专利检索 ap:("Applied Materials, Inc.") AND inv:"YU, Xiaozhou" 第 1 页

1.

发明公开
BOTTOM COVER PLATE TO REDUCE WAFER PLANAR NONUNIFORMITY 审中-实审

公开(公告)号：EP4420158A1

公开(公告)日：2024-08-28

申请号：EP22884219.1

申请日：2022-08-01

申请人： Applied Materials, Inc.

发明人： HUANG, Zubin , MOHANA, Srinivas Tokur , YADAMANE, Sandesh , WU, Kai , RAVI, Jallepally , YU, Xiaozhou , WANG, Peiqi

IPC分类号： H01L21/687 , H01L21/67 , C23C16/458 , C23C16/46

CPC分类号： H01L21/67103 , H01L21/68785 , H01L21/67248 , H01L21/68757 , C23C16/4585 , H01L21/68742 , C23C16/46