公开(公告)号：EP0834914A3

公开(公告)日：1999-01-20

申请号：EP97307291.1

申请日：1997-09-19

申请人： DOW CORNING CORPORATION

发明人： Bearinger, Clayton R. ,  Camilletti, Robert Charles ,  Haluska, Loren Andrew ,  Michael, Keith Winton

IPC分类号： H01L21/56 ,  H01L23/31

CPC分类号： H01L23/573 ,  H01L23/291 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： The present invention relates to a ceramic coating composition comprising a preceramic material such as silicon oxide precursors, silicon carbonitride precursors, silicon carbide precursors and silicon nitride precursors and a flux material such as B 2 O 3 , PBO 2 , P 2 O 5 and Bi 2 O 3 . The present invention also relates to a substrate such as an electronic device having said coating applied and ceramified thereon.

公开(公告)号：EP0779653A3

公开(公告)日：1999-01-20

申请号：EP96119804.1

申请日：1996-12-10

申请人： DOW CORNING CORPORATION

发明人： Bearinger, Clayton R. ,  Camilletti, Robert Charles ,  Kilby, Jack St. Clair ,  Haluska, Loren Andrew ,  Michael, Keith Winton

IPC分类号： H01L21/60

CPC分类号： H01L24/81 ,  C08L2666/54 ,  C09J183/04 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29076 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29291 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29344 ,  H01L2224/29388 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/321 ,  Y10T428/2857 ,  Y10T428/31663 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method and composition for joining flip chips back-side-up with respect to substrates, comprises applying an adhesive between the active side of the flip chip and the substrate. The adhesive is a conductive silicone pressure sensitive adhesive containing (i) a silicone resin, (ii) a siloxane gum, (iii) a conductive particulate material and, optionally, (iv) a peroxide catalyst. Suitable conductive particulate materials are silver-clad glass fibers; spherical gold particles; spherical hollow glass microspheres coated with silver, gold, nickel or copper; or spherical particles of metal alloys of Sn/Cu, Pb/Sn or Au/Sn. The adhesive is applied as a ball or bump itself, in conjunction with a solder ball or bump or in the form of tape sandwiched between the flip chip and the substrate.

公开(公告)号：EP0791567A1

公开(公告)日：1997-08-27

申请号：EP97300830.3

申请日：1997-02-10

申请人： DOW CORNING CORPORATION

发明人： Currie, Alexander Brian ,  Haines, Cathryn Marie ,  Little, Michael Dean ,  Michael, Keith Winton ,  Scheibert, Kristen Andrea

IPC分类号： C04B41/50 ,  H01L21/312 ,  H01L21/316 ,  H01L23/29

CPC分类号： H01L21/02126 ,  C04B35/62222 ,  C04B41/009 ,  C04B41/5035 ,  C04B2111/00844 ,  H01L21/02134 ,  H01L21/02337 ,  H01L21/31051 ,  H01L21/3121 ,  H01L21/316 ,  H01L23/296 ,  H01L2924/0002 ,  C04B41/4554 ,  H01L2924/00

摘要： Disclosed are coating compositions which include a preceramic silicon-containing material dissolved in short chain linear siloxanes. These compositions surprisingly have a long shelf life and are useful for forming coatings which are thick and of good quality.

摘要翻译： 公开了包含溶解在短链线性硅氧烷中的预陶瓷含硅材料的涂料组合物。 这些组合物令人惊讶地具有长的保存期限，并且可用于形成厚且质量好的涂层。

公开(公告)号：EP0579456B1

公开(公告)日：1997-06-18

申请号：EP93305375.3

申请日：1993-07-08

申请人： DOW CORNING CORPORATION

发明人： Ballance, David Stephen ,  Eckstein, Marie Norton ,  Loboda, Mark John ,  Michael, Keith Winton ,  Shelton, Liberty Belle

IPC分类号： H01L21/48 ,  H01L23/29

CPC分类号： H01L21/481 ,  C04B41/4554 ,  C04B41/5035 ,  C04B2111/00844 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/02337 ,  H01L21/316 ,  H01L23/296 ,  H01L2924/0002 ,  C04B41/4519 ,  C04B41/5027 ,  H01L2924/00

公开(公告)号：EP0677871A2

公开(公告)日：1995-10-18

申请号：EP95302023.7

申请日：1995-03-27

申请人： DOW CORNING CORPORATION

发明人： Haluska, Loren Andrew ,  Michael, Keith Winton

IPC分类号： H01L21/314 ,  C04B35/58

CPC分类号： C23C24/08 ,  C04B35/62222 ,  C23C26/00 ,  H01L21/02145 ,  H01L21/02222 ,  H01L21/02282 ,  H01L21/316 ,  H01L23/291 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention relates to a method of forming coatings on electronic substrates and to the substrates coated thereby. The method comprises applying a coating comprising a borosilazane and a filler on a substrate and then heating the coated substrate at a temperature sufficient to convert the borosilazane to a ceramic coating.

