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公开(公告)号:EP1186002A4
公开(公告)日:2009-01-14
申请号:EP00913858
申请日:2000-03-10
申请人: CALIFORNIA INST OF TECHN
发明人: JIANG FUKANG , HAN ZHIGANG , WANG XUAN-QI , TAI YU-CHONG
IPC分类号: B81C1/00 , B81B3/00 , B81B7/02 , H01L21/00 , H01L21/302 , H01L21/3065 , H01L29/84
CPC分类号: B81C1/00246 , B81B2203/0127 , B81C2203/0735
摘要: A combined IC/Mems process forms the IC parts first, and then forms the MEMS parts (110). One option forms a parylene overlayer, then forms a cavity under the parylene overlayer.