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1.发明公开METALL-KERAMIK-SUBSTRAT F R ELEKTISCHE SCHALTKREISE- ODER MO DULE, VERFAHREN ZUM HERSTELLEN EINES SOLCHEN SUBSTRATES SOWIE MODUL MIT EINEM SOLCHEN SUBSTRAT 有权金属陶瓷基板Elektische circuits-或模块用于生产这样的基材，基材和模块
公开(公告)号：EP1514459A1
公开(公告)日：2005-03-16
申请号：EP03727202.8
申请日：2003-04-11
IPC分类号： H05K3/46
CPC分类号： H05K3/4667 , H01L23/3735 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/162 , H01L2224/32225 , H01L2224/48091 , H01L2224/48111 , H01L2224/48137 , H01L2224/48227 , H01L2224/49 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12044 , H01L2924/1301 , H01L2924/15787 , H01L2924/181 , H05K1/0306 , H05K1/092 , H05K3/28 , H05K2201/0352 , H05K2201/0355 , H05K2201/09972 , H05K2203/1476 , Y10T29/49227 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： The invention relates to a metal-ceramic substrate for electric circuits or modules, said substrate comprising a ceramic layer which is provided with at least one metallic layer of a first type applied to a surface of said ceramic layer in a plane manner. An insulating layer consisting of a glass-containing material is applied to at least one partial region of a surface of the metallic layer of the first type, said surface opposing the ceramic layer, and a metallic layer of a second type is applied to the insulating layer, the insulating layer and the metallic layer of a second type respectively being thinner then the ceramic layer and the metallic layer of the first type.
摘要翻译： 到第一类型的金属层（12），其面向从含玻璃材料的绝缘层（14）上的陶瓷层（11）的厚度约为远的表面的至少一部分0.015 0.15毫米被应用。 在此绝缘层，第二类型的至少一个金属层（15）被施加，其厚度为0.015-0.15毫米。 一个独立的claimsoft包括用于制造衬底的。
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2.发明授权METALL-KERAMIK-SUBSTRAT FÜR ELEKTISCHE SCHALTKREISE- ODER MODULE, VERFAHREN ZUM HERSTELLEN EINES SOLCHEN SUBSTRATES SOWIE MODUL MIT EINEM SOLCHEN SUBSTRAT 有权金属陶瓷基板Elektische circuits-或模块用于生产这样的基材，基材和模块
公开(公告)号：EP1514459B1
公开(公告)日：2011-07-13
申请号：EP03727202.8
申请日：2003-04-11
IPC分类号： H05K3/46
CPC分类号： H05K3/4667 , H01L23/3735 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/162 , H01L2224/32225 , H01L2224/48091 , H01L2224/48111 , H01L2224/48137 , H01L2224/48227 , H01L2224/49 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12044 , H01L2924/1301 , H01L2924/15787 , H01L2924/181 , H05K1/0306 , H05K1/092 , H05K3/28 , H05K2201/0352 , H05K2201/0355 , H05K2201/09972 , H05K2203/1476 , Y10T29/49227 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： The invention relates to a metal-ceramic substrate for electric circuits or modules, said substrate comprising a ceramic layer which is provided with at least one metallic layer of a first type applied to a surface of said ceramic layer in a plane manner. An insulating layer consisting of a glass-containing material is applied to at least one partial region of a surface of the metallic layer of the first type, said surface opposing the ceramic layer, and a metallic layer of a second type is applied to the insulating layer, the insulating layer and the metallic layer of a second type respectively being thinner then the ceramic layer and the metallic layer of the first type.
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