MOLD-RELEASING FILM AND METHOD FOR MANUFACTURING LIGHT EMITTING DIODE
    4.
    发明公开
    MOLD-RELEASING FILM AND METHOD FOR MANUFACTURING LIGHT EMITTING DIODE 有权
    维多利亚州立大学

    公开(公告)号:EP2374590A1

    公开(公告)日:2011-10-12

    申请号:EP10729232.8

    申请日:2010-01-07

    摘要: Provided is a release film for producing a light emitting diode having desired concaves and convexes accurately transferred directly to the surface of a resin-sealed portion, at a low cost and in high yield, and a process for producing a light emitting diode.
    A release film 10 having a plurality of convex portions (convex stripes 12) and/or concave portions (grooves 14) formed on the surface is used as a release film to be placed in a cavity of a mold for forming a resin-sealed portion to seal a light emitting element of a light emitting diode.

    摘要翻译: 提供一种用于制造具有所需的凹凸的发光二极管的剥离膜,其以低成本和高产率直接准确地转印到树脂密封部分的表面上,以及制造发光二极管的工艺。 使用具有形成在表面上的多个凸部(凸条12)和/或凹部(凹槽14)的剥离膜10作为剥离膜,放置在用于形成树脂密封部的模具的空腔中 以密封发光二极管的发光元件。

    MOLD RELEASE FILM FOR SEMICONDUCTOR RESIN MOLD
    5.
    发明公开
    MOLD RELEASE FILM FOR SEMICONDUCTOR RESIN MOLD 审中-公开
    GUSSLÖSEFILMFÜRHALBLEITERHARZGUSS

    公开(公告)号:EP2012351A1

    公开(公告)日:2009-01-07

    申请号:EP07742083.4

    申请日:2007-04-20

    IPC分类号: H01L21/56 B29C33/68

    摘要: To provide a release film which has an extremely low gas permeability, an enormously small mold contamination by a mold resin and a high releasability.
    A gas barrier release film for semiconductor resin molds, comprising a release layer (I) having excellent releasability, a plastic support layer (II) supporting the release layer, and a gas restraint layer (III) made of a metal or a metal oxide, formed between the release layer and the support layer, and having a xylene gas permeability of at most 10 -15 (kmol m/(s·m 2 ·kPa)) at 170°C. The release layer (I) is preferably formed from a fluororesin such as an ethylene/tetrafluoroethylene copolymer, and a metal oxide layer is preferably a layer of an oxide such as an aluminum oxide, a silicon oxide or a magnesium oxide.

    摘要翻译: 为了提供一种具有极低气体渗透性的脱模膜,模具树脂具有极小的模具污染和高脱模性。 一种用于半导体树脂模具的阻气性隔离膜,包括具有优异的剥离性的剥离层(I),支撑脱模层的塑料支撑层(II)和由金属或金属氧化物制成的气体限制层(III) 形成在释放层和支撑层之间,并且在170℃下二甲苯气体渗透率为至多10 -15(kmol / m s(s·m 2·kPa))。 脱模层(I)优选由氟树脂如乙烯/四氟乙烯共聚物形成,金属氧化物层优选为氧化铝,氧化硅或氧化镁等氧化物层。

    LAMINATE FOR FLEXIBLE PRINTED WIRING BOARDS
    10.
    发明公开
    LAMINATE FOR FLEXIBLE PRINTED WIRING BOARDS 有权
    LAMINATFÜR灵活的LEITERPLATTEN

    公开(公告)号:EP1830613A1

    公开(公告)日:2007-09-05

    申请号:EP05814488.2

    申请日:2005-12-07

    摘要: To provide a laminate for a flexible printed wiring board excellent in signal response in the high frequency region. A laminate for a flexible printed wiring board having a three-layer laminated structure where a reinforcing layer (A), an electrical insulator layer (B) and an electrical conductor layer (C) are laminated in this order, wherein the electrical insulator layer (B) is made of a fluorocopolymer comprising repeating units (a) based on tetrafluoroethylene and/or chlorotrifluoroethylene, repeating units (b) based on a fluoromonomer excluding tetrafluoroethylene and chlorotrifluoroethylene, and repeating units (c) based on a monomer having an acid anhydride residue and the electrical conductor layer (C) has a surface roughness of at most 10 µm on the side being in contact with the electrical insulator layer (B). The laminate for a flexible printed wiring board is excellent in signal response in the high frequency region and excellent in flex resistance.

    摘要翻译: 为了提供高频区域的信号响应优异的柔性印刷布线板的层叠体。 具有三层层叠结构的柔性印刷线路板的层叠体,其中,依次层叠有增强层(A),电绝缘体层(B)和导电体层(C),其中,电绝缘体层 B)由包含基于四氟乙烯和/或三氟氯乙烯的重复单元(a)的含氟共聚物制成,基于除四氟乙烯和氯三氟乙烯之外的含氟单体的重复单元(b)和基于具有酸酐残基的单体的重复单元(c) 并且电导体层(C)在与电绝缘体层(B)接触的一侧具有至多10μm的表面粗糙度。 用于柔性印刷线路板的层叠体在高频区域的信号响应优异,抗弯曲性优异。