed with flexible architecture and can be configured in several ways. The electroless deposition process is performed in-situ with an electroplating process to minimize oxidation and other contaminants prior to the electroplating process. The system allows the substrate to be transferred from the electroless deposition process to the electroplating process with a protective coating to also minimise oxidation. The system generally includes a mainframe (214) having a mainframe substrate transfer robot (228), a loading station (210) disposed in connection with the mainframe, one or more processing facilities (218) disposed in connection with the mainframe, and an electroless supply (220) fluidly connected to the one or more processing applicators (240). Preferably, the electro-chemical deposition system includes a spin-rinse-dry (SRD) station (212) disposed between the loading station and the mainframe, a rapid thermal anneal chamber (211) attached to the loading station, and a system controller for controlling the deposition processes and the components of the electro-chemical deposition system. The electroless deposition fills defects and discontinues in the activation, or seed, layer and allows subsequent processing, such as electroplating, to fill the remainder of the features without substantial voids in the deposited material.

公开(公告)号：EP1139391A1

公开(公告)日：2001-10-04

申请号：EP01103525.0

申请日：2001-02-16

申请人： Applied Materials, Inc.

发明人： Chen, B. Michelle ,  Shin, Ho Seon ,  Dordi, Yezdi ,  Morad, Ratson ,  Cheung, Robin

IPC分类号： H01L21/00 ,  C22F1/02 ,  C22F1/08

CPC分类号： H01L21/6723 ,  C22F1/02 ,  C22F1/08 ,  H01L21/76886

摘要： A method and apparatus for annealing copper. The method comprises forming a copper layer by electroplating on a substrate (190) in an integrated processing system and annealing the copper layer in a chamber (102) inside the integrated processing system.

摘要翻译： 一种退火铜的方法和装置。 该方法包括通过在集成处理系统中的衬底（190）上电镀形成铜层，并对集成处理系统内的腔室（102）中的铜层退火。