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1.发明公开
公开(公告)号：EP0815292A1
公开(公告)日：1998-01-07
申请号：EP96907505.0
申请日：1996-03-15
IPC分类号： C25D5
CPC分类号： C25D5/54
摘要： The invention concerns a process for the selective or partial electrolytic metallization of surfaces of substrates made from electrically non-conducting materials which for the purpose of the coating process are secured to plastic-coated holding elements. The proposed process involves the following steps: a) preliminary treatment of the surfaces with an etching solution containing chromium (VI) oxide; followed immediately by b) treatment of the surfaces with a colloidal acidic solution of palladium-/zinc compounds, care being taken to prevent prior contact with adsorption-promoting solutions; c) treatment of the surfaces with a solution containing a soluble metal compound capable of being reduced by zinc (II) compounds, an alkali or alkaline earth metal hydroxide, and a complex forming agent for the metal in a quantity sufficient at least to prevent precipitation of metal hydroxides; d) treatment of the surfaces with an electrolytic metallization solution. By applying this process, it is possible to ensure that only the surfaces of the work piece are coated with metal, not the holding elements or, where applicable, non-conductive plastic layers applied to parts of the work pieces. In addition, the process facilitates direct electrolytic metallization even of large plastic surfaces without prior currentless metallization.
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公开(公告)号：EP2825689A1
公开(公告)日：2015-01-21
申请号：EP13709443.9
申请日：2013-03-15
IPC分类号： C23C18/22
CPC分类号： C23C18/24 , C23C18/1641 , C23C18/22 , H05K3/382
摘要： The present invention relates to a process for metallizing nonconductive plastics using an etching solution free of hexavalent chromium. The etching solution is based on an acidic permanganate solution. After the treatment of the plastics with the etching solution, the plastics are metallized by means of known processes.
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公开(公告)号：EP2825688A1
公开(公告)日：2015-01-21
申请号：EP13709442.1
申请日：2013-03-15
IPC分类号： C23C18/22
CPC分类号： C23C18/24 , C23C18/1641 , C23C18/1653 , C23C18/166 , C23C18/2073 , C23C18/2086 , C23C18/22 , C23C18/28 , C23C18/30 , C25D5/56
摘要： The present invention relates to a process for metallizing nonconductive plastics using etching solutions free of hexavalent chromium. The etching solutions are based on permanganate solutions. After the treatment of the plastics with the etching solutions, the plastics are metallized by means of known processes.
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公开(公告)号：EP1343921A1
公开(公告)日：2003-09-17
申请号：EP01992803.5
申请日：2001-10-04
IPC分类号： C23C18/16 , C23C18/20 , C23C18/24 , C23C18/28 , C23C18/32 , C23C18/34 , C23C18/44 , C23C18/50 , C23C18/18
CPC分类号： C23C18/34 , C23C18/1844 , C23C18/1893 , C23C18/2086 , C23C18/28 , C23C18/50
摘要： A method for electroless metal plating of substrates, more specifically with electrically non-conductive surfaces, by which the substrates may be reliably metal plated at low cost under manufacturing conditions as well and by means of which it is possible to selectively coat the substrates to be treated only, and not the surfaces of the racks. The method involves the following steps: a. pickling the surfaces with a solution containing chromate ions; b. activating the pickled surfaces with a silver colloid containing stannous ions; c. treating the activated surfaces with an accelerating solution in order to remove tin compounds from the surfaces; and d. depositing, by means of an electroless nickel plating bath, a layer that substantially consists of nickel to the surfaces treated with the accelerating solution, the electroless nickel plating bath containing at least one reducing agent selected from the group comprising borane compounds.
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公开(公告)号：EP2825690B1
公开(公告)日：2016-05-18
申请号：EP13712718.9
申请日：2013-03-15
发明人： MIDDEKE, Hermann
IPC分类号： C23C18/22
CPC分类号： C23C18/1603 , C23C18/1625 , C23C18/163 , C23C18/1641 , C23C18/166 , C23C18/22 , C23C18/24 , C23C18/52
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公开(公告)号：EP2825689B1
公开(公告)日：2016-05-18
申请号：EP13709443.9
申请日：2013-03-15
IPC分类号： C23C18/22
CPC分类号： C23C18/24 , C23C18/1641 , C23C18/22 , H05K3/382
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公开(公告)号：EP2825690A2
公开(公告)日：2015-01-21
申请号：EP13712718.9
申请日：2013-03-15
发明人： MIDDEKE, Hermann
IPC分类号： C23C18/22
CPC分类号： C23C18/1603 , C23C18/1625 , C23C18/163 , C23C18/1641 , C23C18/166 , C23C18/22 , C23C18/24 , C23C18/52
摘要： The present invention relates to a process for metallizing electrically nonconductive plastic surfaces of articles. During the process, the rack to which the said articles are fastened is subjected to a treatment for protection against metallization. Subsequently, the articles are metallized by means of known processes, wherein the racks remain free of metal.
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公开(公告)号：EP2825688B1
公开(公告)日：2016-05-18
申请号：EP13709442.1
申请日：2013-03-15
IPC分类号： C23C18/22
CPC分类号： C23C18/24 , C23C18/1641 , C23C18/1653 , C23C18/166 , C23C18/2073 , C23C18/2086 , C23C18/22 , C23C18/28 , C23C18/30 , C25D5/56
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公开(公告)号：EP1343921B1
公开(公告)日：2005-03-16
申请号：EP01992803.5
申请日：2001-10-04
IPC分类号： C23C18/16 , C23C18/20 , C23C18/24 , C23C18/28 , C23C18/32 , C23C18/34 , C23C18/44 , C23C18/50 , C23C18/18
CPC分类号： C23C18/34 , C23C18/1844 , C23C18/1893 , C23C18/2086 , C23C18/28 , C23C18/50
摘要： A method for electroless metal plating of substrates, more specifically with electrically non-conductive surfaces, by which the substrates may be reliably metal plated at low cost under manufacturing conditions as well and by means of which it is possible to selectively coat the substrates to be treated only, and not the surfaces of the racks. The method involves the following steps: a. pickling the surfaces with a solution containing chromate ions; b. activating the pickled surfaces with a silver colloid containing stannous ions; c. treating the activated surfaces with an accelerating solution in order to remove tin compounds from the surfaces; and d. depositing, by means of an electroless nickel plating bath, a layer that substantially consists of nickel to the surfaces treated with the accelerating solution, the electroless nickel plating bath containing at least one reducing agent selected from the group comprising borane compounds.
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10.发明公开
公开(公告)号：EP1354073A2
公开(公告)日：2003-10-22
申请号：EP01949313.9
申请日：2001-05-04
CPC分类号： B01D61/027 , B01D61/145 , C23C18/1617 , C25D21/20
摘要： The invention relates to a method for the treatment of work pieces with a palladium colloid solution by bringing the work pieces into contact with the colloid solution, palladium being recovered after the use of the colloid solution. This is achieved by separating palladium colloid particles from the colloid liquid by means of a molecular filter. With this method it is easy to continuously and largely completely separate palladium from the spent processing solutions without investing large amounts of chemicals, energy and time. The spent processing solution may especially be worked up after separation of the part of the solution containing palladium such that palladium can be recovered completely and be reused for further processing.
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