公开(公告)号：EP2579940B1

公开(公告)日：2014-03-19

申请号：EP11725709.7

申请日：2011-06-08

申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives ,  Chambre de Commerce et d'Industrie de Paris (Esiee Paris)

发明人： SCORSONE, Emmanuel ,  BERGONZO, Philippe ,  BONNAURON, Mathias ,  LISSORGUES, Gaëlle ,  ROUSSEAU, Lionel

IPC分类号： H01L21/02 ,  H01L21/64 ,  H01L29/16 ,  H01L29/45 ,  A61N1/05 ,  A61N1/36

CPC分类号： H01L21/64 ,  A61N1/0543 ,  A61N1/36046 ,  H01L21/02444 ,  H01L21/02527 ,  H01L21/02579 ,  H01L21/02601 ,  H01L21/0262 ,  H01L21/02628 ,  H01L21/02639 ,  H01L29/1602 ,  H01L29/45

公开(公告)号：EP2579940A1

公开(公告)日：2013-04-17

申请号：EP11725709.7

申请日：2011-06-08

申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives ,  Chambre de Commerce Et d'Industrie de Paris (Esiee Paris)

发明人： SCORSONE, Emmanuel ,  BERGONZO, Philippe ,  BONNAURON, Mathias ,  LISSORGUES, Gaëlle ,  ROUSSEAU, Lionel

IPC分类号： A61N1/36 ,  A61N1/05 ,  H01L21/20

CPC分类号： H01L21/64 ,  A61N1/0543 ,  A61N1/36046 ,  H01L21/02444 ,  H01L21/02527 ,  H01L21/02579 ,  H01L21/02601 ,  H01L21/0262 ,  H01L21/02628 ,  H01L21/02639 ,  H01L29/1602 ,  H01L29/45

摘要： The invention relates to a method for manufacturing an intraocular retinal implant including a flexible plate made of insulating material, one face of which is provided with a plurality of electrodes made of doped diamond connected to interconnection lines. Said method includes providing a mold capable of supporting the growth of a layer of doped diamond, said mold comprising, on one of the faces thereof, a set of elements which are all depressed or all projecting with respect to the surface of said face, and which constitute a cavity for the electrodes of the implant which it is desired to obtain; producing the doped diamond electrodes by growing a layer of doped diamond in all or part of the space occupied by the elements of the cavity; forming a first insulating layer on the face of the mold comprising the cavity; producing the interconnection lines by depositing an electrically conductive material at least in the spaces not covered by the first insulating layer; forming a second insulating layer on the face of the mold including the cavity, said second layer covering the interconnection lines, the first and second insulating layers forming the flexible plate of the implant; and removing the mold.