CURRENT REDISTRIBUTION IN A PRINTED CIRCUIT BOARD
    2.
    发明公开
    CURRENT REDISTRIBUTION IN A PRINTED CIRCUIT BOARD 审中-公开
    STROMUMVERTEILUNG BEI EINER LEITERPLATTE

    公开(公告)号:EP2912928A1

    公开(公告)日:2015-09-02

    申请号:EP13735145.8

    申请日:2013-06-25

    Abstract: In one implementation, a multilayered printed circuit board is configured to redirect current distribution. The current may be distributed by steering, blocking, or otherwise manipulating current flows. The multilayered printed circuit board includes at least one power plane layer. The power plane layer does not distribute current evenly. Instead, the power plane layer includes multiple patterns with different resistances. The patterns may include a hatching pattern, a grid pattern, a directional pattern, a slot, a void, or a continuous pattern. The pattern is a predetermined spatial variation such that current flows in a first area differently than current flows in a second area.

    Abstract translation: 在一个实现中,多层印刷电路板被配置为重定向电流分布。 电流可以通过转向,阻塞或以其它方式操纵电流来分配。 多层印刷电路板包括至少一个电源层。 电源层不均匀分布电流。 替代地,功率平面层包括具有不同电阻的多个图案。 图案可以包括阴影图案,网格图案,方向图案,狭缝,空隙或连续图案。 图案是预定的空间变化,使得电流在第一区域中不同于电流在第二区域中流动。

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