Plasma uniformity control by gas diffuser hole design
    3.
    发明公开
    Plasma uniformity control by gas diffuser hole design 审中-公开
    Regelung der Plasma-Uniformitätdurch Formgebung der Gasverteiler-Löcher

    公开(公告)号:EP2261393A2

    公开(公告)日:2010-12-15

    申请号:EP10184016.3

    申请日:2005-01-17

    摘要: Embodiments of a gas diffuser plate for distributing gas in a processing chamber are provided. The gas distribution plate includes a diffuser plate having an upstream side and a downstream side, and a plurality of gas passages passing between the upstream and downstream sides of the diffuser plate. The gas passages include hollow cathode cavities at the downstream side to enhance plasma ionization. The depths, the diameters, the surface area and density of hollow cathode cavities of the gas passages that extend to the downstream end can be gradually increased from the center to the edge of the diffuser plate to improve the film thickness and property uniformity across the substrate. The increasing diameters, depths and surface areas from the center to the edge of the diffuser plate can be created by bending the diffuser plate toward downstream side, followed by machining out the convex downstream side. Bending the diffuser plate can be accomplished by a thermal process or a vacuum process. The increasing diameters, depths and surface areas from the center to the edge of the diffuser plate can also be created computer numerically controlled machining. Diffuser plates with gradually increasing diameters, depths and surface areas of the hollow cathode cavities from the center to the edge of the diffuser plate have been shown to produce improved uniformities of film thickness and film properties.

    摘要翻译: 提供了用于在处理室中分配气体的气体扩散板的实施例。 气体分配板包括具有上游侧和下游侧的扩散板,以及在扩散板的上游侧和下游侧之间通过的多个气体通路。 气体通道包括在下游侧的空心阴极腔,以增强等离子体电离。 延伸到下游端的气体通道的空心阴极腔的深度,直径,表面积和密度可以从扩散板的中心到边缘逐渐增加,以改善衬底上的膜厚度和性能均匀性 。 从扩散板的中心到边缘的直径,深度和表面积的增加可以通过向下游侧弯曲扩散板,然后在凸出的下游侧加工出来。 扩散板的弯曲可以通过热处理或真空工艺来实现。 从扩散板的中心到边缘的直径,深度和表面积的增加也可以用计算机数字控制加工。 具有从扩散板的中心到边缘的中空阴极腔的直径逐渐增加,深度和表面积逐渐增加的扩散板已被证明可产生改善的膜厚度和膜性质的均匀性。

    Anodized substrate support
    5.
    发明公开
    Anodized substrate support 审中-公开
    Anodisierte Substratauflage

    公开(公告)号:EP1475460A1

    公开(公告)日:2004-11-10

    申请号:EP04011066.0

    申请日:2004-05-10

    摘要: A substrate support and method for fabricating the same are provided. In one embodiment of the invention, a substrate support includes an electrically conductive body having a substrate support surface that is covered by an electrically insulative coating. At least a portion of the coating centered on the substrate support surface has a surface finish of between about 80 to about 200 micro-inches. In another embodiment, a substrate support includes an anodized aluminum body having a surface finish on the portion of the body adapted to support a substrate thereon of between about 80 to about 200 micro-inches.

    摘要翻译: 提供了一种基板支撑件及其制造方法。 在本发明的一个实施例中,衬底支撑件包括具有由电绝缘涂层覆盖的衬底支撑表面的导电体。 以基板支撑表面为中心的涂层的至少一部分具有约80至约200微英寸的表面光洁度。 在另一个实施例中,衬底支撑件包括阳极氧化铝体,其在主体部分上具有表面光洁度,其适于将其上的衬底支撑在约80至约200微英寸之间。