摘要:
L'invention concerne un procédé de traitement pour recyclage d'un module photovoltaïque (M), ledit module photovoltaïque (M) comprenant ; - Une première couche (1) en face arrière du module photovoltaïque (M), cette première couche étant réalisée à base d'au moins un matériau polymère, - Une deuxième couche (2), dite couche intermédiaire, comprenant une enveloppe d'encapsulation (21) dans laquelle sont placées des cellules photovoltaïques (20), - Une troisième couche (3) formant un deuxième élément de protection en face avant du module photovoltaïque (M), - Le procédé comportant : - Une première étape d'usinage (E2) de la première couche du module photovoltaïque, configurée pour enlever la matière formant ledit premier élément de protection, - Une deuxième étape d'usinage (E3, E3') de ladite couche intermédiaire, configurée pour enlever la matière formant l'enveloppe d'encapsulation (21) et/ou la matière formant lesdites cellules photovoltaïques (20).
摘要:
Procédé de traitement pour recyclage d'un dispositif fonctionnel, notamment d'un module photovoltaïque (M), le dispositif fonctionnel comportant au moins l'un d'une cellule photovoltaïque (20) ou d'une diode électroluminescente (DEL) noyée dans un encapsulant (21) comportant un matériau polymère, le procédé comportant les étapes suivantes : (a) irradiation du dispositif fonctionnel par un traitement ionisant modifiant les propriétés mécaniques de l'encapsulant, et (b) usinage de l'encapsulant (21), afin de réduire celui-ci en copeaux.
摘要:
L'objet principal de l'invention est un support (1) à la découpe par fil à abrasifs liés d'au moins une pièce à découper réalisée en un premier matériau, caractérisé en ce que le support (1) est réalisé par un assemblage de matériaux différents comprenant au moins le premier matériau, le premier matériau du support (1) étant réparti de manière inhomogène avec les autres matériaux du support (1).
摘要:
The invention primarily relates to a device (1) for wire cutting (2) of a piece to be cut (3), intended to move with respect to the wire (2) to enable the cut, comprising at least one first rotary member (5a) rotating around a first axis of rotation (Xa) and one second rotary member (5b) rotating around a second axis of rotation (Xb), said first (Xa) and second (Xb) axes of rotation being substantially parallel to one another, said at least one first (5a) and one second (5b) rotary members driving the wire (2) substantially perpendicular to said first (Xa) and second (Xb) axes of rotation, the wire (2) resting against the external surface (Sa, Sb) of each of said at least one first (5a) and one second (5b) rotary members extending around the corresponding axis of rotation (Xa, Xb), at least one of the said at least one first (5a) and one second (5b) rotary members comprising lubrication means (6a, 6b) of the wire (2) configured to allow circulation of a lubricating liquid from the centre thereof (Ca, Cb) to the external surface thereof (Sa, Sb) in contact with the wire (2), and the lubrication means (6a) comprising a lubrication liquid (F) feed device (7a), mounted on the axis of rotation (Xa) of said at least one of said at least one first (5a) and second (5b) rotary members, to supply the centre thereof (Ca) with lubrication liquid (F).
摘要:
The method involves: a. a step of causing the wire (1) to move b. concomitantly, a step of bringing the wire (1) and the workpiece (3) into contact so as to machine at least a groove in the workpiece (3), c. a vibration-inducing step during which the wire passes through at least one reservoir (8A, 8B) containing a transmission fluid to which vibrations produced by ultrasound are restituted, said reservoir being situated in the direct vicinity of the workpiece (3), so as to apply to the wire (1) vibrations which are transmitted into the groove. The reservoir of transmission fluid is formed by a cavity formed in a sonotrode (7A, 7B).
摘要:
The main subject matter of the invention relates to a device (1) for cutting by wire (2), comprising at least one first rotary member (5b), characterized in that the device (1) comprises a detection and measurement system (10) of the sag (F) formed on the wire (2), comprising at least one sensor (6) for detection of the presence or non-presence of the wire (2), included in the interior of at least the one said first rotary member (5a) and second rotary member (5b), the detection sensor (6) being configured to supply a signal on the detection or non-detection of the wire (2), providing information on the presence or otherwise of a sag (F), and in that the detection and measurement system (10) further comprises an electronic processing system (8) configured to determine the measurement of the sag (F) from the detection signal.
摘要:
The invention relates to an abrasive sawing or polishing substrate comprising: a substrate; a binder C1 covering at least part of the substrate; abrasive particles having an at least partial coating C2; a coating C3 covering the binder C1 and the abrasive particles coated with C2; and at least one luminescent compound. The abrasive particles coated with C2 are in contact with the binder C1 and with the coating C3.