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公开(公告)号：EP2281020B1
公开(公告)日：2016-09-28
申请号：EP09747709.5
申请日：2009-05-15
发明人： LI, Yunjun , ROUNDHILL, David Max , YANG, Mohshi , PAVLOVSKY, Igor , FINK, Richard Lee , YANIV, Zvi
CPC分类号： H05K3/1283 , H05K2201/0257 , H05K2203/107 , H05K2203/1131
摘要： A solution of metal ink is mixed and then printed or dispensed onto the substrate using the dispenser. The film then is dried to eliminate water or solvents. In some cases, a thermal curing step can be introduced subsequent to dispensing the film and prior to the photo-curing step. The substrate and deposited film can be cured using an oven or by placing the substrate on the surface of a heater, such as a hot plate. Following the drying and/or thermal curing step, a laser beam or focused light from the light source is directed onto the surface of the film in a process known as direct writing. The light serves to photo-cure the film such that it has low resistivity.
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公开(公告)号：EP2356678A1
公开(公告)日：2011-08-17
申请号：EP09826725.5
申请日：2009-11-12
申请人： Applied Nanotech Holdings, Inc. , Li, Yunjun , Laxton, Peter B. , Novak, James , Roundhill, David Max
IPC分类号： H01L23/48
CPC分类号： C09D11/38 , C09D11/36 , C09D11/52 , H01B1/22 , H01L24/03 , H01L24/05 , H01L31/022425 , H01L2224/0401 , H01L2224/16 , H01L2924/01057 , H01L2924/01067 , H01L2924/01077 , H01L2924/10158 , H01L2924/12032 , Y02E10/50 , H01L2924/00
摘要： A silicon solar cell is formed with an N-type silicon layer on a P-type silicon semiconductor substrate. An antireflective and passivation layer is deposited on the N-type silicon layer, and then an aluminum ink composition is printed on the back of the silicon wafer to form the back contact electrode. The back contact electrode is sintered to produce an ohmic contact between the electrode and the P-type silicon layer. The aluminum ink composition may include aluminum powders, a vehicle, an inorganic polymer, and a dispersant. Other electrodes on the solar cell can be produced in a similar manner with the aluminum ink composition.
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公开(公告)号：EP2281020A1
公开(公告)日：2011-02-09
申请号：EP09747709.5
申请日：2009-05-15
发明人： LI, Yunjun , ROUNDHILL, David Max , YANG, Mohshi , PAVLOVSKY, Igor , FINK, Richard Lee , YANIV, Zvi
IPC分类号： C09D1/00
CPC分类号： H05K3/1283 , H05K2201/0257 , H05K2203/107 , H05K2203/1131
摘要： A solution of metal ink is mixed and then printed or dispensed onto the substrate using the dispenser. The film then is dried to eliminate water or solvents. In some cases, a thermal curing step can be introduced subsequent to dispensing the film and prior to the photo-curing step. The substrate and deposited film can be cured using an oven or by placing the substrate on the surface of a heater, such as a hot plate. Following the drying and/or thermal curing step, a laser beam or focused light from the light source is directed onto the surface of the film in a process known as direct writing. The light serves to photo-cure the film such that it has low resistivity.
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公开(公告)号：EP2281020B8
公开(公告)日：2016-11-30
申请号：EP09747709.5
申请日：2009-05-15
发明人： LI, Yunjun , ROUNDHILL, David Max , YANG, Mohshi , PAVLOVSKY, Igor , FINK, Richard Lee , YANIV, Zvi
CPC分类号： H05K3/1283 , H05K2201/0257 , H05K2203/107 , H05K2203/1131
摘要： A solution of metal ink is mixed and then printed or dispensed onto the substrate using the dispenser. The film then is dried to eliminate water or solvents. In some cases, a thermal curing step can be introduced subsequent to dispensing the film and prior to the photo-curing step. The substrate and deposited film can be cured using an oven or by placing the substrate on the surface of a heater, such as a hot plate. Following the drying and/or thermal curing step, a laser beam or focused light from the light source is directed onto the surface of the film in a process known as direct writing. The light serves to photo-cure the film such that it has low resistivity.
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