公开(公告)号：EP2481546A1

公开(公告)日：2012-08-01

申请号：EP10818709.7

申请日：2010-09-13

申请人： Asahi Glass Company, Limited

发明人： OKUYA, Tamao

IPC分类号： B29C33/68 ,  B29C45/26

CPC分类号： B29C33/68 ,  B29C37/0075 ,  B29L2011/00 ,  H01L24/45 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： To provide a mold release film for producing a light emitting diode by a mold, which is less susceptible to formation of pin holes or rupture and which is applicable to mass production of a light emitting diode by means of a mold having a plurality of cavities, and a process for producing a light emitting diode by means of such a mold release film. A mold release film to be disposed on the cavity surface of a mold to form a substantially hemispherical lens portion by encapsulating a light emitting element of a light emitting diode with an encapsulation resin, which release film has a thickness of from 16 to 175 µm and a tensile rupture elongation of from 600 to 3,000% at 110°C as measured in accordance with JIS K7127, and a process for producing a light emitting diode by means of such a mold release film.

摘要翻译： 为了提供一种用于通过模具制造发光二极管的脱模膜，其不易形成针孔或破裂，并且适用于通过具有多个空腔的模具批量生产发光二极管， 以及通过这种脱模膜制造发光二极管的方法。 一种脱模膜，其通过将发光二极管的发光元件与封装树脂封装而形成基本上半球形的透镜部分，该剥离膜的厚度为16〜175μm， 在根据JIS K7127测量的110℃下的拉伸断裂伸长率为600至3,000％，以及通过这种脱模膜制造发光二极管的方法。

公开(公告)号：EP2128190A1

公开(公告)日：2009-12-02

申请号：EP08711575.4

申请日：2008-02-19

申请人： Asahi Glass Company, Limited

发明人： YUKAWA, Yasumasa ,  OKUYA, Tamao

IPC分类号： C08J5/18 ,  H01M8/04

CPC分类号： H01M4/8814 ,  C08J5/18 ,  C08J2327/18 ,  H01M4/8605 ,  H01M4/8668 ,  H01M4/8828 ,  H01M4/8882 ,  H01M4/926 ,  H01M2008/1095 ,  Y10T428/266 ,  Y10T428/3154

摘要： To provide a carrier film for a fuel cell production process which is excellent in a recycling property and sufficient handling property in the fuel cell production process.
A carrier film for a fuel cell production process, which is made of a fluororesin and has a tensile elastic modulus of at least 1,500 MPa in the machine direction, as measured in accordance. with ASTM D882 and a tensile elastic modulus of at least 100 MPa in the machine direction at 150°C, and which preferably has a thickness of from 10 to 300 µm.

摘要翻译： 提供一种在燃料电池生产过程中循环利用性和充分处理性优异的燃料电池制造方法的载体膜。 用于燃料电池生产过程的载体膜，其由氟树脂制成，并且在纵向方向上的拉伸弹性模量为至少1500MPa，如根据测量的。 ASTM D882，在150℃下的机械方向的拉伸弹性模量为100MPa以上，优选为10〜300μm。

公开(公告)号：EP2002973A1

公开(公告)日：2008-12-17

申请号：EP07740172.7

申请日：2007-03-28

申请人： Asahi Glass Company, Limited

发明人： OKUYA, Tamao ,  ARUGA, Hiroshi ,  YAMAUCHI, Masaru

IPC分类号： B32B9/00 ,  H05K3/28

CPC分类号： H05K3/281 ,  B30B15/061 ,  Y10T156/10 ,  Y10T428/265 ,  Y10T428/3154 ,  Y10T428/31663

摘要： To provide a release film which does not need to be changed often for hot press and is easy to be changed; a releasable cushion material which can reduce the frequency of changing a cushion material main body; and a process for producing a printed board with good productivity and low cost.
A release film 10 which is to be provided on a surface of a cushion material made of silicone rubber, and which has a layer 14 containing Si on one side of a substrate 12 made of a fluororesin; a releasable cushion material wherein the release film is provided on a surface of the cushion material made of silicone rubber so that the layer containing Si is located on the cushion material side; and a process for producing a printed board wherein, when a laminate of a printed board main body and coverlay films is subjected to hot press as sandwiched between press boards, the release film is disposed on a surface of the cushion material of the coverlay film side so that the layer containing Si is located on the cushion material side.

