公开(公告)号：EP0579456B1

公开(公告)日：1997-06-18

申请号：EP93305375.3

申请日：1993-07-08

申请人： DOW CORNING CORPORATION

发明人： Ballance, David Stephen ,  Eckstein, Marie Norton ,  Loboda, Mark John ,  Michael, Keith Winton ,  Shelton, Liberty Belle

IPC分类号： H01L21/48 ,  H01L23/29

CPC分类号： H01L21/481 ,  C04B41/4554 ,  C04B41/5035 ,  C04B2111/00844 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/02337 ,  H01L21/316 ,  H01L23/296 ,  H01L2924/0002 ,  C04B41/4519 ,  C04B41/5027 ,  H01L2924/00

公开(公告)号：EP0579456A3

公开(公告)日：1994-04-20

申请号：EP93305375.3

申请日：1993-07-08

申请人： DOW CORNING CORPORATION

发明人： Ballance, David Stephen ,  Eckstein, Marie Norton ,  Loboda, Mark John ,  Michael, Keith Winton ,  Shelton, Liberty Belle

IPC分类号： H01L21/48 ,  H01L23/29

CPC分类号： H01L21/481 ,  C04B41/4554 ,  C04B41/5035 ,  C04B2111/00844 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/02337 ,  H01L21/316 ,  H01L23/296 ,  H01L2924/0002 ,  C04B41/4519 ,  C04B41/5027 ,  H01L2924/00

摘要： The present invention relates to a low temperature method of forming silica-containing ceramic coatings on substrates. The method involves applying a coating comprising a silicon hydride containing resin on a substrate and heating the coated substrate under an environment comprising nitrous oxide at a temperature sufficient to convert the resin to the silica-containing ceramic coating. This method is especially valuable for forming protective and dielectric coatings on electronic devices.

摘要翻译： 本发明涉及在基材上形成含二氧化硅的陶瓷涂层的低温方法。 该方法包括将包含含氢化硅树脂的涂层涂覆在基材上，并在足以将树脂转化为含二氧化硅的陶瓷涂层的温度下，在包含氧化亚氮的环境下加热涂覆的基材。 此方法对于在电子设备上形成保护和介电涂层特别有用。

公开(公告)号：EP0579456A2

公开(公告)日：1994-01-19

申请号：EP93305375.3

申请日：1993-07-08

申请人： DOW CORNING CORPORATION

发明人： Ballance, David Stephen ,  Eckstein, Marie Norton ,  Loboda, Mark John ,  Michael, Keith Winton ,  Shelton, Liberty Belle

IPC分类号： H01L21/48 ,  H01L23/29

CPC分类号： H01L21/481 ,  C04B41/4554 ,  C04B41/5035 ,  C04B2111/00844 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/02337 ,  H01L21/316 ,  H01L23/296 ,  H01L2924/0002 ,  C04B41/4519 ,  C04B41/5027 ,  H01L2924/00

摘要： The present invention relates to a low temperature method of forming silica-containing ceramic coatings on substrates. The method involves applying a coating comprising a silicon hydride containing resin on a substrate and heating the coated substrate under an environment comprising nitrous oxide at a temperature sufficient to convert the resin to the silica-containing ceramic coating. This method is especially valuable for forming protective and dielectric coatings on electronic devices.

摘要翻译： 本发明涉及在基材上形成二氧化硅的陶瓷涂层的低温方法。 该方法包括将包含含硅氢化物的树脂的涂层施加在基底上，并在包含一氧化二氮的环境下，在足以将树脂转化为含二氧化硅的陶瓷涂层的温度下加热涂覆的基底。 该方法对于在电子设备上形成保护性和电介质涂层特别有价值。