公开(公告)号：EP2281020B1

公开(公告)日：2016-09-28

申请号：EP09747709.5

申请日：2009-05-15

申请人： Applied Nanotech Holdings, Inc. ,  Ishihara Chemical Co., Ltd

发明人： LI, Yunjun ,  ROUNDHILL, David Max ,  YANG, Mohshi ,  PAVLOVSKY, Igor ,  FINK, Richard Lee ,  YANIV, Zvi

IPC分类号： C09D1/00 ,  H05K3/12

CPC分类号： H05K3/1283 ,  H05K2201/0257 ,  H05K2203/107 ,  H05K2203/1131

摘要： A solution of metal ink is mixed and then printed or dispensed onto the substrate using the dispenser. The film then is dried to eliminate water or solvents. In some cases, a thermal curing step can be introduced subsequent to dispensing the film and prior to the photo-curing step. The substrate and deposited film can be cured using an oven or by placing the substrate on the surface of a heater, such as a hot plate. Following the drying and/or thermal curing step, a laser beam or focused light from the light source is directed onto the surface of the film in a process known as direct writing. The light serves to photo-cure the film such that it has low resistivity.

公开(公告)号：EP2047531A2

公开(公告)日：2009-04-15

申请号：EP07825373.9

申请日：2007-07-09

申请人： Applied Nanotech Holdings, Inc.

发明人： FINK, Richard Lee ,  YANIV, Zvi

IPC分类号： H01L51/10 ,  H01L51/40

CPC分类号： H01L51/0541 ,  B82Y10/00 ,  H01L51/0005 ,  H01L51/0045 ,  H01L51/102

摘要： Fabrication of thin-film transistor devices on polymer substrate films that is low-temperature and fully compatible with polymer substrate materials. The process produces micron-sized gate length struc¬ tures that can be fabricated using inkjet and other standard printing techniques. The process is based on microcrack technology developed for surface conduction emitter configurations for field emission devices.

公开(公告)号：EP2281020A1

公开(公告)日：2011-02-09

申请号：EP09747709.5

申请日：2009-05-15

申请人： Applied Nanotech Holdings, Inc.

发明人： LI, Yunjun ,  ROUNDHILL, David Max ,  YANG, Mohshi ,  PAVLOVSKY, Igor ,  FINK, Richard Lee ,  YANIV, Zvi

IPC分类号： C09D1/00

CPC分类号： H05K3/1283 ,  H05K2201/0257 ,  H05K2203/107 ,  H05K2203/1131

摘要： A solution of metal ink is mixed and then printed or dispensed onto the substrate using the dispenser. The film then is dried to eliminate water or solvents. In some cases, a thermal curing step can be introduced subsequent to dispensing the film and prior to the photo-curing step. The substrate and deposited film can be cured using an oven or by placing the substrate on the surface of a heater, such as a hot plate. Following the drying and/or thermal curing step, a laser beam or focused light from the light source is directed onto the surface of the film in a process known as direct writing. The light serves to photo-cure the film such that it has low resistivity.

公开(公告)号：EP2281020B8

公开(公告)日：2016-11-30

申请号：EP09747709.5

申请日：2009-05-15

申请人： Ishihara Chemical Co., Ltd.

发明人： LI, Yunjun ,  ROUNDHILL, David Max ,  YANG, Mohshi ,  PAVLOVSKY, Igor ,  FINK, Richard Lee ,  YANIV, Zvi

IPC分类号： C09D1/00 ,  H05K3/12

CPC分类号： H05K3/1283 ,  H05K2201/0257 ,  H05K2203/107 ,  H05K2203/1131

摘要： A solution of metal ink is mixed and then printed or dispensed onto the substrate using the dispenser. The film then is dried to eliminate water or solvents. In some cases, a thermal curing step can be introduced subsequent to dispensing the film and prior to the photo-curing step. The substrate and deposited film can be cured using an oven or by placing the substrate on the surface of a heater, such as a hot plate. Following the drying and/or thermal curing step, a laser beam or focused light from the light source is directed onto the surface of the film in a process known as direct writing. The light serves to photo-cure the film such that it has low resistivity.