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公开(公告)号：EP2121509A2
公开(公告)日：2009-11-25
申请号：EP07857609.7
申请日：2007-12-14
IPC分类号： B81B1/00
CPC分类号： H01L23/055 , B81B2207/012 , B81B2207/095 , B81B2207/096 , B81B2207/097 , B81C1/0023 , B81C1/00301 , H01L2224/73204 , H01L2924/01019 , H01L2924/01079 , H01L2924/01322 , H01L2924/1433 , H01L2924/1461 , H01L2924/00
摘要： The invention relates to a method for producing an encapsulation module (A) and/or for encapsulating a micromechanical arrangement, wherein electronic connection means, such as through contacts (2), electrical lines, contacts and/or electronic structures are produced from a blank (1) of electrically conducting semiconductor material, in particular, doped silicon, by means of one or more structuring processes and/or etching processes, wherein in the process of the formation of the electronic connector means, a plinth (6) of the semiconductor material is generated on which the electronic connector means are arranged, subsequently being embedded in an embedding material (9) and the embedding material and/or the semiconductor plinth (6) are removed after the embedding to the extent that a defined number of the electronic connector means have electrical contact on at least one of the outer surfaces (7, 8) of the encapsulation module (A) and during the process of the formation of the electronic connector means with the at least one structuring and/or etching process at least one isolated material mound on each of which a through contact (2) is arranged, are formed on the plinth of the semiconductor material (6), which forms a semiconductor electrode (3). The invention further relates to an encapsulation module and/or a micromechanical arrangement with at least one through contact (2) and at least one semiconductor electrode (3) and the use thereof in motor vehicles.
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公开(公告)号：EP2195662A1
公开(公告)日：2010-06-16
申请号：EP08805461.4
申请日：2008-09-29
申请人： VTI TECHNOLOGIES OY
IPC分类号： G01P3/02 , G01P15/097 , G01C19/56
CPC分类号： G01C19/5712
摘要： The invention relates to measuring devices to be used in the measuring of angular velocity and, more precisely, to vibrating micromechanical sensors of angular velocity. In a sensor of angular velocity according to the invention, a mass is supported to the frame of the sensor component by means of an asymmetrical spring structure (1), (2), (3), (4), (22), (24) in such a way, that the coupling from one mode of motion to another, conveyed by the spring (1), (2), (3), (4), (22), (24), cancels or alleviates the coupling caused by the non-ideality due to the skewness in the springs or in their support. The structure of the sensor of angular velocity according to the invention enables reliable measuring with good performance, particularly in small vibrating micromechanical solutions for sensors of angular velocity.
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