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1.发明公开
公开(公告)号：EP2200838A1
公开(公告)日：2010-06-30
申请号：EP08842620.0
申请日：2008-10-23
发明人： GAO, Feng , JOHNSON, Lynda, Kaye , KEUSSEYAN, Roupen, Leon , KEYS, Dalen, E. , MALAJOVICH, Irina , SCHIFFINO, Rinaldo, Soria , ZUMSTEG, Fredrick, Claus, JR.
CPC分类号： B41M5/38207 , B41M5/38214 , B41M5/392 , H05K3/046 , H05K3/182 , H05K3/207 , H05K9/0094 , H05K2201/0209 , H05K2203/0528 , H05K2203/107 , Y10T428/24802
摘要： Disclosed is a method for making a metal pattern with high conductivity comprising providing a patterned substrate comprising a patterned catalyst layer on a base substrate by a thermal imaging method followed by plating to provide the metal pattern. The metal patterns provided are suitable for electrical devices including electromagnetic interference shielding devices and touchpad sensors.
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2.发明授权NEGATIVE IMAGING METHOD FOR PROVIDING A PATTERNED METAL LAYER HAVING HIGH CONDUCTIVITY 有权负面形象方法提供结构化金属层具有高导电性
公开(公告)号：EP2201827B1
公开(公告)日：2014-04-23
申请号：EP08842070.8
申请日：2008-10-23
发明人： GAO, Feng , JOHNSON, Lynda, Kaye , KEUSSEYAN, Roupen, Leon , MALAJOVICH, Irina , METH, Jeffrey, Scott , SHARP, Kenneth, George , ZUMSTEG JR, Fredrick, Claus , AGRAWAL, Seema
CPC分类号： B41M5/38207 , B41M5/392 , H05K3/046 , H05K3/182 , H05K3/185 , H05K2203/0528 , H05K2203/107 , H05K2203/1105
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3.发明公开
公开(公告)号：EP2041814A2
公开(公告)日：2009-04-01
申请号：EP07872556.1
申请日：2007-07-16
发明人： ANDREWS, Gerald, Donald , BAILEY, Richard, Kevin , BLANCHET, Graciela, Beatriz , CASPAR, Jonathan, V. , CATRON, John, W. , CHESTERFIELD, Reid, John , FELDER, Thomas, C. , GAO, Feng , GLICKSMAN, Howard, David , GOLDFINGER, Marc, B. , HARMER, Mark, Andrew , JAYCOX, Gary, Delmar , JOHNSON, Lynda, Kaye , KEUSSEYAN, Roupen, Leon , KEYS, Dalen, E. , MALAJOVICH, Irina , MARSHALL, William, J. , MCCORD, Elizabeth, Forrester , MCEWEN, Charles, Nehemiah , METH, Jeffrey, Scott , NUNES, Geoffrey , SCHIFFINO, Rinaldo, S. , SHANNON, Paul, J. , SHARP, Kenneth, George , TASSI, Nancy, G. , VISSCHER, Karyn, B.
IPC分类号： H01L51/00
CPC分类号： H01L51/0013 , H01L51/0545 , H05K1/097 , H05K3/046 , H05K2203/0528 , H05K2203/107 , Y10T428/24901
摘要： The invention discloses processes for thermal transfer patterning of a nanoparticle layer and a corresponding proximate portion of a carrier layer, and optionally additional transfer layers, together onto a thermal imaging receiver. The invention is useful for dry fabrication of electronic devices. Additional embodiments of the invention include multilayer thermal imaging donors comprising in layered sequence: a base film, a carrier layer and a nanoparticle layer. The carrier layer can be a dielectric or conducting layer. When the carrier layer is a dielectric layer, the base film includes a light attenuating agent in the form of a dye or pigment.
