公开(公告)号：EP2875703A4

公开(公告)日：2016-05-25

申请号：EP13820665

申请日：2013-07-17

Applicant: DIALIGHT CORP

Inventor： FETTERLY RICHARD H ,  HEBBORN KEVIN A ,  VERDES ANTHONY ,  JENKINS KENNETH ,  MERRIAM VIRGINIA

IPC: H05B33/08 ,  F21V23/00

CPC classification number: H05B33/0854 ,  F21V23/003 ,  F21V29/77 ,  F21Y2115/10

Abstract: The present disclosure provides a method for powering a light fixture to provide a constant light output. In one embodiment, the method includes providing a current to one or more light emitting diodes (LEDs), monitoring an external ambient temperature and increasing the current to the one or more LEDs as the external ambient temperature rises to maintain the constant light output.

Abstract translation: 本公开提供了一种为灯具供电以提供恒定的光输出的方法。 在一个实施例中，该方法包括向一个或多个发光二极管（LED）提供电流，监视外部环境温度并且随着外部环境温度升高而增加到一个或多个LED的电流以维持恒定的光输出。

公开(公告)号：EP2819826A4

公开(公告)日：2015-11-25

申请号：EP13755891

申请日：2013-02-27

Applicant: DIALIGHT CORP

Inventor： JENKINS KENNETH ,  HEBBORN KEVIN A ,  LEIB WILLIAM S III ,  WEIMER DAVID

IPC: B29C39/10 ,  H05K5/06

CPC classification number: B29C39/10 ,  B29K2675/00 ,  B29K2683/00 ,  B29K2863/00 ,  H05K5/064

Abstract: The present disclosure is directed to a method for potting an electrical module. In one embodiment, the method includes placing the electrical component in a potting mold, wherein the potting mold comprises an interior topology that matches a topology of one or more components of the electrical module, filling the potting mold with a potting compound and curing the potting compound over the electrical module.

Abstract translation: 本公开涉及一种用于封装电气模块的方法。 在一个实施例中，该方法包括将电气部件放置在灌封模具中，其中灌封模具包括匹配电气模块的一个或多个部件的拓扑结构的内部拓扑结构，用灌封化合物填充灌封模具并固化灌封 复合电气模块。

公开(公告)号：EP3180968A4

公开(公告)日：2017-12-27

申请号：EP15831847

申请日：2015-08-12

Applicant: DIALIGHT CORP

Inventor： PECK JOHN PATRICK ,  JENKINS KENNETH ,  BOEGE SAMUAL DAVID

IPC: H05K7/20 ,  F21S2/00 ,  F21V3/00 ,  F21V23/00 ,  F21V29/76 ,  F21V29/77 ,  F21V31/00 ,  F21Y113/00 ,  F21Y115/10

CPC classification number: F21V29/773 ,  F21S2/005 ,  F21V3/00 ,  F21V23/009 ,  F21V23/023 ,  F21V29/763 ,  F21V29/83 ,  F21V31/005 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10

Abstract: The present disclosure is directed to a light emitting diode (LED) light module. In one embodiment, the LED light module includes a plurality of light sections and a plurality of open sections formed by a plurality of heat sink fins between the plurality of light sections, wherein each one of the plurality of light sections is adjacent to two different light sections of the plurality of light sections.

公开(公告)号：EP2286468A4

公开(公告)日：2013-11-06

申请号：EP09743402

申请日：2009-05-04

Applicant: DIALIGHT CORP

Inventor： OESTERHELD KLAUS ,  JENKINS KENNETH

IPC: H05K1/14 ,  H05K3/36

CPC classification number: F21K9/20 ,  F21K9/30 ,  F21W2111/00 ,  H05K1/141 ,  H05K1/181 ,  H05K3/366 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10106

Abstract: The present invention is directed to a surface mount circuit board indicator. In one embodiment the surface mount circuit board indicator includes a printed circuit board (PCB) having at least one light emitting diode (LED) die, one or more traces and at least one lens, a housing comprising at least one opening on a side along a perimeter of the housing, wherein the PCB is coupled to the housing such that a light output surface of the at least one LED die faces a same direction as the at least one opening and at least one alignment pin coupled to the housing.

Abstract translation: 本发明涉及一种表面贴装电路板指示器。 在一个实施例中，表面贴装电路板指示器包括具有至少一个发光二极管（LED）裸片，一个或多个迹线和至少一个透镜的印刷电路板（PCB），壳体包括沿着一侧的至少一个开口 壳体的周边，其中PCB耦合到壳体，使得至少一个LED管芯的光输出表面面向与至少一个开口相同的方向，以及耦合到壳体的至少一个对准销。