公开(公告)号：EP3214134A1

公开(公告)日：2017-09-06

申请号：EP15848426.1

申请日：2015-09-29

申请人： Daikin Industries, Ltd.

发明人： IIDA, Junya ,  NAKANISHI, Koji ,  NAKAUE, Ayane ,  KONO, Hideki

IPC分类号： C08L71/10 ,  C08L27/12

CPC分类号： H01B3/445 ,  C08G2650/40 ,  C08L27/12 ,  C08L27/18 ,  C08L27/20 ,  C08L29/10 ,  C08L71/00 ,  C08L71/10

摘要： The present invention aims to provide a resin composition capable of providing a molded article that has high slidability and high impact resistance, as well as excellent tensile strength. The present invention relates to a resin composition containing an aromatic polyether ketone resin (I) and a fluororesin (II). The composition preferably has a sodium content of 120 ppm or less relative to the composition or a calcium content of 15 ppm or less relative to the composition.

摘要翻译： 本发明的目的在于提供一种树脂组合物，其能够提供具有高滑动性和高耐冲击性以及优异的拉伸强度的成型制品。 本发明涉及含有芳香族聚醚酮树脂（I）和氟树脂（II）的树脂组合物。 相对于组合物，组合物的钠含量优选为120ppm或更低，或相对于组合物的钙含量为15ppm或更低。

公开(公告)号：EP4317307A1

公开(公告)日：2024-02-07

申请号：EP22781277.3

申请日：2022-03-31

申请人： DAIKIN INDUSTRIES, LTD.

发明人： MUKAE, Hirofumi ,  KISHIKAWA, Yosuke ,  YAMANAKA, Taku ,  KATO, Taketo ,  SAKAKURA, Atsushi ,  ITOH, Ryuo ,  KUBOTA, Hiroki ,  NAKAUE, Ayane

IPC分类号： C08L27/12 ,  C08F214/26 ,  C08J3/12 ,  C08J3/20

摘要： Provided is a fluororesin composition having excellent tensile properties while containing a fluororesin having a history of being heated to the melting point thereof or higher, and a molded article obtainable from the fluororesin composition. The disclosure provides a non-melt-flowable fluororesin composition containing: a non-melt-flowable fluororesin A having a history of being heated to a melting point thereof or higher; and a melt-flowable fluororesin B.

公开(公告)号：EP4108723A1

公开(公告)日：2022-12-28

申请号：EP21767966.1

申请日：2021-03-05

申请人： Daikin Industries, Ltd.

发明人： MUKAE, Hirofumi ,  KONO, Hideki ,  KOMORI, Masaji ,  NAKAUE, Ayane ,  ITO, Hiroshi

IPC分类号： C08L27/18 ,  C08L71/08 ,  C08K3/38

摘要： The disclosure provides a resin composition having high heat dissipation and low relative permittivity while also having excellent moldability. The disclosure relates to a resin composition containing: a melt-fabricable fluororesin containing at least one functional group selected from the group consisting of a carbonyl group-containing group and a hydroxy group; at least one fluorine-free resin selected from the group consisting of a liquid crystal polymer, a polyarylene sulfide, and an aromatic polyether ketone; and particulate boron nitride.

公开(公告)号：EP3604431A1

公开(公告)日：2020-02-05

申请号：EP18784843.7

申请日：2018-04-11

申请人： Daikin Industries, Ltd.

发明人： YAMAGUCHI, Shuhei ,  NAKAUE, Ayane ,  KOMORI, Masaji ,  KONO, Hideki

IPC分类号： C08L27/16 ,  C08L27/18 ,  C08L33/12

摘要： The invention provides a resin composition and a molded article having a high tensile elongation and excellent transparency. The resin composition contains a fluorine-containing polymer and a methacrylate resin. The fluorine-containing polymer and the methacrylate resin have a mass ratio of 35/65 to 95/5. The fluorine-containing polymer contains a vinylidene fluoride unit and a tetrafluoroethylene unit. The vinylidene fluoride unit and the tetrafluoroethylene unit have a mole ratio of 81/19 to 99/1.

公开(公告)号：EP3988300A1

公开(公告)日：2022-04-27

申请号：EP20840634.8

申请日：2020-07-10

申请人： Daikin Industries, Ltd.

发明人： MUKAE, Hirofumi ,  KOMORI, Hirokazu ,  KOMORI, Masaji ,  KONO, Hideki ,  NAKAUE, Ayane

IPC分类号： B32B27/18 ,  B32B27/30 ,  C08L27/12 ,  B32B15/08 ,  C08K3/38 ,  H05K1/03

摘要： The disclosure provides, for example, a resin composition for a circuit board having excellent low-dielectric characteristics and excellent heat dissipation. The resin composition for a circuit board contains a melt-fabricable fluororesin and a particulate boron nitride.