公开(公告)号：EP1638384A1

公开(公告)日：2006-03-22

申请号：EP05445068.9

申请日：2005-09-12

Applicant: Danaher Motion Stockholm AB

Inventor： Nilson, thord Agne Gustaf ,  Ro, Ola ,  Karlsson, Ulf Bengt Ingemar ,  Förborgen, Carl Erik Mikael ,  Berglund, Jan Anders ,  Röcklinger, Erik Hakan

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K1/0204 ,  H05K3/0061 ,  H05K7/209 ,  H05K2201/10166 ,  H05K2201/10416

Abstract: A circuit arrangement comprises a circuit board (10), a semi-conductor (12) provided on a first side of the circuit board, and a heat sink (15) provided on a second side of the circuit board opposite to the first side and in heat transferring contact with the power semi-conductor. A heat conductive element (13) is provided in a hole (10a) in the circuit board, wherein the heat conductive element is positioned in heat transferring contact with both the semi-conductor and the heat sink for transfer of heat generated by the semi-conductor to the heat sink. A circuit arrangement is provided, wherein the provision of a low thermal resistance path through the circuit board by means of heat conductive elements provides a compact circuit arrangement well suited for assembly by means of an automated surface mounting process.

Abstract translation: 电路装置包括电路板（10），设置在电路板的第一侧上的半导体（12）和设置在电路板的与第一侧相对的第二侧上的散热片（15），以及 与电力半导体传热接触。 导电元件（13）设置在电路板的孔（10a）中，其中导热元件与半导体和散热片传热接触，用于传递由半导体元件产生的热量， 导体到散热器。 提供了一种电路装置，其中通过导热元件提供通过电路板的低热阻路径提供了非常适合于通过自动表面安装工艺组装的紧凑的电路布置。