Conductive polishing article for electrochemical mechanical polishing
    4.
    发明公开
    Conductive polishing article for electrochemical mechanical polishing 有权
    LeitenderPolierkörperzum elektrochemisch-mechanischen Polieren

    公开(公告)号:EP1640113A1

    公开(公告)日:2006-03-29

    申请号:EP05077958.6

    申请日:2002-04-10

    IPC分类号: B24B37/04 B24D13/14 B23H5/08

    摘要: An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

    摘要翻译: 提供了一种用于平坦化基板表面的制造和设备。 在一个方面,提供了一种用于抛光衬底的制品,所述衬底包括抛光制品,所述抛光制品包括具有适于抛光所述衬底和安装表面的至少部分导电表面的主体。 可以在抛光制品中形成多个穿孔,以使材料流过其中。 另一方面,用于抛光衬底的抛光制品包括具有抛光表面和设置在其中的导电元件的主体。 导电元件可以具有延伸超过由抛光表面限定的平面的接触表面。 抛光表面可以具有形成在其中的一个或多个凹穴。 导电元件可以设置在每个抛光槽中。