FILM-FORMING DEVICE
    7.
    发明公开
    FILM-FORMING DEVICE 审中-公开
    成膜装置

    公开(公告)号:EP3223301A1

    公开(公告)日:2017-09-27

    申请号:EP15861765.4

    申请日:2015-11-09

    摘要: In a film-forming apparatus, a rotary shaft is connected to a rotary stage. A plurality of wafers are placed in a plurality of placement regions arranged in a circumferential direction with respect to a central axis line of the rotary shaft and is held by the rotary stage. The rotary stage is accommodated in an internal space of a susceptor. In this internal space, a gas supply mechanism generates a process gas flow along a direction orthogonal to the axis line from the outside of the rotary stage. A heat insulating material is installed in a heat insulating region in the internal space of the susceptor. The heat insulating region is located more outwardly from the axis line than positions in the placement regions nearest to the central axis line and more inwardly from the central axis line than positions in the placement regions farthest from the axis line.

    摘要翻译: 在成膜装置中,旋转轴连接到旋转台。 多个晶片被放置在多个布置在相对于圆周方向的旋转轴的中心轴线设置区域中,并且通过旋转台保持。 旋转台被容纳在基座的内部空间中。 在该内部空间中,气体供给机构从旋转台的外部沿着与轴线正交的方向产生处理气体流。 绝热材料被安装在基座的内部空间中的绝热区域中。 绝热区域位于更向外从轴线比在放置区域的位置最接近于从中心轴线比在从轴线最远的设置区域的位置的中心轴线和更向内。

    VERFAHREN ZUM ABSCHEIDEN EINER KRISTALLSCHICHT BEI NIEDRIGEN TEMPERATUREN, INSBESONDERE EINER PHOTOLUMINESZIERENDEN IV-IV-SCHICHT AUF EINEM IV-SUBSTRAT, SOWIE EIN EINE DERARTIGE SCHICHT AUFWEISENDES OPTOELEKTRONISCHES BAUELEMENT
    9.
    发明公开
    VERFAHREN ZUM ABSCHEIDEN EINER KRISTALLSCHICHT BEI NIEDRIGEN TEMPERATUREN, INSBESONDERE EINER PHOTOLUMINESZIERENDEN IV-IV-SCHICHT AUF EINEM IV-SUBSTRAT, SOWIE EIN EINE DERARTIGE SCHICHT AUFWEISENDES OPTOELEKTRONISCHES BAUELEMENT 审中-公开
    METHOD FOR晶体层在低温下,特别是光致发光的IV-IV层上的IV SUBSTRATE AND SUCH表现出光电子器件的层分离

    公开(公告)号:EP3155145A1

    公开(公告)日:2017-04-19

    申请号:EP15726035.7

    申请日:2015-05-18

    摘要: The invention relates to a method for monolithically depositing a monocrystalline IV-IV layer that glows when excited and that is composed of a plurality of elements of the IV main group, in particular a GeSn or Si-GeSn layer, said IV-IV layer having a dislocation density less than 6 cm
    -2 , on an IV substrate, in particular a silicon or germanium substrate, comprising the following steps: providing a hydride of a first IV element (A), such as Ge
    2 H
    6 or Si
    2 H
    6 ; providing a halide of a second IV element (B), such as SnCl
    4 ; heating the substrate to a substrate temperature that is less than the decomposition temperature of the pure hydride or of a radical formed therefrom and is sufficiently high that atoms of the first element (A) and of the second element (B) are integrated into the surface in crystalline order, wherein the substrate temperature lies, in particular, in a range between 300°C and 475°C; producing a carrier gas flow of an inert carrier gas, in particular N
    2 , Ar, He, which in particular is not H
    2 ; transporting the hydride and the halide and decomposition products arising therefrom to the surface at a total pressure of at most 300 mbar; depositing the IV-IV layer, or a layer sequence consisting of IV-IV layers of the same type, having a thickness of at least 200 nm, wherein the deposited layer is, in particular, a Si
    y Ge
    1
    -x-y Sn layer, with x > 0.08 and y ≤ 1.

    摘要翻译: 一种用于单片沉积单晶IV-IV层做发光激发时,也由所述IV主族元素中的多个方法,特别是GeSn或Si GeSn层,具有的位错密度的IV-IV层少 超过6厘米2,在上基片IV,特别是硅或锗的衬底,其包括以下步骤:提供第一元件IV(A)的氢化物:如Ge2H6或乙硅烷; 提供第二IV族元素(B),:如四氯化锡的卤化物; 加热该基材至基材温度并低于从形成在那里的纯氢化的或自由基的分解温度和足够高做的第一元件(A)的原子和所述第二元件(B)的被集成到表面 在晶序,worin基板温度读取,特别是在300℃和475℃之间的范围内。 产生的惰性载气的载气流量,特别是N 2,氩,氦,其中特定不H3; 输送氢化物和卤化物和分解产物所产生从那里到在300毫巴的总压的表面上; 沉积IV-IV层,或由相同类型的IV-IV层的层序列,其厚度至少为200nm,worin沉积层,特别地,一个SiyGe1-X-YSN层,其中x > 0:08和y≦第一