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    VERKAPSELUNGSMODUL, VERFAHREN ZU DESSEN HERSTELLUNG UND VERWENDUNG
    2.
    发明公开
    VERKAPSELUNGSMODUL, VERFAHREN ZU DESSEN HERSTELLUNG UND VERWENDUNG 审中-公开
    封装的制造方法和使用

    公开(公告)号：EP2121509A2

    公开(公告)日：2009-11-25

    申请号：EP07857609.7

    申请日：2007-12-14

    申请人： Continental Teves AG & Co. oHG ,  VTI Technologies Oy

    发明人： HARTMANN, Bernhard ,  HILSER, Roland ,  KUISMA, Heikki ,  TORKKELI, Altti

    IPC分类号： B81B1/00

    CPC分类号： H01L23/055 ,  B81B2207/012 ,  B81B2207/095 ,  B81B2207/096 ,  B81B2207/097 ,  B81C1/0023 ,  B81C1/00301 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/00

    摘要： The invention relates to a method for producing an encapsulation module (A) and/or for encapsulating a micromechanical arrangement, wherein electronic connection means, such as through contacts (2), electrical lines, contacts and/or electronic structures are produced from a blank (1) of electrically conducting semiconductor material, in particular, doped silicon, by means of one or more structuring processes and/or etching processes, wherein in the process of the formation of the electronic connector means, a plinth (6) of the semiconductor material is generated on which the electronic connector means are arranged, subsequently being embedded in an embedding material (9) and the embedding material and/or the semiconductor plinth (6) are removed after the embedding to the extent that a defined number of the electronic connector means have electrical contact on at least one of the outer surfaces (7, 8) of the encapsulation module (A) and during the process of the formation of the electronic connector means with the at least one structuring and/or etching process at least one isolated material mound on each of which a through contact (2) is arranged, are formed on the plinth of the semiconductor material (6), which forms a semiconductor electrode (3). The invention further relates to an encapsulation module and/or a micromechanical arrangement with at least one through contact (2) and at least one semiconductor electrode (3) and the use thereof in motor vehicles.

    ENERGY HARVESTING / TIRE PRESSURE, TEMPERATURE AND TIRE DATA TRANSMITTER
    4.
    发明公开
    ENERGY HARVESTING / TIRE PRESSURE, TEMPERATURE AND TIRE DATA TRANSMITTER 有权
    STROMER令人信服DEVICE用于发送数据的轮胎压力和温度轮胎和其它数据

    公开(公告)号：EP2614583A1

    公开(公告)日：2013-07-17

    申请号：EP11823120.8

    申请日：2011-09-07

    申请人： Murata Electronics Oy ,  Toyota Motor Corporation

    发明人： KUISMA, Heikki ,  NARITA, Katsutoshi

    IPC分类号： H02N11/00 ,  H02N2/18

    CPC分类号： B60C23/0411 ,  H01L41/1136 ,  H02N1/08 ,  H02N2/18

    摘要： The invention embodies a harvester (12) to convert energy from mechanical domain to electrical domain. The harvester comprises at least one inertial body (6), at least one beam (7, 9), a support (8) to said at least one beam (7, 9) and transducer means (10, 16), wherein said at least one beam (7, 9) configures the inertial body (6) into a pendulum structure being suspended from said support (8) so that the beam (7, 9) is allowed to bend according to the kinetic state changes of the inertial body (6), and is configured to interact with at least one transducer means (10) that is/are configured to produce change in the electrical state of said transducer means (10, 16) responsively to the kinetic state of the beam (7, 9). The invention also shows harvester module, matrix and a harvester system comprising at least one embodied harvester. The invention also shows a tire and a foot wear that comprises at least one harvester embodied.

    A METHOD OF MAKING A SYSTEM-IN-PACKAGE DEVICE, AND A SYSTEM-IN-PACKAGE DEVICE
    7.
    发明公开
    A METHOD OF MAKING A SYSTEM-IN-PACKAGE DEVICE, AND A SYSTEM-IN-PACKAGE DEVICE 审中-公开
    VERFAHREN ZUR HERSTELLUNG EINER系统IM-PAKET-VORRICHTUNG系统IM-PAKET-VORRICHTUNG

    公开(公告)号：EP2727146A1

    公开(公告)日：2014-05-07

    申请号：EP12805018.4

    申请日：2012-06-29

    申请人： Murata Electronics Oy

    发明人： KUISMA, Heikki

    IPC分类号： H01L25/04 ,  H01L25/16 ,  B81C1/00

    摘要： A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer.

    摘要翻译： 公开了一种制造系统级封装器件的方法，以及一种系统级封装器件。 在该方法中，至少一个具有预定尺寸的第一种模具，具有预定尺寸的至少一个第二种类模具，并且系统级装置中的至少一个另外的部件被包括在系统包装装置中。 选择第一和第二种类模具中的至少一种用于重新定尺，并且将材料添加到所选择的模具的至少一侧，使得添加的材料和所选择的模具形成重新定尺的模具结构。 在重新定型的模具结构上形成连接层。 重新定尺寸的模具结构的尺寸被设计成允许安装未选择的模具和至少一个另外的部件通过连接层与重新定向的模具结构接触。