公开(公告)号：EP4432791A2

公开(公告)日：2024-09-18

申请号：EP24183664.2

申请日：2021-03-12

Applicant: Ascensia Diabetes Care Holdings AG

Inventor： Gofman, Igor Y.

IPC: H05K3/40

CPC classification number: H05K1/115 ,  H05K1/113 ,  H05K3/321 ,  H05K2201/1003720130101 ,  H05K2201/05620130101 ,  H05K1/189 ,  H05K2201/05320130101 ,  H05K2201/0906320130101 ,  H05K2201/097920130101 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/1283 ,  Y02E60/10

Abstract: A flexible printed circuit board (PCB) may have one or more coin cell batteries mounted thereto such that the flexibility of the flexible PCB is maintained. The flexible PCB has one or more battery contact pads fabricated thereon. Each battery contact pad includes a pattern of metalized vias each extending from a top surface to a bottom surface of the flexible PCB. A coin cell battery may be positioned over or under the battery contact pad. Conductive light curable epoxy is applied to and in each metalized via to contact and adhere to the coin cell battery to form a conductive path from the battery through the battery contact pad to printed conductors on the flexible PCB. Methods of mounting one or more coin cell batteries to a flexible PCB are also provided, as are other aspects.

公开(公告)号：EP3305853B1

公开(公告)日：2024-07-10

申请号：EP16803481.7

申请日：2016-06-02

IPC: H05K1/09 ,  C09D5/24 ,  B22F1/0545 ,  B22F1/102 ,  B22F1/145 ,  B22F7/04 ,  H05K3/12

CPC classification number: C08K3/08 ,  C08K3/22 ,  C09D17/00 ,  C09D201/00 ,  C08L71/02 ,  H01B5/14 ,  H01B13/00 ,  C09D7/40 ,  H05K1/097 ,  H05K3/1283 ,  H05K2201/026920130101 ,  B22F2007/04720130101 ,  B22F7/04 ,  C09D5/24 ,  B22F1/0545 ,  B22F1/102 ,  B22F1/147

公开(公告)号：EP3374194A1

公开(公告)日：2018-09-19

申请号：EP16777820.8

申请日：2016-09-01

Applicant: Exatec, LLC.

Inventor： NELSON, Mark Kevin ,  SHULER, Stephen ,  SCHOUWENAAR, Richard

IPC: B41M5/00 ,  B41M1/12 ,  B41M1/30 ,  B41M1/34 ,  H01B1/22 ,  H05K1/09

CPC classification number: H05B3/84 ,  B41J3/4073 ,  B41M1/12 ,  B41M1/30 ,  B41M1/34 ,  B41M5/0023 ,  B41M5/0047 ,  B41M5/0064 ,  C09D11/037 ,  C09D11/322 ,  C09D11/52 ,  H01B1/22 ,  H05K1/0212 ,  H05K1/0284 ,  H05K1/092 ,  H05K3/1216 ,  H05K3/1233 ,  H05K3/125 ,  H05K3/1283 ,  H05K2201/09018 ,  H05K2201/10098 ,  H05K2201/10272 ,  H05K2203/013 ,  H05K2203/0139

Abstract: In an embodiment, a printing method for forming a conductive line on a plastic substrate for use in an automobile, comprises one or both of inkjet printing and screen printing the conductive line on the plastic substrate while the plastic substrate is fixed in a fixture of an automatic printing machine; the conductive mixture comprises a conductive paste; a solvent; and an adhesion agent; and wherein the conductive line is a busbar, a grid line, or an antenna line in the automobile.