摘要翻译： 为了提供离型膜，它不需要进行热压要经常改变，很容易被改变; 可释放的衬垫材料可以减少改变缓冲材料主体的频率; 并具有良好的生产率和低成本制造的印刷电路板的方法。 一种剥离膜10所有要被设置在由硅橡胶形成的缓冲材料的表面上，并具有在由氟树脂构成的12个基片的一侧的含Si的层14; 可释放的衬垫材料worin释放电影设置由硅橡胶制成，以便DASS死层含有Si位于缓冲材料侧的衬垫材料的表面上; 以及一种用于制造印刷电路板worin，当印刷基板主体和覆盖膜的层叠体进行热压作为夹在加压板之间的过程中，释放电影被设置在覆盖膜侧的缓冲材料的表面上 所以没有含Si位于缓冲材料侧的层。

公开(公告)号：EP2128190B1

公开(公告)日：2016-11-02

申请号：EP08711575.4

申请日：2008-02-19

申请人： Asahi Glass Company, Limited

发明人： YUKAWA, Yasumasa ,  OKUYA, Tamao

IPC分类号： C08J5/18 ,  H01M4/88 ,  H01M4/86 ,  H01M8/1018 ,  H01M4/92

CPC分类号： H01M4/8814 ,  C08J5/18 ,  C08J2327/18 ,  H01M4/8605 ,  H01M4/8668 ,  H01M4/8828 ,  H01M4/8882 ,  H01M4/926 ,  H01M2008/1095 ,  Y10T428/266 ,  Y10T428/3154

公开(公告)号：EP2002973B1

公开(公告)日：2011-05-11

申请号：EP07740172.7

申请日：2007-03-28

申请人： Asahi Glass Company, Limited

发明人： OKUYA, Tamao ,  ARUGA, Hiroshi ,  YAMAUCHI, Masaru

IPC分类号： B32B9/00 ,  H05K3/28 ,  B30B15/06

CPC分类号： H05K3/281 ,  B30B15/061 ,  Y10T156/10 ,  Y10T428/265 ,  Y10T428/3154 ,  Y10T428/31663

摘要： A mold release film that does not need frequent replacement at hot press, realizing easy replacement; a mold release cushion material that enables suppressing the frequency of replacement of cushion material main body; and a process for manufacturing a printed board, in which a printed board can be manufactured with high productivity at low cost. There is provided mold release film (10) to be laid on a surface of cushion material of silicone rubber, comprising base material (12) of fluororesin and, superimposed on one surface thereof, layer (14) containing Si. Further, there is provided a mold release cushion material comprising a cushion material of silicone rubber and, superimposed on a surface thereof, a mold release film so that the layer containing Si is positioned on the side of cushion material. Still further, there is provided a process for manufacturing a printed board, comprising interposing a laminate of printed board main body and coverlay film between press boards and carrying out hot press with a mold release film disposed on the surface of the coverlay film side of cushion material and with the layer containing Si disposed on the side of cushion material.

公开(公告)号：EP2012351A1

公开(公告)日：2009-01-07

申请号：EP07742083.4

申请日：2007-04-20

申请人： Asahi Glass Company, Limited

发明人： OKUYA, Tamao ,  ARUGA, Hiroshi ,  HIGUCHI, Yoshiaki

IPC分类号： H01L21/56 ,  B29C33/68

CPC分类号： B29C33/68 ,  H01L21/566 ,  H01L2924/0002 ,  Y10T428/3154 ,  Y10T428/31678 ,  Y10T428/31692 ,  H01L2924/00

摘要： To provide a release film which has an extremely low gas permeability, an enormously small mold contamination by a mold resin and a high releasability.
A gas barrier release film for semiconductor resin molds, comprising a release layer (I) having excellent releasability, a plastic support layer (II) supporting the release layer, and a gas restraint layer (III) made of a metal or a metal oxide, formed between the release layer and the support layer, and having a xylene gas permeability of at most 10 -15 (kmol m/(s·m 2 ·kPa)) at 170°C. The release layer (I) is preferably formed from a fluororesin such as an ethylene/tetrafluoroethylene copolymer, and a metal oxide layer is preferably a layer of an oxide such as an aluminum oxide, a silicon oxide or a magnesium oxide.

摘要翻译： 为了提供一种具有极低气体渗透性的脱模膜，模具树脂具有极小的模具污染和高脱模性。 一种用于半导体树脂模具的阻气性隔离膜，包括具有优异的剥离性的剥离层（I），支撑脱模层的塑料支撑层（II）和由金属或金属氧化物制成的气体限制层（III） 形成在释放层和支撑层之间，并且在170℃下二甲苯气体渗透率为至多10 -15（kmol / m s（s·m 2·kPa））。 脱模层（I）优选由氟树脂如乙烯/四氟乙烯共聚物形成，金属氧化物层优选为氧化铝，氧化硅或氧化镁等氧化物层。