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公开(公告)号：EP1295518B1
公开(公告)日：2008-07-02
申请号：EP01953385.0
申请日：2001-06-26
CPC分类号： H05K3/046 , G03F7/00 , G03F7/36 , H05K3/207 , H05K2203/0525 , H05K2203/0528
摘要： A process for patterning thick film electrically functional patterns using a photosensitive polymer layer. A tacky photosensitive layer (104) is applied onto a substrate surface. The photosensitive layer (104) is imaged with a pattern (106) using actinic radiation, the exposed areas (107) of the photosensitive layer become hardened and non-tacky. A subsequent application of a thick film composition sheet (101 on 102) will cause the thick film (101) to adhere to the remaining tacky areas (104). Upon peeling the sheet (102), a thick film print pattern (101) will be produced. This step is followed by a processing profile prescribed by the thick film composition used which results in a pattern having electrically functional properties. The invention also extends to a process wherein a thick film composition is recovered from a used sheet.
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公开(公告)号：EP2200838B1
公开(公告)日：2011-10-19
申请号：EP08842620.0
申请日：2008-10-23
发明人： GAO, Feng , JOHNSON, Lynda, Kaye , KEUSSEYAN, Roupen, Leon , KEYS, Dalen, E. , MALAJOVICH, Irina , SCHIFFINO, Rinaldo, Soria , ZUMSTEG, Fredrick, Claus, JR.
CPC分类号： B41M5/38207 , B41M5/38214 , B41M5/392 , H05K3/046 , H05K3/182 , H05K3/207 , H05K9/0094 , H05K2201/0209 , H05K2203/0528 , H05K2203/107 , Y10T428/24802
摘要： Disclosed is a method for making a metal pattern with high conductivity comprising providing a patterned substrate comprising a patterned catalyst layer on a base substrate by a thermal imaging method followed by plating to provide the metal pattern. The metal patterns provided are suitable for electrical devices including electromagnetic interference shielding devices and touchpad sensors.
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6.发明公开NEGATIVE IMAGING METHOD FOR PROVIDING A PATTERNED METAL LAYER HAVING HIGH CONDUCTIVITY 有权负面形象方法提供结构化金属层具有高导电性
公开(公告)号：EP2201827A1
公开(公告)日：2010-06-30
申请号：EP08842070.8
申请日：2008-10-23
发明人： GAO, Feng , JOHNSON, Lynda, Kaye , KEUSSEYAN, Roupen, Leon , MALAJOVICH, Irina , METH, Jeffrey, Scott , SHARP, Kenneth, George , ZUMSTEG JR, Fredrick, Claus , AGRAWAL, Seema
CPC分类号： B41M5/38207 , B41M5/392 , H05K3/046 , H05K3/182 , H05K3/185 , H05K2203/0528 , H05K2203/107 , H05K2203/1105
摘要： Disclosed is a method negative imaging method for making a metal pattern with high conductivity comprising providing a patterned substrate comprising a patterned catalyst layer on a base substrate by a thermal imaging method followed by plating to provide the metal pattern. The metal patterns provided are suitable for electrical devices including electromagnetic interference shielding devices and touchpad sensors.
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公开(公告)号：EP1295518A2
公开(公告)日：2003-03-26
申请号：EP01953385.0
申请日：2001-06-26
CPC分类号： H05K3/046 , G03F7/00 , G03F7/36 , H05K3/207 , H05K2203/0525 , H05K2203/0528
摘要： A process for patterning thick film electrically functional patterns using a photosensitive polymer layer. A tacky photosensitive layer (104) is applied onto a substrate surface. The photosensitive layer (104) is imaged with a pattern (106) using actinic radiation, the exposed areas (107) of the photosensitive layer become hardened and non-tacky. A subsequent application of a thick film composition sheet (101 on 102) will cause the thick film (101) to adhere to the remaining tacky areas (104). Upon peeling the sheet (102), a thick film print pattern (101) will be produced. This step is followed by a processing profile prescribed by the thick film composition used which results in a pattern having electrically functional properties. The invention also extends to a process wherein a thick film composition is recovered from a used sheet.
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