公开(公告)号：EP3365396A1

公开(公告)日：2018-08-29

申请号：EP16858050.4

申请日：2016-10-18

Applicant: Sun Chemical Corporation

Inventor： MATHEW, Mathew ,  KRISHNAN, Ramasamy

IPC: C09D5/24 ,  C09D11/101 ,  H05K1/09 ,  H05K3/12 ,  H05K3/28 ,  H05K3/46 ,  G06F3/044

CPC classification number: G06F3/044 ,  B41M5/0023 ,  C09D11/101 ,  C09D11/52 ,  G06F2203/04103 ,  G06K19/07722 ,  H05K1/0266 ,  H05K1/092 ,  H05K1/162 ,  H05K3/1208 ,  H05K3/1275 ,  H05K3/1283 ,  H05K2201/09936 ,  H05K2201/10151

Abstract: Described herein are capacitive devices and methods for producing same using printing methods such as flexography, gravure, offset, lithography, etc. The capacitive devices are formed from printing conductive inks, non-conductive inks, masking ink layers, graphic artwork layers, and overprint layers on a substrate. Interaction between a conductive ink layer of the capacitive device with a touch screen device of a computer, tablet, smart phone, etc. causes a capacitive effect that allows information coded in capacitive device to be read, leading to an activity such as the download of content to the device having the touch screen.

公开(公告)号：EP3203816A4

公开(公告)日：2018-05-30

申请号：EP15846149

申请日：2015-08-31

Applicant: KOMURA TECH CO LTD

Inventor： KANEHARA MASAYUKI ,  URANO MASAAKI

IPC: H05K3/12 ,  B41F3/20 ,  B41F17/14 ,  B41M1/04 ,  B41M1/30 ,  C09D11/52 ,  H05K1/09

CPC classification number: H05K3/12 ,  B41F3/20 ,  B41F17/14 ,  B41M1/04 ,  B41M1/30 ,  C09D11/52 ,  H05K1/097 ,  H05K3/1275 ,  H05K3/1283 ,  H05K2201/0257 ,  H05K2203/1131

Abstract: An electronic circuit board manufacturing method according to the present disclosure is a method of manufacturing an electronic circuit board including a substrate and an electronic circuit having a predetermined pattern, the electronic circuit being fixed on the substrate and being made from a nanoink composition containing metal particles. The method includes the steps of: causing a printing plate to hold a nanoink composition containing metal particles, the printing plate including an ink holding part formed on a surface thereof and having a predetermined pattern; bringing a surface of the substrate into intimate contact with the printing plate to transfer the nanoink composition held on the ink holding part onto the substrate (workpiece W); and drying the transferred nanoink composition in an environment of 40°C or below in the atmosphere to fix the nanoink composition after the transfer step, thereby forming an electronic circuit having a predetermined pattern. This method is capable of forming a layer made from a uniform nanoink composition rapidly and efficiently at ordinary temperatures and under atmospheric pressure.

公开(公告)号：EP3168267A4

公开(公告)日：2017-10-25

申请号：EP15848117

申请日：2015-09-29

Applicant: TEIKOKU PRINTING INKS MFG CO LTD

Inventor： KOMINAMI YOSHIHUMI ,  KINOSHITA KENJI ,  TORIHATA TAKUYA

IPC: C09D133/00 ,  C08G18/67 ,  C08G18/73 ,  C08G18/75 ,  C09D4/06 ,  C09D133/06 ,  C09D175/04 ,  C09D175/16 ,  C09D183/00

CPC classification number: C09D133/10 ,  B05D3/067 ,  C08F290/04 ,  C08G18/722 ,  C08G18/73 ,  C08G18/755 ,  C09D4/06 ,  C09D7/20 ,  C09D133/066 ,  C09D175/16 ,  H05K3/1283 ,  H05K3/282 ,  H05K3/287 ,  C08L33/08 ,  C08L75/04 ,  C08L83/00 ,  C08F265/06 ,  C08G18/672 ,  C08G18/62 ,  C08F222/10

Abstract: [Problem] A coating resin composition having all of respective beneficial features of excellent state in chemical resistance, under high temperature, against human skin protection creams containing a mixture of alkyl esters of benzoic acid, as represented by Neutrogena Cream (registered trademark), excellent state in gas barrier property against metal-corrosive gases as represented by sulfur-containing gases, and excellent state in flexibility that accommodates three-dimensional shape forming processing is demanded. [Solution Means] An ultraviolet curing type coating resin composition, comprising an ultraviolet curing type coating resin composition containing an unsaturated-group-containing acrylic resin, with a weight average molecular weight of 5000 to 70000, a number of (meth) acrylate functional groups per molecule of 5 to 40, a hydroxyl value of 2 to 200mgKOH/g, and with a glass transition temperature of 20 to 90°C, a volatile organic solvent, and a photopolymerization initiator.