摘要翻译： 在电子基板上形成涂层的方法，包括：（a）涂覆涂料组合物。 在电子基板上包含硼硅氮烷和填料，和（b）转化涂料组合物。 在衬底上形成硼硅酸盐。 陶瓷涂层。

公开(公告)号：EP0270263B1

公开(公告)日：1994-04-13

申请号：EP87309966.7

申请日：1987-11-11

申请人： DOW CORNING CORPORATION

发明人： Haluska, Loren Andrew ,  Michael, Keith Winton ,  Tarhay, Leo

IPC分类号： H01L21/312 ,  H01L21/314 ,  H01L21/316 ,  H01L21/318

CPC分类号： H01L23/3171 ,  H01L21/56 ,  H01L23/291 ,  H01L23/296 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/00

公开(公告)号：EP0590780A1

公开(公告)日：1994-04-06

申请号：EP93306587.2

申请日：1993-08-19

申请人： DOW CORNING CORPORATION

发明人： Camilletti, Robert Charles ,  Chandra, Grish ,  Loboda, Mark Jon ,  Michael, Keith Winton ,  Sierawski, David Alan

IPC分类号： H01L21/316 ,  C04B41/50 ,  H01L23/31 ,  C04B41/45 ,  H01L21/56 ,  H01L23/29 ,  H01L23/485

CPC分类号： H01L24/05 ,  H01L23/291 ,  H01L23/296 ,  H01L24/03 ,  H01L2224/02166 ,  H01L2224/05082 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05684 ,  H01L2224/85375 ,  H01L2224/85815 ,  H01L2224/8585 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/05042 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： This invention relates to integrated circuits which are protected from the environment. Such circuits are hermetically sealed by applying a non-corroding, conductive layer to the bond pads and additional ceramic layers to the primary passivation.

摘要翻译： 本发明涉及受环境保护的集成电路。 这样的电路通过将不腐蚀的导电层施加到接合焊盘并将附加的陶瓷层施加到初级钝化而被密封。

公开(公告)号：EP0323186B1

公开(公告)日：1994-03-16

申请号：EP88312293.9

申请日：1988-12-23

申请人： DOW CORNING CORPORATION

发明人： Haluska, Loren Andrew ,  Michael, Keith Winton ,  Tarhay, Leo

IPC分类号： H01L21/314 ,  H01L21/56 ,  C04B41/52

CPC分类号： H01L21/3144 ,  H01L21/314 ,  H01L21/56 ,  H01L2924/0002 ,  Y10T428/31678 ,  H01L2924/00

公开(公告)号：EP0510872A1

公开(公告)日：1992-10-28

申请号：EP92303413.6

申请日：1992-04-15

申请人： DOW CORNING CORPORATION

发明人： Haluska, Loren Andrew ,  Michael, Keith Winton

IPC分类号： G03F7/075

CPC分类号： G03F7/0757

摘要： The present invention relates to a method of forming patterned coatings on substrates, especially electronic devices, by negative resist techniques. The method comprises applying a preceramic coating comprising hydrogen silsesquioxane resin and an initiator onto the substrate and then radiating a selected region of the coating for a time sufficient to cure the resin. The uncured coating is then rinsed away leaving the patterned coating.

摘要翻译： 本发明涉及通过负型抗蚀剂技术在衬底上，特别是电子器件上形成图案化涂层的方法。 该方法包括将包含氢倍半硅氧烷树脂和引发剂的预陶瓷涂层施加到基底上，然后将涂层的选定区域辐射足以固化树脂的时间。 然后将未固化的涂层冲洗掉，留下图案化的涂层。

公开(公告)号：EP0270229B1

公开(公告)日：1992-07-15

申请号：EP87309356.1

申请日：1987-10-22

申请人： DOW CORNING CORPORATION

发明人： Haluska, Loren Andrew ,  Michael, Keith Winton ,  Tarhay, Leo

IPC分类号： C04B41/50 ,  C04B41/52 ,  C04B35/14

CPC分类号： H01L23/296 ,  C04B41/5035 ,  C04B41/5066 ,  C04B41/52 ,  C23C18/1208 ,  C23C18/122 ,  C23C18/1225 ,  C23C18/1275 ,  C23C18/1295 ,  H01L21/02134 ,  H01L21/0217 ,  H01L21/022 ,  H01L21/02222 ,  H01L21/02282 ,  H01L21/02337 ,  H01L21/3124 ,  H01L21/316 ,  H01L21/31612 ,  H01L21/56 ,  H01L23/291 ,  H01L2924/0002 ,  H01L2924/00