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公开(公告)号：EP1391394A1
公开(公告)日：2004-02-25
申请号：EP02728158.3
申请日：2002-05-27
发明人： FUJIMURA, Tetsuo , MIYAKAWA, Takeshi , SHIMIZU, Mikio , YOKOYAMA, Satoshi , HIGANO, Masanori , ISHII, Masanori , KOSUGI, Kazuhiro , TOMIZAWA, Takashi
CPC分类号： B32B1/08 , B32B1/06 , B32B3/12 , B32B7/06 , B32B27/08 , B32B2270/00 , B32B2307/21 , B32B2439/00 , B65D75/327 , B65D77/2032 , B65D85/38 , B65D2213/02 , H01L2221/68313 , H05K13/0084
摘要： In order to prevent impairment due to static electricity in a container for an electronic component, generation of static electricity itself has to be inhibited. The peeling static electrification amount of a cover tape should be from -9 to +9 nC when the cover tape has a surface resistivity of at least 10 11 Ω, or it should be from -3 to +3 nC when the cover tape has a surface resistivity of less than 10 11 Ω. In a carrier tape body, a side of a cover tape which faces an electronic component should have a composition containing a resin on the positive polarity side and a resin on the negative polarity side relative to a side of the electronic component which faces the cover tape in the series of frictional electrification. For the surface of a container to be in contact with an electronic component, a material which is less likely to generate static electricity should be employed. A material close to a molding compound for en electronic component in the series of frictional electrification may be employed for the surface of a packaging container to be in contact with an electronic component. Otherwise, a positive polarity side one and a negative polarity side one in the series of frictional electrification may be used together.
摘要翻译： 为了防止用于电子部件的容器中的静电造成的损害，必须抑制静电的产生。 当胶带的表面电阻率至少为10 11欧姆时，覆带的剥离静电量应为-9至+9nC，或者当盖带 表面电阻率小于10 11欧米茄。 在载带体中，面向电子部件的覆盖带的一侧应该具有在正极侧包含树脂的组合和相对于面向盖带的电子部件侧的负极侧的树脂 在一系列摩擦带电。 为了使容器的表面与电子部件接触，应采用不太可能产生静电的材料。 在一系列摩擦带电中，靠近用于电子部件的模塑料的材料可以用于与电子部件接触的包装容器的表面。 否则，可以一起使用一系列摩擦带电中的正极侧和负极侧。
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公开(公告)号：EP2719636A1
公开(公告)日：2014-04-16
申请号：EP12796948.3
申请日：2012-05-29
CPC分类号： B65D43/02 , B32B7/06 , B32B27/08 , B32B27/20 , B32B27/302 , B32B27/327 , B32B27/34 , B32B2250/24 , B32B2264/102 , B32B2307/202 , B32B2307/31 , B32B2307/518 , B32B2307/5825 , B32B2307/748 , B32B2435/00 , B32B2435/02 , B32B2439/40 , B32B2553/00 , H05K13/0084 , Y10T428/1405 , Y10T428/1452 , Y10T428/2826
摘要： Disclosed is a cover film and an electronic component package that uses the cover film as a lid material for a thermoplastic resin carrier tape, the cover film having at least a substrate layer (A), an intermediate layer (B), and a heat sealing layer (C) having a thermoplastic resin which can be heat-sealed to a carrier tape, the intermediate layer (B) including a metallocene straight-chain low density polyethylene, the metallocene straight-chain low density polyethylene having a TMA softening temperature of 90 to 109 °C according to JIS K7196, and the cover film in some instances having a release layer (D) between the intermediate layer (B) and the heat sealing layer (C).
摘要翻译： 本发明公开了一种覆盖膜和电子部件封装，其使用该覆盖膜作为热塑性树脂载带的盖材，该覆盖膜至少具有基板层（A），中间层（B）和热封 （B）包含茂金属直链低密度聚乙烯，所述茂金属直链低密度聚乙烯具有90的TMA软化温度，所述热塑性树脂可热封到载带上，所述中间层（B） 根据JIS K7196为109℃，覆盖膜有时在中间层（B）与热封层（C）之间具有脱模层（D）。
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公开(公告)号：EP2628690A1
公开(公告)日：2013-08-21
申请号：EP11832315.3
申请日：2011-04-18
CPC分类号： B65D43/02 , B32B7/02 , B32B7/06 , B32B7/12 , B32B27/08 , B32B27/20 , B32B27/302 , B32B27/308 , B32B27/32 , B32B27/327 , B32B27/34 , B32B27/36 , B32B2250/24 , B32B2255/10 , B32B2255/26 , B32B2255/28 , B32B2307/202 , B32B2307/21 , B32B2307/31 , B32B2307/518 , B32B2307/54 , B32B2307/748 , B32B2457/00 , B32B2457/08 , B32B2553/00 , Y10T428/2826
摘要： Disclosed is a cover film which is used in combination with a carrier tape and comprises at least a base layer (A), an intermediate layer (B), a releasing layer (C) and a heat seal layer (D) that is capable of being heat sealed to the carrier tape. The intermediate layer (B) contains, as a main component, a linear low density polyethylene that is polymerized using a metallocene catalyst and has a tensile modulus of 200 MPa or less. The releasing layer (C) contains a conductive material and also contains, as a main component, a hydrogenated resin of an aromatic vinyl-conjugated diene copolymer having an aromatic vinyl group content of 15-35% by mass. This cover film is small in variation in peel strength when the cover film is released, and is thus capable of suppressing troubles during the releasing in a mounting process.
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