公开(公告)号：EP2050320B1

公开(公告)日：2017-09-27

申请号：EP07788794.1

申请日：2007-07-06

Applicant: Stora Enso Oyj

Inventor： MAIJALA, Juha ,  MERTA, Juha ,  LEHTI, Sanna

IPC: H05K3/10

CPC classification number: H05K3/1266 ,  G03G15/225 ,  H05K3/1283 ,  H05K3/4664 ,  H05K2203/0143 ,  H05K2203/0425 ,  H05K2203/0517 ,  H05K2203/1131 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/5313

公开(公告)号：EP3203816A1

公开(公告)日：2017-08-09

申请号：EP15846149.1

申请日：2015-08-31

Applicant: Komura-tech Co., Ltd.

Inventor： KANEHARA, Masayuki ,  URANO, Masaaki

IPC: H05K3/12 ,  B41M1/04 ,  B41M1/30 ,  B41F3/20 ,  B41F17/14

CPC classification number: H05K3/12 ,  B41F3/20 ,  B41F17/14 ,  B41M1/04 ,  B41M1/30 ,  C09D11/52 ,  H05K1/097 ,  H05K3/1275 ,  H05K3/1283 ,  H05K2201/0257 ,  H05K2203/1131

Abstract: An electronic circuit board manufacturing method according to the present disclosure is a method of manufacturing an electronic circuit board including a substrate and an electronic circuit having a predetermined pattern, the electronic circuit being fixed on the substrate and being made from a nanoink composition containing metal particles. The method includes the steps of: causing a printing plate to hold a nanoink composition containing metal particles, the printing plate including an ink holding part formed on a surface thereof and having a predetermined pattern; bringing a surface of the substrate into intimate contact with the printing plate to transfer the nanoink composition held on the ink holding part onto the substrate (workpiece W); and drying the transferred nanoink composition in an environment of 40°C or below in the atmosphere to fix the nanoink composition after the transfer step, thereby forming an electronic circuit having a predetermined pattern. This method is capable of forming a layer made from a uniform nanoink composition rapidly and efficiently at ordinary temperatures and under atmospheric pressure.

Abstract translation: 根据本公开的电子电路板制造方法是一种制造电子电路板的方法，该电子电路板包括基板和具有预定图案的电子电路，该电子电路固定在基板上并由包含金属颗粒的纳米燃料组合物制成 。 所述方法包括以下步骤：使印刷板保持包含金属颗粒的纳米油墨组合物，所述印刷板包括在其表面上形成并具有预定图案的油墨保持部分; 使基板的表面与印刷板紧密接触以将保持在墨水保持部件上的纳米燃料组合物转印到基板（工件W）上; 以及在大气中在40℃或更低的环境下干燥转印的纳米油墨组合物以在转印步骤后固定纳米油墨组合物，由此形成具有预定图案的电子电路。 该方法能够在常温和常压下快速有效地形成由均匀的纳米油墨组合物制成的层。

公开(公告)号：EP2479314A4

公开(公告)日：2017-08-02

申请号：EP10817129

申请日：2010-09-13

Applicant: HITACHI CHEMICAL CO LTD

Inventor： NAKAKO HIDEO ,  YAMAMOTO KAZUNORI ,  KUMASHIRO YASUSHI ,  YOKOSAWA SHUNYA ,  MASUDA KATSUYUKI ,  EJIRI YOSHINORI ,  INADA MAKI ,  KURODA KYOKO

