公开(公告)号：EP1475460A1

公开(公告)日：2004-11-10

申请号：EP04011066.0

申请日：2004-05-10

申请人： Applied Materials, Inc.

发明人： Choi, Soo Young ,  Park, Beom Soo ,  Shang, Quanyuan ,  Greene, Robert I. ,  White, John M. ,  Yim, Dong-Kil ,  Park, Chung-Hee ,  Law, Kam

IPC分类号： C23C16/458 ,  C25D11/16 ,  C25D11/18

CPC分类号： H01J37/32082 ,  C23C16/4581 ,  C25D11/04 ,  C25D11/16 ,  C25D11/18

摘要： A substrate support and method for fabricating the same are provided. In one embodiment of the invention, a substrate support includes an electrically conductive body having a substrate support surface that is covered by an electrically insulative coating. At least a portion of the coating centered on the substrate support surface has a surface finish of between about 80 to about 200 micro-inches. In another embodiment, a substrate support includes an anodized aluminum body having a surface finish on the portion of the body adapted to support a substrate thereon of between about 80 to about 200 micro-inches.

摘要翻译： 提供了一种基板支撑件及其制造方法。 在本发明的一个实施例中，衬底支撑件包括具有由电绝缘涂层覆盖的衬底支撑表面的导电体。 以基板支撑表面为中心的涂层的至少一部分具有约80至约200微英寸的表面光洁度。 在另一个实施例中，衬底支撑件包括阳极氧化铝体，其在主体部分上具有表面光洁度，其适于将其上的衬底支撑在约80至约200微英寸之间。