公开(公告)号：EP0871568A4

公开(公告)日：2002-05-08

申请号：EP96918387

申请日：1996-06-07

申请人： DEXTER CORP

发明人： GEBHARDT WILLIAM F ,  PAPALIA ROCCO

IPC分类号： H05K1/03 ,  B32B15/08 ,  H05K3/04 ,  H05K3/10 ,  H05K3/38 ,  B32B9/00

CPC分类号： B32B15/08 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2457/08 ,  H05K3/045 ,  H05K3/107 ,  H05K3/386 ,  H05K2201/0133 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2203/0108 ,  H05K2203/1545 ,  Y10S428/901 ,  Y10T428/24917

摘要： A thin film printed board precursor containing a laminate of a dielectric thermosetting resin film layer (6) and a heat and electrically conductive metal foil layer (5) in direct adhesive bonding with a side of the resin film (6), optionally containing a supporting layer (22) comprising one or more of fiber, fabric and thermoplastic polymer in contact with the other side of the resin layer (6), wherein the dielectric thermosetting resin layer (6) has an unimpeded thickness that is at least equal to that of the foil layer (5) bonded to it.

摘要翻译： 一种薄膜印刷电路板前体，其包含介电热固性树脂薄膜层和导热金属箔层之间的层压体，其与树脂薄膜的一侧直接粘接，任选地包含一个支撑层，该支撑层包括纤维，织物 以及与树脂层的另一侧接触的热塑性聚合物，其中所述介电热固性树脂层具有至少等于与其粘合的箔层的厚度的无阻碍厚度。

公开(公告)号：EP0836795A4

公开(公告)日：2000-05-10

申请号：EP96923244

申请日：1996-06-07

申请人： DEXTER CORP

发明人： GEBHARDT WILLIAM F ,  PAPALIA ROCCO

IPC分类号： B32B15/08 ,  H05K3/00 ,  H05K3/04 ,  H05K3/10 ,  H05K3/38

CPC分类号： H05K3/045 ,  H05K3/107 ,  H05K3/386 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T156/1039

摘要： A mechanically debossed foil (21) with a circuit pattern is laminated to a thin isotropic uncured and ungelled thermosetting resin film (11). The process comprises debossing a metal foil using a shaping tool with a surface possessing an embossed circuitry pattern, as described in the prior art. The foil (21) is separated from the tool. The separated metal foil (21) is placed in contact with the resin film (11) and forced into the film without significantly altering the foil shape. An optional support layer (18) may be bonded to the film.

公开(公告)号：EP0842045A4

公开(公告)日：1999-11-10

申请号：EP96919307

申请日：1996-06-07

申请人： DEXTER CORP

发明人： GEBHARDT WILLIAM F ,  PAPALIA ROCCO

IPC分类号： H05K1/03 ,  B29C43/02 ,  B29C59/02 ,  B32B15/08 ,  H05K3/04 ,  H05K3/38 ,  B32B9/04 ,  B21F21/00 ,  B22F5/00 ,  B32B15/04 ,  B32B17/00 ,  B32B31/00

CPC分类号： B32B15/08 ,  B29C43/021 ,  B29C2043/025 ,  B29K2101/10 ,  B32B15/082 ,  B32B15/092 ,  B32B15/20 ,  B32B2307/708 ,  B32B2311/12 ,  B32B2333/04 ,  B32B2363/00 ,  B32B2457/08 ,  H05K3/045 ,  H05K3/386 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/31504 ,  Y10T428/31507 ,  Y10T428/31678 ,  Y10T428/31786 ,  Y10T428/31935

摘要： A thin thermosetting resin film that is amenable to being subjected to a debossing procedure that debosses a grooved printed circuit pattern thereon with minimal loss of debossment precision of the grooved pattern, which pattern and the grooving can be cured to produce a thermoset resin film that can be employed for eventually generating a printed board. The thermosetting resin film has the following qualities: a) it is designed for shaping by processes such as stamping, compression molding, transfer molding, injection molding, and the like without the need for constraining flow at the edges of the resin film; b) the resin is nonconductive, i.e., the resin can be used as a dielectric substrate; c) it is a thin film that is sufficiently uniform in thickness in order to provide consistent heat shaping capability across the breadth of the film, and the thickness should be sufficient to accept the shape imposed by the shaping process; d) the film possesses low flow over a broad temperature range so that it does not flow uncontrollably while undergoing cure conditions, and when placed under pressure, only the portions that are superimposed over a groove or cavity in the case of a female mold, or over a protuberance in the case of a male mold, will be caused to flow because of pressure imposed on the film; and e) the film gels or achieves properties similar to a state of gelation, over conditions leading to cure, that satisfy commercial conditions.