IPC: B22F1/02 ,  B22F9/22 ,  B32B15/01 ,  C22C5/04 ,  C22C9/00 ,  C23C26/00 ,  C23C30/00 ,  H01B1/02 ,  H01B5/14 ,  H01B13/00 ,  H05K1/09 ,  H05K3/10 ,  H05K3/12

CPC classification number: B22F9/26 ,  B22F1/02 ,  B22F9/22 ,  B22F9/24 ,  B22F2201/01 ,  B22F2301/10 ,  B22F2302/25 ,  B22F2999/00 ,  B32B15/01 ,  C22C5/04 ,  C22C9/00 ,  H01B1/026 ,  H05K1/097 ,  H05K3/105 ,  H05K3/1283 ,  H05K2201/0224 ,  H05K2201/0272 ,  H05K2203/0315 ,  H05K2203/1131 ,  H05K2203/1157 ,  Y10T156/10 ,  Y10T428/12903 ,  B22F2201/013 ,  B22F2202/13

Abstract: Disclosed are: a copper metal film which has good adhesion to a substrate, low volume resistivity, and good deep-part metal properties; and a method for producing a copper metal film, wherein the copper metal film can be produced by reducing a substrate to a deep part thereof without damaging the substrate. Specifically disclosed is a copper metal film obtained by treating a copper-based particle deposition layer containing both copper oxides and a metallic transition metal or alloy, or a transition metal complex containing a metal element, with gaseous formic acid and/or formaldehyde heated to 120°C or higher. The copper oxide is preferably copper (I) oxide and/or copper (II) oxide. The transition metal, alloy or metal complex are preferably a metal selected from the group consisting of Cu, Pd, Pt, Ni, Ag, Au and Rh, an alloy containing the metal, or a complex containing the metal element, respectively.

Abstract translation: 本发明公开了一种对基材具有良好粘附性，低体积电阻率和良好的深部金属性质的铜金属膜; 以及一种用于制造铜金属膜的方法，其中所述铜金属膜可以通过在不损坏衬底的情况下将衬底还原到其深部来生产。 具体而言，公开了通过将加热至120℃的气态甲酸和/或甲醛处理含有铜氧化物和金属过渡金属或合金，或含有金属元素的过渡金属络合物的铜基颗粒沉积层而获得的铜金属膜 °C或更高。 氧化铜优选为氧化铜（I）和/或氧化铜（II）。 过渡金属，合金或金属配合物优选分别为选自Cu，Pd，Pt，Ni，Ag，Au和Rh的金属，含有该金属的合金或含有该金属元素的配合物。

公开(公告)号：EP3197250A1

公开(公告)日：2017-07-26

申请号：EP16789545.7

申请日：2016-04-28

Applicant: Fujikura Ltd.

Inventor： ISHII, Masaaki

IPC: H05K3/20 ,  G06F3/041 ,  G06F3/044 ,  H05K9/00

CPC classification number: G06F3/044 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0296 ,  H05K3/1258 ,  H05K3/1283 ,  H05K3/20 ,  H05K3/207 ,  H05K9/00 ,  H05K2201/09681 ,  H05K2201/10151

Abstract: A wiring body (4) includes an adhesive layer (5) and a mesh-like electrode layer (6) having a shape of a mesh formed by fine wires (64) intersecting each other, and formed on the adhesive layer (5). The mesh-like electrode layer (6) includes an intersection region (T1) intersecting fine wires (64) each other, and a non-intersection region (T2) corresponding to a region except for the intersection region (T1), and a depression (65) recessed toward the adhesive layer (5) is formed in the intersection region (T2).

Abstract translation: 布线体（4）包括粘合层（5）和网状电极层（6），所述网状电极层（6）具有由相互交叉的细线（64）形成的网状形状，并形成在粘合层（5）上。 网状电极层（6）具有交叉细线（64）的交叉区域（T1）和除交叉区域（T1）以外的区域对应的非交叉区域（T2） 在交叉区域（T2）形成朝向粘合层（5）凹陷的凹部（65）。