GLOW DISCHARGE-GENERATED CHEMICAL VAPOR DEPOSITION
    3.
    发明公开
    GLOW DISCHARGE-GENERATED CHEMICAL VAPOR DEPOSITION 审中-公开
    辉光放电产生的化学气相沉积

    公开(公告)号:EP1663518A2

    公开(公告)日:2006-06-07

    申请号:EP04816852.0

    申请日:2004-09-07

    IPC分类号: B05D7/24 C23C16/505 C23C16/40

    摘要: A process for creating plasma polymerized deposition on a substrate using a glow discharge is described. The glow discharge is created between an electrode (16) and a counterelectrode (24). A mixture of a balance gas and a tetraalkylorthosilicate is flowed through the glow discharge onto a substrate (28) to deposit a coating onto the substrate as an optically clear coating or to create surface modification. The process, which is preferably carried out at or near atmospheric pressure, can be designed to create an optically clear powder-free or virtually powder free coating.

    摘要翻译: 描述了使用辉光放电在衬底上产生等离子体聚合沉积的方法。 在电极(16)和反电极(24)之间产生辉光放电。 平衡气体和原硅酸四烷基酯的混合物通过辉光放电流到衬底(28)上以将涂层沉积到衬底上作为光学透明涂层或产生表面改性。 优选在大气压下或接近大气压下进行的方法可以设计成产生光学透明的无粉末或基本上无粉末的涂层。

    MULTILAYER COATINGS BY PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION
    5.
    发明公开
    MULTILAYER COATINGS BY PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION 审中-公开
    多层涂层通过等离子体增强化学气相沉积

    公开(公告)号:EP1807545A1

    公开(公告)日:2007-07-18

    申请号:EP05809910.2

    申请日:2005-09-02

    摘要: The present invention provides a process for preparing a multiple layer coating on the surface of an organic polymeric substrate by means of atmospheric pressure plasma deposition, the steps of the process comprising depositing a layer (first layer) of a plasma polymerized, optically clear, highly adherent, organosilicon compound onto the surface of the organic polymeric substrate by atmospheric pressure plasma deposition of a gaseous mixture comprising an organosilicon reagent compound and optionally an oxidant in a first step and thereafter in a second step depositing a substantially uniform layer (second layer) of a silicon oxide compound onto the exposed surface of said first layer by atmospheric pressure plasma deposition of a gaseous mixture comprising an oxidant and an organosilicon reagent compound, wherein the molar ratio of oxidant to organosilicon reagent compound in the gaseous mixture is greater in the second step than in the first step.