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公开(公告)号：EP2719636A1
公开(公告)日：2014-04-16
申请号：EP12796948.3
申请日：2012-05-29
CPC分类号： B65D43/02 , B32B7/06 , B32B27/08 , B32B27/20 , B32B27/302 , B32B27/327 , B32B27/34 , B32B2250/24 , B32B2264/102 , B32B2307/202 , B32B2307/31 , B32B2307/518 , B32B2307/5825 , B32B2307/748 , B32B2435/00 , B32B2435/02 , B32B2439/40 , B32B2553/00 , H05K13/0084 , Y10T428/1405 , Y10T428/1452 , Y10T428/2826
摘要： Disclosed is a cover film and an electronic component package that uses the cover film as a lid material for a thermoplastic resin carrier tape, the cover film having at least a substrate layer (A), an intermediate layer (B), and a heat sealing layer (C) having a thermoplastic resin which can be heat-sealed to a carrier tape, the intermediate layer (B) including a metallocene straight-chain low density polyethylene, the metallocene straight-chain low density polyethylene having a TMA softening temperature of 90 to 109 °C according to JIS K7196, and the cover film in some instances having a release layer (D) between the intermediate layer (B) and the heat sealing layer (C).
摘要翻译： 本发明公开了一种覆盖膜和电子部件封装，其使用该覆盖膜作为热塑性树脂载带的盖材，该覆盖膜至少具有基板层（A），中间层（B）和热封 （B）包含茂金属直链低密度聚乙烯，所述茂金属直链低密度聚乙烯具有90的TMA软化温度，所述热塑性树脂可热封到载带上，所述中间层（B） 根据JIS K7196为109℃，覆盖膜有时在中间层（B）与热封层（C）之间具有脱模层（D）。
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公开(公告)号：EP2628690A1
公开(公告)日：2013-08-21
申请号：EP11832315.3
申请日：2011-04-18
CPC分类号： B65D43/02 , B32B7/02 , B32B7/06 , B32B7/12 , B32B27/08 , B32B27/20 , B32B27/302 , B32B27/308 , B32B27/32 , B32B27/327 , B32B27/34 , B32B27/36 , B32B2250/24 , B32B2255/10 , B32B2255/26 , B32B2255/28 , B32B2307/202 , B32B2307/21 , B32B2307/31 , B32B2307/518 , B32B2307/54 , B32B2307/748 , B32B2457/00 , B32B2457/08 , B32B2553/00 , Y10T428/2826
摘要： Disclosed is a cover film which is used in combination with a carrier tape and comprises at least a base layer (A), an intermediate layer (B), a releasing layer (C) and a heat seal layer (D) that is capable of being heat sealed to the carrier tape. The intermediate layer (B) contains, as a main component, a linear low density polyethylene that is polymerized using a metallocene catalyst and has a tensile modulus of 200 MPa or less. The releasing layer (C) contains a conductive material and also contains, as a main component, a hydrogenated resin of an aromatic vinyl-conjugated diene copolymer having an aromatic vinyl group content of 15-35% by mass. This cover film is small in variation in peel strength when the cover film is released, and is thus capable of suppressing troubles during the releasing in a mounting process.
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