摘要:
A method of making fancy pale blue or fancy pale blue/green CVD diamond material is described. The method comprises irradiating single crystal diamond material that has been grown by a CVD process with electrons to introduce isolated vacancies into the diamond material, the irradiated diamond material having (or after a further post- irradiation treatment having) a total vacancy concentration [VT] and a path length L such that [VT] x L is at least 0.072 ppm cm and at most 0.36 ppm cm, and the diamond material becomes fancy pale blue or fancy pale blue/green in colour. Fancy pale blue diamonds are also described.
摘要:
A surface-coated cutting tool according to the present invention is provided with a base material and a coating formed on the base material, the coating includes an ±-Al 2 O 3 layer, the ±-Al 2 O 3 layer includes a plurality of crystal grains of ±-Al 2 O 3 and shows (001) orientation, a grain boundary of the crystal grains contains a CSL grain boundary and a general grain boundary, and a length of a ˆ‘3 crystal grain boundary out of the CSL grain boundary exceeds 80% of a length of a ˆ‘3-29 crystal grain boundary and is equal to or more than 10% and equal to or less than 50% of the total length of all grain boundaries which is the sum of the length of the ˆ‘3-29 crystal grain boundary and a length of the general grain boundary.
摘要:
A device, system and method for depositing crystalline layers on at least one crystalline substrate is described. The disclosure includes the use of a multi zone heater, the multi zone heater is disposed between a reactor housing and a process chamber. The multi zone heater has different electrical properties along its length, whereby the multi zone heater when heated by eddy currents induced by an RF field generated by a RF heating coil provides a temperature profile inside the multi zone heater that varies along the length of the multi zone heater for heating the process chamber.
摘要:
The present invention provides a method for producing an epitaxial silicon carbide wafer comprising epitaxially growing SiC on an SiC substrate to produce an epitaxial SiC wafer during which further reducing stacking faults and comet defects than the conventional technologies to obtain an epitaxial SiC wafer having a high quality epitaxial film. The method for producing the epitaxial silicon carbide wafer is characterized in that a pre-growth atmosphere gas flowing into the growth furnace before the start of epitaxial growth contains hydrogen gas and has a balance of an inert gas and unavoidable impurities, and the hydrogen gas is contained in 0.1 to 10.0 vol% with respect to the inert gas.
摘要:
In a film-forming apparatus, a rotary shaft is connected to a rotary stage. A plurality of wafers are placed in a plurality of placement regions arranged in a circumferential direction with respect to a central axis line of the rotary shaft and is held by the rotary stage. The rotary stage is accommodated in an internal space of a susceptor. In this internal space, a gas supply mechanism generates a process gas flow along a direction orthogonal to the axis line from the outside of the rotary stage. A heat insulating material is installed in a heat insulating region in the internal space of the susceptor. The heat insulating region is located more outwardly from the axis line than positions in the placement regions nearest to the central axis line and more inwardly from the central axis line than positions in the placement regions farthest from the axis line.
摘要:
The invention relates to a method for monolithically depositing a monocrystalline IV-IV layer that glows when excited and that is composed of a plurality of elements of the IV main group, in particular a GeSn or Si-GeSn layer, said IV-IV layer having a dislocation density less than 6 cm -2 , on an IV substrate, in particular a silicon or germanium substrate, comprising the following steps: providing a hydride of a first IV element (A), such as Ge 2 H 6 or Si 2 H 6 ; providing a halide of a second IV element (B), such as SnCl 4 ; heating the substrate to a substrate temperature that is less than the decomposition temperature of the pure hydride or of a radical formed therefrom and is sufficiently high that atoms of the first element (A) and of the second element (B) are integrated into the surface in crystalline order, wherein the substrate temperature lies, in particular, in a range between 300°C and 475°C; producing a carrier gas flow of an inert carrier gas, in particular N 2 , Ar, He, which in particular is not H 2 ; transporting the hydride and the halide and decomposition products arising therefrom to the surface at a total pressure of at most 300 mbar; depositing the IV-IV layer, or a layer sequence consisting of IV-IV layers of the same type, having a thickness of at least 200 nm, wherein the deposited layer is, in particular, a Si y Ge 1 -x-y Sn layer, with x > 0.08 and y ≤ 1.