公开(公告)号：EP0832407A1

公开(公告)日：1998-04-01

申请号：EP96915890.0

申请日：1996-05-20

申请人： BROOKS AUTOMATION, INC.

发明人： MUKA, Richard S.

IPC分类号： F27B5 ,  C23C16 ,  C23F1 ,  C23F4 ,  C30B25 ,  C30B31 ,  F27D7 ,  H01L21

CPC分类号： C23C16/463 ,  C23C16/4583 ,  C23C16/46 ,  C30B25/10 ,  C30B31/12 ,  H01L21/67103

摘要： A substrate thermal condtioning apparatus (10) with a chamber (12), a plate (32) located in the chamber (12) and a gas supply (14). The plate (32) has a top heat transfer surface with grooves (42) therealong. A substrate (S) is placed on standoffs (41) of the heat transfer surface and gas is pumped into the chamber (12). The plate (32) is either heated or cooled to change the temperature of the substrate (S). Heat is transferred between the substrate (S) and the plate (32) primarily by gas conduction heating. Because of the grooves (42) in the plate (32), the gas can be very quickly and uniformly distributed and evacuated between the substrate (S) and the heat transfer surface.

公开(公告)号：EP0832407B1

公开(公告)日：2003-07-30

申请号：EP96915890.6

申请日：1996-05-20

申请人： BROOKS AUTOMATION, INC.

发明人： MUKA, Richard S.

IPC分类号： F27D5/00 ,  F27D7/06 ,  C30B25/10 ,  C30B25/14 ,  C23C16/44

CPC分类号： C23C16/463 ,  C23C16/4583 ,  C23C16/46 ,  C30B25/10 ,  C30B31/12 ,  H01L21/67103

摘要： A substrate thermal condtioning apparatus (10) with a chamber (12), a plate (32) located in the chamber (12) and a gas supply (14). The plate (32) has a top heat transfer surface with grooves (42) therealong. A substrate (S) is placed on standoffs (41) of the heat transfer surface and gas is pumped into the chamber (12). The plate (32) is either heated or cooled to change the temperature of the substrate (S). Heat is transferred between the substrate (S) and the plate (32) primarily by gas conduction heating. Because of the grooves (42) in the plate (32), the gas can be very quickly and uniformly distributed and evacuated between the substrate (S) and the heat transfer surface.

公开(公告)号：EP0733130A1

公开(公告)日：1996-09-25

申请号：EP95904908.0

申请日：1994-12-15

申请人： BROOKS AUTOMATION, INC.

发明人： HENDRICKSON, Ruth Ann ,  HOFMEISTER, Christopher ,  MUKA, Richard S.

IPC分类号： C23C16 ,  C23F1 ,  C23F4 ,  C30B25 ,  C30B31 ,  H01L21

CPC分类号： C23C16/463 ,  C23C16/4583 ,  C23C16/46 ,  C30B25/10 ,  C30B31/12 ,  H01L21/67103

摘要： Gas-loaded thermal conditioning is used to cause the temperature of a substrate (20) to approach that of a high thermal inertia temperature-controlled plate (22 or 106) by adjustable pressure of gas above the substrate (20), so as to press the substrate (20) against the plate (22 or 106). There is no mechanical contact with the substrate (20) except the plate (22 or 106) which it rests on, and there is no danger of overheating or overcooling.